Abstract: The present invention relates to a method for dissolving metals by photocatalysis. A metal-containing material to be dissolved is dispersed in a mixed solution of photocatalyst-containing cyanide and organic chloride; then, a photocatalyst is added; next, an oxygen-containing gas or a substance which is capable of generating oxygen is introduced; and irradiation is applied for a period of time to dissolve metals. Compared with the prior method, the present invention is advantageous in moderate reaction condition, energy conservation, environmental protection, low cost, and convenient operation, and is suitable for mass industrial treatment on metal dissolution.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. A gate structure is disposed along a front-side of the substrate. A back-side of the substrate includes one or more first angled surfaces defining a central diffuser disposed over the image sensing element. The back-side of the substrate further includes second angled surfaces defining a plurality of peripheral diffusers laterally surrounding the central diffuser. The plurality of peripheral diffusers are a smaller size than the central diffuser.

Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers over the semiconductor substrate and connected to the source/drain feature, a gate portion between vertically adjacent channel layers, and an inner spacer between the source/drain feature and the gate portion and between adjacent channel layers. The semiconductor device further includes an air gap between the inner spacer and the source/drain feature.

Abstract: A rotary seat including a base includes an outer surface, and a composite material layer attached to at least a part of the outer surface. The base also includes a recess for accommodating a turntable and including a first opening on the outer surface. The material of the composite material layer includes fibers and a resin. Therefore, the rotary seat may be more lightweight. A rotary table is also provided and includes the rotary seat, a driving device which drives the rotary seat to rotate, and a turntable which is rotatably disposed in the recess of the base.

Abstract: A semiconductor device and method for forming the semiconductor device are provided. In some embodiments, a semiconductor substrate comprises a device region. An isolation structure extends laterally in a closed path to demarcate the device region. A first source/drain region and a second source/drain region are in the device region and laterally spaced. A sidewall of the first source/drain region directly contacts the isolation structure at a first isolation structure sidewall, and remaining sidewalls of the first source/drain region are spaced from the isolation structure. A selectively-conductive channel is in the device region, and extends laterally from the first source/drain region to the second source/drain region. A plate comprises a central portion and a first peripheral portion. The central portion overlies the selectively-conductive channel, and the first peripheral portion protrudes from the central portion towards the first isolation structure sidewall.

Abstract: The present invention discloses a Fe—Al-based metal porous membrane and a preparation method thereof, which relate to the technical field of industrial gas-solid and liquid-solid separation and purification, and mainly address problems in the prior art, such as cracking-prone and peeling of a membrane layer of an existing Fe—Al-based metal porous membrane during its preparation and use. The preparation method of the present invention comprises the steps of: adding a Fe—Al-based metal powder and a metal fiber powder into an organic-additive-added water-based solvent, and mixing them into a slurry; casting the slurry, through a casting machine, to form a membrane green body on a metal substrate layer, and letting it dry; and placing the dried membrane green body in a sintering furnace, to remove organic substances and perform high-temperature sintering and predetermined-temperature reaction synthesis.

Abstract: The present invention provides a compact ceramic chip antenna array based on ultra-wide band three-dimensional direction finding, comprising a dielectric substrate, a metal floor and a coplanar waveguide feeder, wherein the front face of the dielectric substrate is provided with three antenna units; three coplanar waveguide feeders are electrically connected to three antenna units, respectively; a plurality of impedance matching structures are further arranged on a front side and a back side of the dielectric substrate, respectively; the first and second impedance matching structures are respectively arranged on a right side of the first antenna unit and a left side of the third antenna unit; the first and second impedance matching structures are rectangular grooves etched on the metal floor; the third, fourth, fifth and sixth impedance matching structures are respectively arranged at both ends of the second coplanar waveguide feeder; and the fifth and sixth impedance matching structures are rectangular metal

Abstract: The present application provides a displaying base plate and a displaying device, which relates to the technical field of displaying. The displaying device can ameliorate the problem of screen greening caused by electrostatic charges, thereby improving the effect of displaying. The displaying base plate includes an active area and a non-active area connected to the active area, the non-active area includes an edge region and a first-dam region, and the first-dam region is located between the active area and the edge region; the displaying base plate further includes: a substrate; an anti-static layer disposed on the substrate, wherein the anti-static layer is located at least within the edge region; and a driving unit and a touch unit that are disposed on the substrate, wherein the driving unit is located within the active area.

Abstract: A system includes an acoustic lure and a sensor package disposed within an interior volume of an insect trapping container and a computing device in communication with the acoustic lure and the sensor package configured to instruct the acoustic lure to output an acoustic tone. The computer device is further configured to receive sensor data from the sensor package, the sensor data representative of insects within the interior volume. Responsive to receiving the sensor data, the computing device is configured to instruct an imaging device to capture image data representative of the insects within the interior volume or determine insect count data based on the sensor data. The computing device is configured to then transmit output data to a remote computing system, the output data including at least one of a first portion of the image data or a second portion of the insect count data.

Abstract: Provided is a semiconductor structure and a formation method therefor. The semiconductor structure includes: a gate structure located on a substrate. The gate structure includes at least two gate conductive layers; the at least two gate conductive layers have the same components and different characteristic parameters; and the characteristic parameter includes at least one of thickness, component content or shape.

Abstract: Disclosed herein are humanized antibodies, antigen-binding fragments thereof, and antibody conjugates, that are capable of specifically binding to certain biantennary Lewis antigens, which antigens are expressed in a variety of cancers. The presently disclosed antibodies are useful to target antigen-expressing cells for treatment or detection of disease, including various cancers. Also provided are polynucleotides, vectors, and host cells for producing the disclosed antibodies and antigen-binding fragments thereof. Pharmaceutical compositions, methods of treatment and detection, and uses of the antibodies, antigen-binding fragments, antibody conjugates, and compositions are also provided.

Abstract: Provided are a method for generating a fishing track, a mobile terminal, and a storage medium. The method includes the steps described below. A first position of a user and a second position of at least one fishing area are acquired. A target fishing area in which the user is located is determined from the at least one fishing area according to the first position and the second position. A fishing track is generated according to the first position and a third position of the target fishing area.

Abstract: The present disclosure provides a radiation inspection device, which has a transportation state and a working state, and includes a container with an adjustable width, and the width of the container in the transportation state is smaller than that in the working state; a radiation inspection apparatus arranged in the container and including a radiation source and a detector, and in the transportation state, the length of the radiation inspection apparatus is arranged along the length direction of the container, and in the working state, the length of the radiation inspection apparatus is arranged along the width direction of the container to perform radiation scanning inspection on vehicles passing through the container along the length direction; a rotating apparatus arranged in the container and configured to rotate the radiation inspection apparatus when the radiation inspection device is switched between the transportation state and the working state.

Abstract: A method for sharing a console variable setting of an application and the electronic device and system is provided. The sharing method includes: capturing a display frame of a first electronic device to obtain a set coding image by a second electronic device; transforming the set coding image into a meta file by the second electronic device, wherein the meta file comprises a set of setting parameters for a plurality of first setting options of a first application of the first electronic device; and setting a plurality of second setting options of a second application of the second electronic device as the set of setting parameters for the plurality of first setting options according to the meta file, wherein the second application is the same as the first application.

Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.

Abstract: An integrated optical component coupled to a circuit board of an aerosol sensor is provided. The integrated optical component comprising a medium including a first, second plane, third plane, wherein the first plane is adjacent to a detection area, the second plane is positioned about a photosensor, and the third plane is opposite an angle formed by an intersection of the first and second plane. The integrated optical component further comprising a first lens configured on the first sidewall, the first lens configured to receive incident light from the detection area and focus the incident light onto a reflector through the medium, the reflector configured on the third sidewall, the reflector configured to reflect the incident light towards a second lens, and the second lens configured on the second sidewall, the second lens configured to receive the incident light from the reflector and focus the incident light to the photosensor.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: This application provides a winding and unwinding device and a battery production system. The winding and unwinding device includes a turret, a driver, and a magnetic powder clutch. The turret includes a rotation shaft and at least one winding shaft, the rotation shaft being parallel to the winding shaft. A drive shaft of the magnetic powder clutch is connected to the driver and a driven shaft of the magnetic powder clutch is connected to the rotation shaft of the turret, such that the driver drives the rotation shaft of the turret to rotate. In this application, with the magnetic powder clutch disposed between the turret and the driver, after the turret rotates to a predetermined position, the rotation of the turret can be stopped without the need to cut off the power supply, ensuring the normal operation of the driver when the turret stops rotation, thus avoiding damage to the driver.

Abstract: A wafer metrology system having a continuous dynamic sampling scheme configured to optimize a sampling rate for AVI of process wafers in an IC fabrication flow based on acceptable quality levels. For a stable process, the process wafers may be sampled at a lower rate without negatively affecting quality control.

Abstract: A scanning method for multiple barcodes is applied in an electronic device. The electronic device loads a tag template, and the tag template has a plurality of detection zones each corresponding to a target barcode and a target barcode type. The electronic device captures a tag image with a plurality of barcode patterns to be detected, and each barcode pattern to be detected has coordinate information on an image coordinate system. The electronic device overlays the tag image with the tag template to determine whether each barcode pattern to be detected is located in one of the detection zones. When the barcode pattern to be detected is located in one of the detection zones and matches the corresponding target barcode type, the electronic device reads the barcode pattern to be detected to obtain a read result.