Patents by Inventor Yu-Po Huang
Yu-Po Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210360822Abstract: A housing includes a first plate and a second plate disposed to face the first plate. In a space of the housing, a groove passing through a heat source contactable portion is formed on at least one of the first plate and the second plate.Type: ApplicationFiled: May 11, 2021Publication date: November 18, 2021Inventors: Yu-Po HUANG, Wang TONY
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Patent number: 10731924Abstract: Disclosed are a vapor chamber sealing method and a structure using the method. An upper plate and a lower plate used for making a plate of a vapor chamber are prepared, and outer edges of the upper and lower plates are formed into mutually attached sealed edges, and then the sealed edges of the upper and lower plates are aligned and engaged with each other to form a chamber between the upper and lower plates, and a sealing structure is formed and combined with the sealed edges of the upper and lower plates by an injection molding method, and the sealing structure is formed around and combined with the sealed edges of the upper and lower plates.Type: GrantFiled: November 29, 2018Date of Patent: August 4, 2020Assignee: KUNSHAN JUE-CHUNG ELECTRONICS CO., LTD.Inventor: Yu-Po Huang
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Publication number: 20200173732Abstract: Disclosed are a vapor chamber sealing method and a structure using the method. An upper plate and a lower plate used for making a plate of a vapor chamber are prepared, and outer edges of the upper and lower plates are formed into mutually attached sealed edges, and then the sealed edges of the upper and lower plates are aligned and engaged with each other to form a chamber between the upper and lower plates, and a sealing structure is formed and combined with the sealed edges of the upper and lower plates by an injection molding method, and the sealing structure is formed around and combined with the sealed edges of the upper and lower plates.Type: ApplicationFiled: November 29, 2018Publication date: June 4, 2020Inventor: Yu-Po HUANG
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Patent number: 10107562Abstract: A heat pipe and a sealing method thereof; the sealing method for a heat pipe includes the steps of: providing a metal pipe member, the metal pipe member including one end having a sealed end portion formed thereon and another end thereof having a narrowing neck section extended therefrom. The narrowing neck section includes a channel. A compression mold compresses the narrowing neck section and moves away from the metal pipe member in order to compress and elongate the narrowing neck section into a compression elongated column and to seal the channel. Finally, spot welding process is performed on the compression elongated column to form a sealed block thereon. The present invention is of the merits of improved work efficiency for heat pipe bending, compression and testing and increased length of the metal pipe member with enhanced thermal transfer performance of the heat pipe.Type: GrantFiled: September 3, 2016Date of Patent: October 23, 2018Assignee: KUNSHAN JUE-CHUNG ELECTRONICS CO., LTD.Inventors: Hung-Ping Hsieh, Yu-Po Huang
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Publication number: 20180066899Abstract: A heat pipe and a sealing method thereof; the sealing method for a heat pipe includes the steps of: providing a metal pipe member, the metal pipe member including one end having a sealed end portion formed thereon and another end thereof having a narrowing neck section extended therefrom. The narrowing neck section includes a channel. A compression mold compresses the narrowing neck section and moves away from the metal pipe member in order to compress and elongate the narrowing neck section into a compression elongated column and to seal the channel. Finally, spot welding process is performed on the compression elongated column to form a sealed block thereon. The present invention is of the merits of improved work efficiency for heat pipe bending, compression and testing and increased length of the metal pipe member with enhanced thermal transfer performance of the heat pipe.Type: ApplicationFiled: September 3, 2016Publication date: March 8, 2018Inventors: Hung-Ping HSIEH, Yu-Po HUANG
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Patent number: 8857502Abstract: A vapor chamber is configured to conduct heat generated by a heat-generating element and includes a bottom plate, a first wick structure, a second wick structure, a cover plate and a working fluid filled between the cover plate and the bottom plate. One side of the bottom plate has a heated protrusion in thermal contact with the heat-generating element, and the other side is formed with an accommodating trough corresponding to the heated protrusion. The first wick structure is provided in the accommodating trough. The second wick structure is disposed on the bottom plate and provided with an opening and a plurality of airflow channels in communication with the opening. The cover plate tightly covers the bottom plate. The supporting posts are sandwiched between the cover plate and the first wick structure. By this arrangement, the mounting and heat-conducting of the heat-generating element can be achieved.Type: GrantFiled: July 26, 2011Date of Patent: October 14, 2014Assignee: Kunshan Jue-Chung Electronics Co., Ltd.Inventor: Yu-Po Huang
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Patent number: 8550148Abstract: A structure of heat plate with clip includes a heat plate and at least one clip. The heat plate is a hollow body having an interior cavity containing a capillary structure and a working fluid. The heat plate has a surface forming a receiving chamber. The clip is a resilient plate having mounting sections, which are mounted to the heat plate. The mounting sections have a portion received in the receiving chamber. In this way, replacement of inside-cavity supporting structure can be realized and advantages of thinned structure, flexible adjustment of positioning, and being hard to cause stress induced deformation can be achieved.Type: GrantFiled: October 13, 2010Date of Patent: October 8, 2013Assignee: Kunshan Jue-Choung Electronics Co., Ltd.Inventors: Yu-Po Huang, Tung-Jung Kuo
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Patent number: 8403032Abstract: A structure of heat plate includes a hollow portion formed adjacent to a side edge of a plate body or in a corner of the plate body. A seal tube is received in the hollow portion so that the plate body provides complete protection to the seal tube against deformation or damage of the seal tube caused by external impact or hit and offers the advantages of simple structure, excellent durability, being easy to practice, and flexibility of arrangement.Type: GrantFiled: December 31, 2009Date of Patent: March 26, 2013Assignee: Kunshan Jue-Choung Electronics Co., Ltd.Inventors: Yu-Po Huang, Tung-Jung Kuo
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Publication number: 20130025829Abstract: A vapor chamber is configured to conduct heat generated by a heat-generating element and includes a bottom plate, a first wick structure, a second wick structure, a cover plate and a working fluid filled between the cover plate and the bottom plate. One side of the bottom plate has a heated protrusion in thermal contact with the heat-generating element, and the other side is formed with an accommodating trough corresponding to the heated protrusion. The first wick structure is provided in the accommodating trough. The second wick structure is disposed on the bottom plate and provided with an opening and a plurality of airflow channels in communication with the opening. The cover plate tightly covers the bottom plate. The supporting posts are sandwiched between the cover plate and the first wick structure. By this arrangement, the mounting and heat-conducting of the heat-generating element can be achieved.Type: ApplicationFiled: July 26, 2011Publication date: January 31, 2013Inventor: Yu- Po HUANG
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Publication number: 20120227934Abstract: A heat pipe having a composite wick structure includes a first pipe, a second pipe, a third wick structure, a working fluid, an evaporating section, a condensing section and a transferring section. The inner wall of the first pipe is provided with a first wick structure. The evaporating section is formed on one side of the first pipe. The condensing section is formed on the other side of the first pipe. The transferring section is formed in the first pipe between the evaporating section and the condensing section. The second pipe is received in the first pipe and located in the transferring section. The outer wall of the second pipe is provided with a second wick structure. The third wick structure is provided between the first wick structure and the second wick structure. The working fluid is filled in the first pipe. By this structure, the condensed working fluid in the first pipe can quickly flow from the condensing section through the transferring section back to the evaporating section.Type: ApplicationFiled: March 11, 2011Publication date: September 13, 2012Inventor: Yu-Po HUANG
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Publication number: 20120227935Abstract: The present invention relates to an interconnected heat pipe assembly and a method for manufacturing the same. The interconnected heat pipe assembly includes a first heat pipe and a second heat pipe. The first heat pipe comprises a first pipe, a first wick structure and a first working fluid. The first pipe has a hollow chamber and an opening. The first wick structure is arranged on inner walls of the hollow chamber. The first working fluid is filled in the hollow chamber. The second heat pipe is disposed through the opening in the first pipe with a portion of the second heat pipe being received in the hollow chamber. An air channel is formed between outer walls of the second heat pipe and inner walls of the first pipe. The present invention can conduct heat to a long distance and has an increased heat-conducting efficiency.Type: ApplicationFiled: March 11, 2011Publication date: September 13, 2012Inventor: Yu-Po HUANG
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Publication number: 20120090824Abstract: A structure of heat plate with clip includes a heat plate and at least one clip. The heat plate is a hollow body having an interior cavity containing a capillary structure and a working fluid. The heat plate has a surface forming a receiving chamber. The clip is a resilient plate having mounting sections, which are mounted to the heat plate. The mounting sections have a portion received in the receiving chamber. In this way, replacement of inside-cavity supporting structure can be realized and advantages of thinned structure, flexible adjustment of positioning, and being hard to cause stress induced deformation can be achieved.Type: ApplicationFiled: October 13, 2010Publication date: April 19, 2012Applicant: Kunshan Jue-Choung Electronics Co., Ltd.Inventors: Yu-Po Huang, Tung-Jung Kuo
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Publication number: 20120048517Abstract: The heat pipe of the invention includes a tube in which an evaporating portion and a condensing portion are defined; a grooved wick longitudinally and entirely disposed on an inner wall of the tube and communicating the evaporating portion with the condensing portion; a porous wick only disposed on the inner wall of the evaporating portion and covering the grooved wick in the evaporating portion; and a fiber wick in a shape of a strip, whose one end connects the porous wick and whose the other end longitudinally extends to the condensing portion.Type: ApplicationFiled: August 31, 2010Publication date: March 1, 2012Inventors: Yu- Po Huang, Tung-Jung Kuo
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Publication number: 20120047984Abstract: First, a heat pipe containing a work fluid is provided. The heat pipe is not pressed until the work fluid turns into a vapor phase so as to form a desired shape. The method can be employed to shape a round cross-section of a heat pipe into an oblate one.Type: ApplicationFiled: August 24, 2010Publication date: March 1, 2012Inventors: Yu-Po Huang, Tung-Jung Kuo
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Publication number: 20120031587Abstract: A heat plate includes two boards, which mate and are coupled to each other to define therebetween an accommodation chamber and a capillary structure of at least one first capillary layer and at least one second capillary layer arranged in the accommodation chamber in such a way that the first and second capillary layers are stacked over each other. With the arrangement of the first and second capillary layers, the efficiency of diffusion of vapor of a working fluid is increased and the uniformity of distribution of the working fluid is enhanced, so that the efficiency of temperature reduction is improved.Type: ApplicationFiled: August 5, 2010Publication date: February 9, 2012Applicant: Kunshan Jue-Choung Electronics Co., Ltd.Inventors: Yu-Po Huang, Tung-Jung Kuo
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Publication number: 20120031588Abstract: A structure of heat plate includes two boards, which mate and are coupled to each other to define therebetween an accommodation chamber and a plurality of capillary layers arranged in the accommodation chamber in such a way that the capillary layers are set on a common horizontal plane and the capillary layers form therebetween a plurality of passages. As such, the efficiency of diffusion of vapor of a working fluid is increased and the uniformity of distribution of the working fluid is improved, so that the efficiency of temperature reduction is improved.Type: ApplicationFiled: August 5, 2010Publication date: February 9, 2012Applicant: Kunshan Jue-Choung Electronics Co., LtdInventors: Yu-Po Huang, Tung-Jung Kuo
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Publication number: 20110240256Abstract: A mounting structure is provided for a heat dissipater, including a heat plate having a surface on which a radiator is positioned. A plurality of retention members is set on side margin portions of the surface of the heat plate. The retention members are secured to the heat plate in a locked manner, so that the retention members help spreading stress to realize stable and secure mounting and enhance the performance of heat transfer.Type: ApplicationFiled: April 6, 2010Publication date: October 6, 2011Applicant: Kunshan Jue-Choung Electronics Co., Ltd.Inventors: Yu-Po Huang, Tung-Jung Kuo
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Publication number: 20110220328Abstract: In a flexible heat pipe and a manufacturing method thereof, the flexible heat pipe includes a first tube body, a second tube body arranged apart from the first tube body, a flexible section, a wick structure, and a working fluid. The flexible section includes an annular elastomer and a soft encapsulating layer. The annular elastomer connects the first tube body and the second tube body. The soft encapsulating layer is set around the annular elastomer. The capillary structure is settled inside the first tube body, the second tube body, and the annular elastomer. The working fluid is filled inside the first tube body, the second tube body, and the soft encapsulating layer. Then, the flexible heat pipe can be bent to any angle or in any direction according to practical demands.Type: ApplicationFiled: March 9, 2010Publication date: September 15, 2011Inventors: Yu- Po HUANG, Tung-Jung Kuo
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Publication number: 20110214841Abstract: A flat heat pipe structure includes a flat pipe, a radial capillary structure and an axial capillary structure. The pipe has a containing space for sealing and storing a working fluid, and the pipe is formed by two opposite bottom walls and two sidewalls laterally and respectively disposed on the two bottom walls, and the pipe further has an evaporation portion, and the radial capillary structure is situated in the evaporation portion and radially surrounded and attached onto the two bottom walls and two sidewalls, and the axial capillary structure is extended in a lengthwise direction of the pipe, disposed in the containing space, and attached onto one of the sidewalls, and the axial capillary structure is extended to the evaporation portion of the pipe and coupled to the radial capillary structure.Type: ApplicationFiled: March 4, 2010Publication date: September 8, 2011Inventors: Yu- Po HUANG, Tung-Jung Kuo
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Publication number: 20110214846Abstract: A method for manufacturing a heat sink includes steps of: preparing a metallic belt; providing a spraying device for spraying a metallic coating layer on one surface of the metallic belt; providing a stamping device for blanking the metallic belt to form a heat-dissipating fin; and stacking a plurality of heat-dissipating fins to form the heat sink. In this way, the heat-dissipating area and efficiency of the heat sink can be increased. The stability and soldering ability of different materials can be improved. The present invention further provides a heat sink.Type: ApplicationFiled: March 5, 2010Publication date: September 8, 2011Inventors: Yu- Po HUANG, Tung-Jung Kuo