Heat dissipater mounting structure

Abstract

A mounting structure is provided for a heat dissipater, including a heat plate having a surface on which a radiator is positioned. A plurality of retention members is set on side margin portions of the surface of the heat plate. The retention members are secured to the heat plate in a locked manner, so that the retention members help spreading stress to realize stable and secure mounting and enhance the performance of heat transfer.

Description

FIELD OF THE INVENTION

The present invention relates to a heat dissipater mounting structure, and in particular to a heat dissipater mounting structure that helps spreading stress and thus realizes stable and secure mounting and enhance the performance of heat transfer.

BACKGROUND OF THE INVENTION

A personal computer or a notebook computer often suffers accumulation of heat due to long time operation. One of the commonly known solutions is to add a heat plate for dissipation of the heat. A heat plate shows the characteristics of high heat transfer rate, light weight, and simple structure, and is capable of transfer of a great amount of heat without consuming electrical power.

The conventional way of mounting a heat plate is to position the heat plate directly on an electronic device that generates heat. The heat plate is further provided with a radiator. The heat plate forms a hollow interior vacuum chamber, in which a capillary structure is formed and a working fluid is received. Through circulation of the working fluid that repeatedly converts between two phases through the capillary structure, the heat generated by the electronic device is transferred to the radiator, so that the heat generated during the operation of the electronic device can be dissipated to the surroundings. However, in a long course of use, a heat plate is subjected to thermal expansion due to the heat applied thereto. Since the heat plate is often secured to an electronic device through bolts that are set at corners of the heat plate. Stresses that are induced may get concentrated at the corners, making the heat plate that is subjected to thermal expansion warped. As a result, stably and securely mounting the heat plate to the electronic device can be no longer held, leading to deterioration or loss of the performance of heat transfer of the heat plate.

Thus, the present invention aims to provide a heat dissipater mounting structure that helps spreading the stresses induced therein to enhance the convenience of use thereof.

SUMMARY OF THE INVENTION

An objective of the present invention is to provide a heat dissipater mounting structure, which provides the efficacies of spreading stress induced therein, stable and secure mounting, and enhanced performance of heat transfer.

To realize the above objective, the present invention provides a heat dissipater mounting structure, comprising at least a radiator, which is positioned on a surface of a heat plate, and a plurality of retention members, which is respectively set on side margin portions of the surface of the heat plate. Fasteners are applied to secure the retention members to the heat plate. The retention members have a unique structure that helps spreading stress, stably mounting, and effectively enhancing the performance of heat transfer.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be apparent to those skilled in the art by reading the following description of preferred embodiments thereof with reference to the drawings, in which:

FIG. 1 is a perspective view showing a heat dissipater mounting structure in accordance with a first embodiment of the present invention;

FIG. 2 is an exploded view of the heat dissipater mounting structure in accordance with the first embodiment of the present invention;

FIG. 3 is a perspective view showing a heat dissipater mounting structure in accordance with a second embodiment of the present invention; and

FIG. 4 is an exploded view of the heat dissipater mounting structure in accordance with the second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

First Embodiment

With reference to the drawings and in particularly to FIGS. 1 and 2, which respectively show a perspective view and an exploded view of a heat dissipater mounting structure in accordance with a first embodiment of the present invention, the heat dissipater mounting structure of the present invention comprises a heat plate 100, at least one radiator 200, and a plurality of retention members 300, provided for mounting on an electronic device to dissipate heat generated by the operation of the electronic device.

The heat plate 100 forms a plurality of first mounting holes 110. The heat plate 100 forms a hollow interior vacuum chamber in which a capillary structure is mounted and a working fluid is received, whereby circulation of the working fluid that changes between two phases thereof through the capillary structure formed inside the heat plate 100 effectively transfers and thus dissipate heat from a heat source and thus reduces the temperature of the heat source.

The radiator 200 is positioned on a surface of the heat plate 100. In the embodiment illustrated, the radiator 200 comprises a plurality of stacked heat dissipation fins, or alternatively heat pipes can be included, or further alternatively, a combination of heat dissipation fins and heat pipes can be used.

The retention members 300 are set on side margin portions of the surface of the heat plate 100. A plurality of fasteners 400 (such as bolts 410 and C clips 420) is provided for fixing the retention members 300 to the heat plate 100 in a locked manner. In the embodiment illustrated, the surface of the heat plate 100 has a plurality of side margin portions (four side margin portions, for example). The retention members 300 are selectively set on any one of the side margin portions. For example, two retention members 300 are respectively set on two opposite side margin portions of the surface of the heat plate 100; alternatively, three retention members 300 are set on three consecutive side margin portions of the surface of the heat plate 100 to form a U-shaped arrangement. The retention members 300 form a plurality of second mounting holes 310 respectively corresponding to the first mounting holes 110. Each retention member 300 comprises two inclined sections 301 and a flat section 302, so that the two inclined sections 301 are respectively connected to opposite ends of the flat section 302, preferably in a symmetric manner, to form a unique structure of the retention member 300 according to the present invention. The second mounting holes 310 are respectively defined in the inclined sections 301. The flat section 302 is positionable, in a tight engagement manner, on the surface of the heat plate 100.

To use the heat dissipater mounting structure of the present invention, the radiator 200 is first positioned on the surface of the heat plate 100, and two opposite side margin portions of the surface of the heat plate 100 each receive a retention member 300 positioned thereon. The retention member 300 has two inclined sections 301 and a flat section 302. The two inclined sections 301 are respectively connected to opposite ends of the flat section 302. The inclined sections 301 form second mounting holes 310. The flat section 302 is positionable on the surface of the heat plate 100 in a tight engagement manner. Fasteners 400 are respectively put through the first mounting holes 110 formed in the heat plate 100 and the second mounting holes 310 formed in the retention members 300 to secure the retention members 300 and the heat plate 100 together in a locked manner, whereby when the heat plate 100 is set on an electronic device, the heat plate 100 transfers the heat generated by the operation of the electronic device to the radiator 200 for further dissipation of the heat. Further, due to the unique structure of the retention member 300, the flat section 302 of the retention member 300 is flat set on and in tight engagement with the heat plate 100 for spreading stress induced therein so that warping of the heat plate 100 is prevented, stably and securely mounting the heat plate 100 to the electronic device is ensured, and the performance of heat dissipation of the heat plate 100 is enhanced.

Second Embodiment

Referring to FIGS. 3 and 4, which respectively show a perspective view and an exploded view of a heat dissipater mounting structure according to a second embodiment of the present invention, the second embodiment is substantially similar to the first embodiment but they are different in that the heat plate 100 of the second embodiment comprises an extension section 120, and the radiator 200 is positioned on the extension section 120. The heat plate 100 has a surface having at least two opposite side margin portions on which retention members 300 are mounted. A pad 500 (for example an elongate pad) is provided between each retention member 300 and the surface of the heat plate 100 to support the flat section 302 of the retention member 300 to rest thereon. The pad 500 enhances spreading of stress induced on the heat plate.

To summarize, the present invention provides a heat dissipater mounting structure, which arranges at least one radiator 200 on a surface of a heat plate 100 and sets a plurality of retention members 300 on side margin portions of the surface of the heat plate 100 with the retention members 300 being secured to the heat plate 100 in a locked manner. With a unique structure of the retention member 300, the retention member 300 helps spreading stress induced in the heat plate 100 during the use thereof, so that the heat plate 100 can be stably and securely mounted to an electronic device and the performance of heat transfer of the heat plate 100 is enhanced.

Although the present invention has been described with reference to the preferred embodiments thereof, it is apparent to those skilled in the art that a variety of modifications and changes may be made without departing from the scope of the present invention which is intended to be defined by the appended claims.

Claims

1. A heat dissipater mounting structure, comprising:

a heat plate;

at least one radiator, which is positioned on a surface of the heat plate; and

a plurality of retention members, which is respectively set on side margin portions of the surface of the heat plate and comprises a plurality of fasteners that secures the retention members to the heat plate.

2. The mounting structure of heat dissipation device as claimed in claim 1, wherein the surface of the heat plate comprises a plurality of side margin portions and wherein two retention members are respectively set on two opposite side margin portions of the surface of the heat plate.

3. The mounting structure of heat dissipation device as claimed in claim 1, wherein the heat plate comprises an extension section on which the radiator is positioned.

4. The mounting structure of heat dissipation device as claimed in claim 1, wherein the heat plate forms a plurality of first mounting holes, the retention members forming a plurality of second mounting holes corresponding to the first mounting holes, the fasteners being respectively received through the first mounting holes and the second mounting holes to secure the retention members to the heat plate.

5. The mounting structure of heat dissipation device as claimed in claim 4, wherein each of the retention members comprises two inclined sections and a flat section, the two inclined sections being respectively connected to two opposite ends of the flat section, the inclined sections forming the second mounting holes, the flat section being positionable on the surface of the heat plate.

6. The mounting structure of heat dissipation device as claimed in claim 1, wherein the fasteners comprise bolts and C clips.

7. The mounting structure of heat dissipation device as claimed in claim 1, wherein the radiator comprises a plurality of stacked heat dissipation fins or heat pipes.

8. The mounting structure of heat dissipation device as claimed in claim 1, wherein the radiator comprises a plurality of stacked heat dissipation fins and heat pipes.

9. The mounting structure of heat dissipation device as claimed in claim 1, wherein a pad is arranged between each of the retention members and the surface of the heat plate.