Abstract: A preparation method of a hemostatic material is provided, wherein the method mainly includes mixing a keratin and an alginate; obtaining a keratin-alginate composite scaffold by a freeze-gelation method; and drying the keratin-alginate composite scaffold to obtain a hemostatic material. Further, a methylene blue can be loaded into the hemostatic material so that the hemostatic material has antimicrobial photodynamic abilities.

Abstract: Systems, methods and devices are provided, which can include an engineering change order (ECO) base. A base layout cell includes metal layer regions, conductive gate patterns arranged above metal layer regions; oxide definition (OD) patterns, metal-zero layer over oxide-definition (metal-zero) patterns, at least one cut metal layer (CMD) pattern; and at least one via region. The base layout cell can be implemented in at least two non-identical functional cells. A first functional cell of the at least two non-identical functional cells includes first interconnection conductive patterns arranged connecting metal-zero structures corresponding to at least two metal-zero patterns in a first layout, and a second functional cell of the at least two non-identical functional cells includes second interconnection conductive patterns arranged connecting metal-zero structures corresponding to at least two metal-zero patterns in a second layout.

Abstract: The present disclosure relates to a fiber optic network configuration having an optical network terminal located at a subscriber location. The fiber optic network configuration also includes a drop terminal located outside the subscriber location and a wireless transceiver located outside the subscriber location. The fiber optic network further includes a cabling arrangement including a first signal line that extends from the drop terminal to the optical network terminal, a second signal line that extends from the optical network terminal to the wireless transceiver, and a power line that extends from the optical network terminal to the wireless transceiver.

Abstract: A package structure is provided. The package structure includes a semiconductor die and a thermoelectric structure disposed on the semiconductor die. The thermoelectric structure includes P-type semiconductor blocks, N-type semiconductor blocks and metal pads. The P-type semiconductor blocks and the N-type semiconductor blocks are arranged in alternation with the metal pads connecting the P-type semiconductor blocks and the N-type semiconductor blocks. When a current flowing through one of the N-type semiconductor block, one of the metal pad, and one of the P-type semiconductor block in order, the metal pad between the N-type semiconductor block and the P-type semiconductor block forms a cold junction which absorbs heat generated by the semiconductor die.

Abstract: The present disclosure relates to a fiber optic connector for use with a fiber optic adapter. The fiber optic connector includes a connector housing having an end defining a plug portion. A ferrule assembly is mounted at least partially within the connector housing. The ferrule assembly includes a ferrule located at the plug portion of the connector housing. A sealing member is mounted about an exterior of the connector housing for providing a seal between the connector housing and the adapter. The fiber optic connector further includes first and second separate retaining mechanism for retaining the fiber optic connector within the fiber optic adapter.

Abstract: A method of fabricating an integrated circuit structure includes placing a first set of conductive structure layout patterns on a first layout level, placing a second set of conductive structure layout patterns on a second layout level, placing a first set of via layout patterns between the second set of conductive structure layout patterns and the first set of conductive structure layout patterns, and manufacturing the integrated circuit structure based on at least one of the layout patterns of the integrated circuit. At least one of the layout patterns is stored on a non-transitory computer-readable medium, and at least one of the placing operations is performed by a hardware processor. The first set of conductive structure layout patterns extends in a first direction. The second set of conductive structure layout patterns extends in the second direction, and overlap the first set of conductive structure layout patterns.

Abstract: The present disclosure incudes a fiber optic cable having a conduit including a conduit wall defining a conduit passage that extends longitudinally through the conduit. The conduit also includes an adhesive injection port defined through the conduit wall and at least one optical fiber within the conduit passage. The cable further includes a fiber lock including an adhesive volume in communication with the adhesive injection port. The adhesive volume includes a main adhesive volume positioned within the conduit passage and bonded to the optical fiber. The main adhesive volume is fixed to prevent longitudinal movement relative to the conduit.

Abstract: A method of manufacturing a semiconductor device includes forming a transistor layer with an M*1st layer that overlays the transistor layer with one or more first conductors that extend in a first direction. Forming an M*2nd layer that overlays the M*1st layer with one or more second conductors which extend in a second direction. Forming a first pin in the M*2nd layer representing an output pin of a cell region. Forming a long axis of the first pin substantially along a selected one of the one or more second conductors. Forming a majority of the total number of pins in the M*1st layer, the forming including: forming second, third, fourth and fifth pins in the M*1st layer representing corresponding input pins of the circuit; and forming long axes of the second to fifth pins substantially along corresponding ones of the one or more first conductors.

Abstract: Processing operations allow optical fibers to be efficiently installed in ferrules. An optical fiber holding device includes a clip having a length that extends between a first end and a second end. The clip includes a base and a cover that each extend between the first end and second ends. The clip includes a fiber passage that located between the cover and the base that extends between the first and second ends. The clip defines a ferrule boot receptacle at the first end.

Abstract: A semiconductor device includes a substrate, a first cell having a first functionality, and a second cell having a second functionality. The first cell includes a first portion on a first side of the substrate, wherein the first portion includes a first conductive element; a second portion on a second side of the substrate, wherein the second portion includes a second conductive element; and a first conductive via extending through the substrate and electrically connecting the first conductive element to the second conductive element. The second cell includes a third portion on the first side of the substrate, wherein the third portion includes a third conductive element; a fourth portion on the second side of the substrate, wherein the fourth portion includes a fourth conductive element; and a second conductive via extending through the substrate and electrically connecting the third conductive element to the fourth conductive element.

Abstract: A method of fabricating an integrated circuit. The method includes generating two first-type active zones and two second-type active zones, and generating a gate-strip intersecting the two first-type active zones and the two second-type active zones. The method further includes patterning one or more poly cuts intersecting the gate-strip based on a determination of a difference between the poly extension effect of a p-type transistor and the poly extension effect of an n-type transistor.

Abstract: An exercise assisting device and exercise assisting method are provided. The device performs the following operations: transmitting a first control signal, the first control signal is related to a motion demonstration video corresponding to an exercise course data; receiving a video stream of a user; analyzing the video stream to generate a motion recognition result corresponding to the exercise course data of the user, and determining whether a motion target value is achieved according to the motion recognition result and the exercise course data; and when the motion target value is not achieved, the motion recognition result and the motion target value are input into an expert suggestion model to generate a follow-up motion suggestion and to determine a follow-up motion demonstration video corresponding to the follow-up motion suggestion.

Abstract: A pedal with anti-collision detection is installed on the rear of a vehicle. The pedal includes a pedal body and a radar device, with an insertion portion extending from the rear lateral side of the pedal body. Arc ribs are arranged from a rear lateral side of the pedal body toward a front lateral side of the pedal body at intervals, and straight ribs extend from the rear lateral side toward the front lateral side in a radial arrangement. The arc ribs and the straight ribs are interlaced, forming reinforcement spaces therebetween. An installation space is formed on an inner side of the front lateral side toward the rear lateral side for receiving the radar device. Each reinforcement space contains a reinforcement structure, thereby strengthening the structural strength of the pedal for protecting the radar device.

Abstract: Intermediate compounds are disclosed for making incretin analogs, or pharmaceutically acceptable salts thereof. In addition, methods are disclosed for making incretin analogs by coupling from two to four of the intermediate compounds herein via hybrid liquid solid phase synthesis or native chemical ligation.

Abstract: A laser soldering system using dynamic light spot and a method thereof are provided. A laser module is controlled to radiate toward multi-lens to form a light spot on a soldering target for soldering, and a lens distance between the multi-lens is adjusted to adjust a light spot size. The disclosure may provide multiple heating densities respectively adequate to different soldering status via adjusting the light spot size when using same laser power, so as to improve the soldering quality.

Abstract: Memories, memory controllers, and computing systems and their methods of operation are disclosed. In some embodiments, a method of accessing a memory includes accessing a first bit line corresponding to a sense amplifier and accessing a second bit line corresponding to the sense amplifier. In some embodiments, a memory controller includes a second memory configured to store data of a second data type. In some embodiments, a method includes operating a memory in a second mode in response to receiving an input to change the operation of the memory from a first mode to the second mode.

Abstract: The disclosure relates to an ultra-wide passband five-order band-pass filter based on an LTCC process. The ultra-wide passband five-order band-pass filter comprises a ceramic substrate, a bottom input electrode, a bottom output electrode and a bottom grounding electrode. Five parallel resonators, a grounding polar plate, two series connection capacitors, two series connection inductors, a cross-coupling capacitor and a parallel inductor are arranged in the ceramic substrate; the two series connection capacitors comprise a first series capacitor and a second series capacitor; the two series connection inductors comprise a first series inductor and a second series inductor; and according to the filter, a five-order parallel resonance structure is adopted, out-of-band suppression is deepened through the five parallel resonance units, a cross coupling capacitor, a parallel inductor and two series connection inductors are innovatively introduced.

Abstract: A loop back connector and methods for testing lines in a fiber optic network are disclosed. The loop back connector includes a ferrule having an interface side constructed for optical connection to a multifiber optical cable. The loop back connector also includes first and second optical loop back paths, each having first and second terminal ends positioned at the interface side. The terminal ends of each loop back path are adapted to be aligned to fibers in the multifiber optical cable. The method includes injecting a signal on a first optical path at a first location, looping back the signal at a second location onto a second optical path, and receiving the signal on the second optical path at the first location.

Abstract: An integrated circuit includes a first type-one transistor, a second type-one transistor, a first type-two transistor, a second type-two transistor, a third type-one transistor, a fourth type-one transistor, and a fifth type-one transistor. The first type-one transistor has a gate configured to have a first supply voltage of a first power supply. The first type-two transistor has a gate configured to have a second supply voltage of the first power supply. The first active-region of the third type-one transistor is connected with an active-region of the first type-one transistor. The second active-region and the gate of the third type-one transistor are connected together. The first active-region of the fifth type-one transistor is connected with the gate of the third type-one transistor. The second active-region of the fifth type-one transistor is configured to have a first supply voltage of a second power supply.

Abstract: An optical fiber testing device (300) being plugged into a port at which optical signals including communication and test signals within different wavelength bands being received, comprises an optical connector (304) including a plug body surrounding a ferrule holding an optical fiber (301) and a reflector component (326) carried with the optical connector (304). The reflector component (326) is optically coupled to the rear of the optical fiber and reflects the test signal. A method for testing an optical fiber, comprises removably securing a reusable ruggedized optical fiber testing device to a ruggedized port of an optical fiber terminal to optically couple to an optical fiber under test, transmitting a test signal over the optical fiber under test, and using the reflector component to return the test signal over the optical fiber under test when receiving the test signal.