Patents by Inventor Yu-Piao Wang

Yu-Piao Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200306923
    Abstract: A polishing pad is provided. The polishing surface of the polishing pad corresponds to a two-dimensional orthogonal coordinate system having a first coordinate direction and a second coordinate direction, the rotating axis of the polishing pad corresponds to the original point of the two-dimensional orthogonal coordinate system, and the polishing pad includes a polishing layer and a surface pattern. The surface pattern is disposed in the polishing layer, and includes at least one first groove and at least one second groove respectively distributing along the first coordinate direction, wherein the at least one first groove has a first cutting trajectory direction, the first cutting trajectory direction is forward with the first coordinate direction, and the at least one second groove has a second cutting trajectory direction, the second cutting trajectory direction is reverse with the first coordinate direction.
    Type: Application
    Filed: March 23, 2020
    Publication date: October 1, 2020
    Applicant: IV Technologies CO., Ltd.
    Inventors: Liang-Chi Tu, Yu-Piao Wang
  • Publication number: 20200047307
    Abstract: A polishing layer is provided. The polishing layer have a surface pattern, a cross section of the surface pattern along a direction has a plurality of grooves and a plurality of polishing portions, each of the grooves is disposed between every two adjacent polishing portions, and the polishing layer comprises a body layer and a surface layer. The surface layer is disposed on a surface of the body layer, and a top of at least one of the polishing portions has at least one flattened region exposing the body layer.
    Type: Application
    Filed: October 16, 2019
    Publication date: February 13, 2020
    Applicant: IV Technologies CO., Ltd.
    Inventors: Yu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang
  • Patent number: 10518386
    Abstract: A polishing pad is provided. The polishing pad, suitable for a polishing procedure using a slurry containing water, includes a polishing track region and a first reactant. The polishing track region includes a central region and a peripheral region surrounding the central region. The first reactant is disposed in the central region of the polishing track region, wherein the first reactant is able to react endothermically with the water in the slurry.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: December 31, 2019
    Assignee: IV Technologies CO., Ltd.
    Inventors: Yu-Piao Wang, I-Ping Chen
  • Patent number: 10478940
    Abstract: A manufacturing method of a polishing layer is provided. First, a mold for which the mold cavity has a contour pattern is provided, and the cross section of the contour pattern along a direction includes a plurality of recessions and at least one concavity portion, wherein the at least one concavity portion is disposed on the bottom of at least one of the recessions. A polymer material is disposed in the mold cavity. The polymer material is cured to form a semifinished product, wherein the cross section of the semifinished product along the direction includes a plurality of polishing portions corresponding to the recessions and at least one protruding portion corresponding to the at least one concavity portion. A flattening process is performed on the semifinished product to remove the at least one protruding portion.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: November 19, 2019
    Assignee: IV Technologies CO., Ltd.
    Inventors: Yu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang
  • Publication number: 20190321936
    Abstract: A polishing pad is provided. The polishing pad comprises a polishing layer and a metal-containing layer. The polishing layer has a polishing surface and a backside surface opposite to each other, wherein the backside surface has a plurality of cavities. The metal-containing layer is disposed on the backside surface of the polishing layer and fills into the cavities, wherein a first contact area is between the metal-containing layer and the backside surface of the polishing layer, and the first contact area is larger than the orthogonal projection area of the polishing layer.
    Type: Application
    Filed: April 17, 2019
    Publication date: October 24, 2019
    Applicant: IV Technologies CO., Ltd.
    Inventors: Yu-Piao Wang, I-Ping Chen
  • Publication number: 20190099860
    Abstract: A polishing pad is provided. The polishing pad, suitable for polishing an object, includes a polishing layer and at least one groove. The polishing layer has a central region and a peripheral region surrounding the central region. The at least one groove is disposed in the polishing layer, wherein the at least one groove has two ends both located in the peripheral region, wherein the two ends include an open end and a closed end.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 4, 2019
    Applicant: IV Technologies CO., Ltd.
    Inventor: Yu-Piao Wang
  • Publication number: 20190061096
    Abstract: A polishing pad including a polishing layer and at least one detection window is provided. The polishing layer includes a polishing surface and a back surface having at least one protrusion. The at least one detection window is disposed at a location corresponding to the at least one protrusion in the polishing layer, and the at least one protrusion surrounds the at least one detection window. A manufacturing method and a polishing method of the polishing pad are also provided.
    Type: Application
    Filed: August 22, 2018
    Publication date: February 28, 2019
    Applicant: IV Technologies CO., Ltd.
    Inventor: Yu-Piao Wang
  • Publication number: 20180161959
    Abstract: A polishing pad is provided. The polishing pad, suitable for a polishing procedure using a slurry containing water, includes a polishing track region and a first reactant. The polishing track region includes a central region and a peripheral region surrounding the central region. The first reactant is disposed in the central region of the polishing track region, wherein the first reactant is able to react endothermically with the water in the slurry.
    Type: Application
    Filed: December 8, 2017
    Publication date: June 14, 2018
    Applicant: IV Technologies CO., Ltd.
    Inventors: Yu-Piao Wang, I-Ping Chen
  • Publication number: 20180009080
    Abstract: A manufacturing method of a polishing layer is provided. First, a mold for which the mold cavity has a contour pattern is provided, and the cross section of the contour pattern along a direction includes a plurality of recessions and at least one concavity portion, wherein the at least one concavity portion is disposed on the bottom of at least one of the recessions. A polymer material is disposed in the mold cavity. The polymer material is cured to form a semifinished product, wherein the cross section of the semifinished product along the direction includes a plurality of polishing portions corresponding to the recessions and at least one protruding portion corresponding to the at least one concavity portion. A flattening process is performed on the semifinished product to remove the at least one protruding portion.
    Type: Application
    Filed: June 28, 2017
    Publication date: January 11, 2018
    Applicant: IV Technologies CO., Ltd.
    Inventors: Yu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang
  • Patent number: 9393665
    Abstract: A polishing method and a polishing system are provided. By means of adjusting a rotational center of a polishing article corresponding to positions of a polishing pad or polishing pads, a polishing rate of the polishing article surface has a better uniformity, resulted from compensation of polishing rates at the rotational center of the polishing article.
    Type: Grant
    Filed: August 5, 2011
    Date of Patent: July 19, 2016
    Assignees: IV TECHNOLOGIES CO., LTD., POWERCHIP TECHNOLOGY CORPORATION
    Inventors: Yu-Piao Wang, Jen-Feng Cheng, Te-Yang Chen, Ya-Ling Chen
  • Patent number: 8870626
    Abstract: A polishing pad used in conjunction with a carrier ring to polish a substrate and has a motion direction when polishing is provided. The carrier ring has at least one carrier groove, and the substrate has a substrate radius. The polishing pad has a polishing layer and a surface pattern. The surface pattern has traversing grooves, and an angle between the tangent line of each traversing groove and the tangent line of the motion direction is not equal to 0 degree. Each traversing groove respectively has a traversing groove trajectory corresponding to the motion direction, and the traversing groove trajectory of the traversing groove has a trajectory width smaller than the substrate radius. At leading region of the carrier ring corresponding to the motion direction, the traversing grooves have at least one carrier compatible groove which aligns with the at least one carrier groove of the carrier ring.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: October 28, 2014
    Assignee: IV Technologies Co., Ltd.
    Inventor: Yu-Piao Wang
  • Patent number: 8721394
    Abstract: A polishing pad and a polishing method for polishing a substrate are described. The polishing pad includes a polishing layer and at least two grooves. The grooves form polishing tracks respectively. The polishing tracks collectively construct an even tracking zone. A better polishing uniformity of a substrate surface is achieved with the even tracking zone.
    Type: Grant
    Filed: December 19, 2007
    Date of Patent: May 13, 2014
    Assignee: IV Technologies Co., Ltd.
    Inventor: Yu-Piao Wang
  • Patent number: 8496512
    Abstract: A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: July 30, 2013
    Assignee: IV Technologies Co., Ltd.
    Inventor: Yu-Piao Wang
  • Patent number: 8398461
    Abstract: A polishing method, a polishing pad and a polishing system are provided. In the invention, the polishing pad is used to polish a polishing article. The polishing pad includes a polishing layer and a surface pattern disposed in the polishing layer. The polishing layer includes a polishing surface, a rotating central region, and a peripheral region. The surface pattern includes many grooves distributed from near the rotating central region and extending outward to near the peripheral region. The grooves include many groove cross sections along a circumferential direction of a same radius. Each of the groove cross sections has a left sidewall and a right sidewall. An included angle is formed by the polishing surface and one of a group of the left sidewalls and a group of the right sidewalls. The included angle is an obtuse angle.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: March 19, 2013
    Assignee: IV Technologies Co., Ltd.
    Inventor: Yu-Piao Wang
  • Patent number: 8393936
    Abstract: The edge effect or variation in polishing edge profile on a substrate undergoing CMP is reduced by structuring a retaining ring, housed in a carrier head for retaining the substrate, such that the polishing edge profile shifts back and forth with respect to the center of the substrate. Embodiments include structuring the retaining ring such that the width between inner and outer surfaces varies by an amount sufficient to compensate for polishing edge profile variation. Embodiments also include structuring the retaining ring such that the distance from the outer surface to the geometric inner surface varies. Embodiments further include structuring the retaining ring such that the distance between the outer surface to the perimeter of the substrate retained by the inner surface of the retaining ring varies.
    Type: Grant
    Filed: August 24, 2009
    Date of Patent: March 12, 2013
    Assignee: IV Technologies Co., Ltd.
    Inventor: Yu Piao Wang
  • Publication number: 20130040539
    Abstract: A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.
    Type: Application
    Filed: October 10, 2012
    Publication date: February 14, 2013
    Applicant: IV Technologies Co., Ltd.
    Inventor: Yu-Piao WANG
  • Publication number: 20130017766
    Abstract: A polishing pad used in conjunction with a carrier ring to polish a substrate and has a motion direction when polishing is provided. The carrier ring has at least one carrier groove, and the substrate has a substrate radius. The polishing pad has a polishing layer and a surface pattern. The surface pattern has traversing grooves, and an angle between the tangent line of each traversing groove and the tangent line of the motion direction is not equal to 0 degree. Each traversing groove respectively has a traversing groove trajectory corresponding to the motion direction, and the traversing groove trajectory of the traversing groove has a trajectory width smaller than the substrate radius. At leading region of the carrier ring corresponding to the motion direction, the traversing grooves have at least one carrier compatible groove which aligns with the at least one carrier groove of the carrier ring.
    Type: Application
    Filed: May 16, 2012
    Publication date: January 17, 2013
    Applicant: IV TECHNOLOGIES CO., LTD.
    Inventor: Yu-Piao Wang
  • Patent number: 8303382
    Abstract: A polishing pad, comprising a mounting surface and an opposing polishing surface with a polishing pattern having at least one aperture thereon, is formed with an adhesive layer adhered to the mounting surface with uniform adhesive strength therebetween. Embodiments include applying an adhesive layer to the mounting surface with uniform pressure prior to forming the polishing pattern on the polishing surface. Embodiments also include forming the polishing pattern having at least one aperture, forming a fitter having a surface pattern opposite to the polishing pattern and having a projection, positioning the fitter on the polishing pattern so that the projection fills the aperture in the polishing pattern forming a composite having substantially parallel opposing surfaces, applying pressure to bond the adhesive layer to the mounting surface with substantially uniform adhesive strength therebetween, and removing the fitter.
    Type: Grant
    Filed: October 4, 2006
    Date of Patent: November 6, 2012
    Assignee: IV Technologies Co., Ltd.
    Inventors: Yu-Piao Wang, Yun-Liang Ouyang
  • Patent number: 8303378
    Abstract: A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.
    Type: Grant
    Filed: April 22, 2009
    Date of Patent: November 6, 2012
    Assignee: IV Technologies Co., Ltd
    Inventor: Yu-Piao Wang
  • Patent number: RE46648
    Abstract: A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: December 26, 2017
    Assignee: IV Technologies Co., Ltd.
    Inventor: Yu-Piao Wang