Abstract: An electrical connector for interconnecting an IC module and a circuit board comprises a base, a slide plate, a plurality of contacts, a spacing plate, a prepreg, a cover and a push plate. A plurality of passageways is formed in the base for receiving corresponding contacts. The slide plate is mounted on a top surface of the base, and a plurality of apertures is formed in the slide plate corresponding to the passageways of the base. The spacing plate is mounted to a bottom surface of the base and forms a plurality of positioning holes for receiving soldering portions of the corresponding contacts. The prepreg is disposed between the base and the spacing plate, and a plurality of spacing holes is formed in the prepreg corresponding to the passageways of the base. Since the spacing plate and the circuit board have the same thermal expansion coefficient, the positioning holes remain in alignment with corresponding solder pads formed on the circuit board during a soldering process.