Patents by Inventor Yu Peng

Yu Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10790261
    Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: September 29, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai, Hsiu-Jen Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu
  • Patent number: 10784221
    Abstract: A method includes vacuum annealing on a substrate having at least one solder bump to reduce voids at an interface of the at least one solder bump. A die is mounted over the substrate.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: September 22, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsiu-Jen Lin, Chung-Shi Liu, Ming-Da Cheng, Chung-Cheng Lin, Yu-Peng Tsai, Cheng-Ting Chen
  • Publication number: 20200243370
    Abstract: A method comprises forming a plurality of interconnect structures including a dielectric layer, a metal line and a redistribution line over a carrier, attaching a semiconductor die on a first side of the plurality of interconnect structures, forming an underfill layer between the semiconductor die and the plurality of interconnect structures, mounting a top package on the first side the plurality of interconnect structures, wherein the top package comprises a plurality of conductive bumps, forming an encapsulation layer over the first side of the plurality of interconnect structures, wherein the top package is embedded in the encapsulation layer, detaching the carrier from the plurality of interconnect structures and mounting a plurality of bumps on a second side of the plurality of interconnect structures.
    Type: Application
    Filed: April 13, 2020
    Publication date: July 30, 2020
    Inventors: Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu
  • Patent number: 10706574
    Abstract: A computer-implemented method for identifying a gap between objects in an image, the method comprising: detecting contours of the objects in the image or in a binarized version thereof; locating at least one path or gap between the objects, in the image or in an intersection region being a portion of the image containing at least respective portions of the objects by: determining representative attenuations or densities of respective one or more rows and columns of the image or of the intersection region, identifying first pixels, being pixels in a column that has a representative attenuation or density of 0, and second pixels, being pixels in a row that has a representative attenuation or density of 0, determining whether there exists a path or gap between two or more boundaries by identifying at least one first or second pixel on each of two or more of the boundaries, and detecting one or more paths between the at least two boundaries; and outputting a result indicative of one or more detected paths.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: July 7, 2020
    Assignee: STRAXCORP PTY LTD
    Inventors: Roger Zebaze, Yu Peng
  • Publication number: 20200202604
    Abstract: A method and apparatus are disclosed for generating an avatar from an image of a face using an avatar generation engine executed by a processing unit of a computing device. The avatar generation engine receives the image, identifies a face in the image, crops a face in the image to generate a cropped face image, detects facial landmarks in the cropped face image, determines an ethnicity and a gender based on the cropped face image, selects a base facial rig from a set of stored facial rigs based on one or more of ethnicity, gender, hairstyle, skin color, hair color, body hair, presence of eyeglasses, presence of a hat, and presence of lipstick, alters the base facial rig based on the facial landmarks to generate a customized facial rig, and adds facial attributes to the customized facial rig based on the facial characteristics to generate the avatar.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 25, 2020
    Inventors: Robert Rui OTANI, Xuanyu ZHONG, Tony Sin-Yu PENG
  • Publication number: 20200191414
    Abstract: An instant hot water dispenser system includes a main body, having a water flow control valve seat, a water inlet and a water outlet, the water flow control valve seat being provided with a first flow control valve and a second flow control valve; a faucet being provided with a first pull member, a second pull member and a water outlet pipe; a first heating unit having a first water storage space and a heater; a second heating unit having a circulating water path and an instantaneous heater, the instantaneous heater being configured to instantaneously heat a water supply in the circulating water path to a predetermined temperature; a processing unit electrically connected to a control interface, the processing unit being further electrically connected to the water flow control valve seat, the first heating unit and the second heating unit.
    Type: Application
    Filed: December 13, 2019
    Publication date: June 18, 2020
    Inventor: SHAO-YU PENG
  • Patent number: 10686390
    Abstract: Utilizing an asymmetric magnetic field caused by a mechanism design between a motor rotor and a stator to induce a BEMF, a method for starting a fixed rotation direction of single-phase sensorless DC brushless motor, includes: power-on starting a motor control circuit; if the motor is not in a rotating state before starting the excitation, executing a static starting procedure; then, if the motor rotation direction conforms to a predetermined direction, executing a normal driving procedure; otherwise, executing a static starting procedure. The static starting procedure, by discharging remnant energy of the motor, achieves the purpose of star-up by performing the steps of first phase excitation, stop excitation, and strong second phase excitation. In the normal driving procedure, the slope of BEMF signal of the first phase or the second phase is taken out periodically to detect the motor rotation direction.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: June 16, 2020
    Assignee: TRITAN TECHNOLOGY INC.
    Inventors: Sheng-Yu Peng, Pi-Cheng Chen, Shun-Sheng Cheng, Shao-Hua Cheng, Huang-Jen Wang
  • Publication number: 20200178738
    Abstract: A method and a wash, clean and dry system are provided for washing, cleaning and drying a surface region of a human body. The system includes a toilet seat assembly with a bidet assembly having a spray canister device for spraying the surface region with a solution, such as a skin protecting barrier solution, a cleaning solution or a medicated solution. In one aspect, the spray canister device can be movably insert into and out of the toilet seat assembly and is easy to operate and use. In addition, the bidet assembly further includes a spray nozzle assembly and a drying nozzle assembly, which are adapted to wash, clean and dry the region of the human body in three dimensional moments. The removable spray canister device with the removable sleeved cover element is thus easy to carry and be re-filled with new solutions.
    Type: Application
    Filed: December 4, 2019
    Publication date: June 11, 2020
    Inventors: Brian Schwab, Shao-Yu Peng, Brian Murray
  • Patent number: 10673726
    Abstract: A heartbeat packet timer identification method and a device, where the identification method is performed by a device that sets a timer, and the method includes determining, in a data packet transmitted by the device, each associated data packet corresponding to each timing end moment of the timer and determining, according to each associated data packet and each timing end moment of the timer, whether the timer is a heartbeat packet timer set by the device for transmitting a heartbeat packet. With reference to a data packet transmitted by a device and each associated data packet that corresponds to each timing end moment of a timer, the heartbeat packet timer identification method and the device may determine with relatively high accuracy whether the timer is a heartbeat packet timer.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: June 2, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yu Peng, Youzhen Chen, Song Yang, Yuhua Guo
  • Publication number: 20200159273
    Abstract: A reference voltage generator includes an output terminal, a current source, a reference circuit, a protection circuit, and a control circuit. The output terminal outputs a reference voltage. The current source is coupled to the output terminal, and generates a reference current. The reference circuit is coupled to the output terminal, and generates a reference voltage according to the reference current. The protection circuit is coupled to the output terminal, and adjusts a voltage of the output terminal to an operating voltage. The control circuit is coupled to the reference circuit and the protection circuit. The control circuit controls the reference circuit and the protection circuit according to a start signal.
    Type: Application
    Filed: September 1, 2019
    Publication date: May 21, 2020
    Inventors: Jen-Yu Peng, Chun-Hung Lin, Cheng-Da Huang
  • Publication number: 20200155502
    Abstract: The invention provides novel compositions and methods for the treatment of Radiation-Induced Bystander Effects (RIBE), resulting from radiation exposure. In one preferred embodiment the inventions includes novel therapeutic agents, including but not limited to quercetin and quercetin analogs, as well as E64, CA074, CA074Me, that interfere with the activity of Cathepsin B.
    Type: Application
    Filed: July 17, 2018
    Publication date: May 21, 2020
    Inventors: Ding Xue, Yu Peng, Man Zhang, Lingjun Zheng, Qian Liang, Hanzeng Li, Jau-Song Yu, Jeng-Ting Chen
  • Publication number: 20200152616
    Abstract: A manufacturing method of a package-on-package structure includes at least the following steps. A plurality of conductive bumps of a first package is attached to a tape carrier. A second package is coupled to the first package opposite to the plurality of conductive bumps. When coupling the second package, the plurality of conductive bumps are deformed to form a plurality of deformed conductive bumps, and a contact area between the tape carrier and the respective deformed conductive bump increases.
    Type: Application
    Filed: January 12, 2020
    Publication date: May 14, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai, Chia-Lun Chang, Chih-Chiang Tsao, Philip Yu-Shuan Chung
  • Patent number: 10644181
    Abstract: A photovoltaic module is provided, and a cell set thereof includes a first cell, a second cell, and a conductive connection element. In the first cell, a first semiconductor stack has a first surface, a second surface, and a first side surface. A first electrode is disposed on the first surface. A second electrode is disposed on the second surface. In the second cell, a second semiconductor stack has a third surface, a fourth surface, and a second side surface. A third electrode is disposed on the third surface. A fourth electrode is disposed on the fourth surface. The conductive connection element connects the first electrode with a part of a first insulation layer on the second surface, and connects the third electrode with a part of a second insulation layer on the fourth surface.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: May 5, 2020
    Assignee: Industrial Technology Research Institute
    Inventors: Chao-Ping Huang, Shang-Yeh Wen, Cheng-Yu Peng
  • Patent number: 10622240
    Abstract: A method comprises forming a plurality of interconnect structures including a dielectric layer, a metal line and a redistribution line over a carrier, attaching a semiconductor die on a first side of the plurality of interconnect structures, forming an underfill layer between the semiconductor die and the plurality of interconnect structures, mounting a top package on the first side the plurality of interconnect structures, wherein the top package comprises a plurality of conductive bumps, forming an encapsulation layer over the first side of the plurality of interconnect structures, wherein the top package is embedded in the encapsulation layer, detaching the carrier from the plurality of interconnect structures and mounting a plurality of bumps on a second side of the plurality of interconnect structures.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: April 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu
  • Patent number: D880583
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: April 7, 2020
    Assignee: AVISION INC.
    Inventors: Shao-Lan Sheng, Chao-Yu Peng
  • Patent number: D881887
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: April 21, 2020
    Assignee: AVISION INC.
    Inventor: Chao-Yu Peng
  • Patent number: D885792
    Type: Grant
    Filed: July 30, 2017
    Date of Patent: June 2, 2020
    Assignee: Chengdu YiShouWeiSheng Technology Co., Ltd
    Inventor: Yu Peng
  • Patent number: D886823
    Type: Grant
    Filed: November 25, 2017
    Date of Patent: June 9, 2020
    Assignee: AVISION INC.
    Inventor: Chao-Yu Peng
  • Patent number: D893604
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: August 18, 2020
    Assignee: AVISION INC.
    Inventors: Shao-Lan Sheng, Chao-Yu Peng
  • Patent number: D895621
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: September 8, 2020
    Assignee: AVISION INC.
    Inventor: Chao-Yu Peng