Abstract: A semiconductor die package is provided. The semiconductor die package includes a package substrate, and a first semiconductor die and a second semiconductor die disposed thereon. A ring structure is attached to the package substrate and surrounds the semiconductor dies. A lid structure is attached to the ring structure and disposed over the semiconductor dies, and has an opening exposing the second semiconductor die. A heat sink is disposed over the lid structure and has a portion extending into the opening of the lid structure. A first thermal interface material (TIM) layer is interposed between the lid structure and the first semiconductor die. A second TIM layer is interposed between the extending portion of the heat sink and the second semiconductor die. The first TIM layer has a thermal conductivity higher than the thermal conductivity of the second TIM layer.

Abstract: A package structure includes a circuit substrate, a semiconductor package, first bump structures and second bump structures. The semiconductor package is disposed on the circuit substrate, wherein the semiconductor package includes a center region and side regions surrounding the center region. The first bump structures are disposed on the center region of the semiconductor package and electrically connecting the semiconductor package to the circuit substrate. The second bump structures are disposed on the side regions of the semiconductor package and electrically connecting the semiconductor package to the circuit substrate, wherein the first bump structures and the second bump structures have different heights and different shapes.

Abstract: An interactive user feedback system for enhancing the inspection accuracy of an automated visual inspection (AVI) system is disclosed. When working normally, the AVI system acquires an article image from a continuous article transferred by a transfer equipment, and then determines whether there is at least one defect feature existing in the article image or not. Subsequently, the interactive user feedback system enables a display of the electronic device show an inspection report region consisting of M×N sub-regions. As such, the display is enabled to show a zoom-in sub-image containing at least one defect after a sub-region is clicked. Therefore, by viewing the zoom-in sub-image, an inspector can determine whether a defect classification data made by the AVI system is correct or not. If not, the inspector is able to revise the defect classification data through the interactive user feedback system.

Abstract: A flexible and intuitive system is disclosed, and is disposed to be coupled to at least one camera, at least one robotic arm and a host electronic device of an AVI system. During a normal operation of the system, a configuration parameter setting of the AVI system can be completed after at least one time of robotic arm setting operation and at least one time of camera setting operation are conducted. After that, a plurality of article images acquired from a specific article by the camera are upload to a remote electronic device by the system, such that the remote electronic device utilizes the article images to update (re-train) a defect recognition model. Consequently, after the system integrates the defect recognition model into a defect recognition program that is installed in the host electronic device, the AVI system is hence configured for conducting an appearance inspection of the article.

Abstract: An adapter for a charging cradle includes: a perimeter wall defining a channel between first and second ends; a first device interface on an inner surface of the perimeter wall in communication with the first end, the first device interface configured to receive and align a first mobile device configuration with the charging cradle; a second device interface on the inner surface of the perimeter wall in communication with the second end, the second device interface configured to receive and align a second mobile device configuration with the charging cradle; a cradle interface on an outer surface of the perimeter wall, and configured to couple the adapter to the charging cradle in one of (i) a first orientation to expose a connector of the charging cradle via the first end of the channel, and (ii) a second orientation to expose the connector via the second end of the channel.

Abstract: A semiconductor die package and a method of forming the same are provided. The semiconductor die package includes a package substrate and a semiconductor device disposed over the package substrate. A ring structure is disposed over the package substrate and laterally surrounds the semiconductor device. The ring structure includes a lower ring portion arranged around the periphery of the package substrate. Multiple notches are formed along the outer periphery of the lower ring portion. The ring structure also includes an upper ring portion integrally formed on the lower ring portion. The upper ring portion laterally extends toward the semiconductor device, so that the inner periphery of the upper ring portion is closer to the semiconductor device than the inner periphery of the lower ring portion. An adhesive layer is interposed between the lower ring portion and the package substrate.

Abstract: A set of tasks is extracted from workflow data of a system. A set of keywords is extracted from a task in the set of tasks. The set of keywords is expanded into an expanded set of keywords, the expanded set of keywords comprising a new keyword with a semantic relationship to a keyword in the set of keywords. A new task is generated using the expanded set of keywords. Based on a result of execution of the new task, a model of the system is adjusted, the model comprising the workflow data, the set of tasks, and the expanded set of keywords.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: The present invention discloses an image processing method. The image processing method includes the following steps: (a), a to-be-processed image is corrected as a first correction image according to a first mapping relationship along a correction direction; (b) the first correction image by an angle is rotated; and (c) the rotated first correction image is corrected as a second correction image according to a second mapping relationship along the same correction direction. In embodiment, given that the to-be-processed image is deformed along two different directions, the to-be-processed image is corrected along the same correction direction, such that correction complexity could be reduced.

Abstract: Disclosed are an order processing method, apparatus and device, and a storage medium. The method comprises: determining a logical partition to which a target order belongs from a plurality of logical partitions as a target logical partition, wherein one logical partition is associated with at least one station and a plurality of inventory containers, and at least one inventory container of a plurality of inventory containers associated with the target logical partition accommodates inventory items required by the target order; allocating the target order to a station associated with the target logical partition, and taking the station as a target station; and controlling a robot to carry a target inventory container, accommodating the inventory items required by the target order, of the plurality of inventory containers associated with the target logical partition to the target station.

Abstract: Disclosed in embodiments of the present application are a linear resistive element and a preparation method therefor. The linear resistive element includes a substrate unit, a function unit and an electrode unit. The substrate unit includes a substrate layer, which is configured to connect the function unit and the electrode unit. The electrode unit includes a first electrode and a second electrode. The first and second electrodes are deposited on the substrate layer, and the function unit is connected between the first and second electrodes. The function unit includes first dielectric layers and resistive layers. The first dielectric layers and the resistive layers are deposited on the substrate layer in an alternately stacked manner. A number of the resistive layers is at least two, and a conductive filament for conductively connecting the first and second electrodes is formed in each of the resistive layers.

Abstract: In one embodiment, a method includes determining, by a first network component, a sender shaper drop value based on the following: a maximum sequence number; a minimum sequence number; and a sender sequence counter number associated with the first network component. The method also includes determining, by the first network component, a wide area network (WAN) link drop value based on the sender sequence counter number associated with the first network component and a receiver sequence counter number associated with a second network component. The method further includes determining, by the first network component, whether to adjust a sender shaper rate based on the sender shaper drop value and the WAN link drop value.

Abstract: An antenna connecting-switching apparatus includes a housing, a first connection structure, a second connection structure, an elastic body, an elastic piece structure and an electronic switch. The elastic piece structure includes a first elastic piece and a second elastic piece. When an external antenna is connected to the first connection structure, the first connection structure compresses the elastic body pushing the first elastic piece; the first elastic piece contacts the second elastic piece; the electronic switch is switched; a wireless communication circuit is electrically connected to the external antenna. When the external antenna stops connected to the first connection structure, the elastic body rebounds pushing the first connection structure; the first connection structure stops pushing the first elastic piece; the first elastic piece stops contacting the second elastic piece; the electronic switch is switched; the wireless communication circuit is electrically connected to an internal antenna.

Abstract: An calibration kit includes a base, a combination of calibration parts, and a manipulation part. The combination of calibration parts is disposed on the base and includes a first calibration part and a second calibration part. The first calibration part has a first calibration surface. The second calibration part has a second calibration surface. The first calibration part and the second calibration part are relatively movable in a movement direction and are movable relative to the base. The manipulation part is movably or rotatably disposed on the base. The manipulation part is configured to be operable to drive the first calibration part and the second calibration part to move in the movement direction relative to the base, so that the combination of calibration parts forms a three-dimensional calibration surface configuration through the first calibration surface and the second calibration surface.

Abstract: Provided are a method for online updating a program of a network power supply, a network power supply and a communication system. The method includes: receiving cipher text of a to-be-updated program sent from a system side, where the cipher text of the to-be-updated program is generated by encrypting a to-be-updated program with a preset key; performing verification, according to a key pre-stored in the network power supply, on the cipher text of the to-be-updated program, to obtain a verification result; and decrypting the cipher text of the to-be-updated program and updating the to-be-updated program according to a decrypted program, if the verification result shows that the verification is passed.

Abstract: The invention discloses a piezoelectric speaker, including a substrate with a cavity therethrough a supporting structure covering the cavity a first drive structure stacked on the supporting structure, including alternately stacked first electrode layers and first piezoelectric layers a transmission structure stacked on the first drive structure, and a separation slot penetrating the supporting structure and the first drive structure to separate the first drive structure into a first piezoelectric driving part and a second piezoelectric driving part. A rigidity of the transmission structure is less than or equal to a rigidity of the first drive structure, and the rigidity of the first drive structure is less than or equal to a rigidity of the supporting structure. Compared with the prior art, the sound pressure level generated at the same moment is higher.

Abstract: The present disclosure provides a method for the treatment or prophylaxis of coronavirus infection, comprising administering a therapeutically effective amount of an immunomodulator to a subject in need thereof or at risk of coronavirus infection. A vaccine composition comprising a pharmaceutically effective amount of an immunomodulator is also provided.

Abstract: A MEMS loudspeaker manufacturing method and a MEMS loudspeaker are provided. The MEMS loudspeaker manufacturing method includes positioning a printed circuit board (PCB) substrate, inverting a MEMS chip and electrically connecting the PCB substrate to a first side of the PCB substrate having a first groove. filling and solidifying a polymer protection material in the gap between the MEMS chip and the PCB substrate, and combining the MEMS chip and the PCB substrate into a combination component. Since the PCB substrate and the MEMS chip are combined into the combination component through using the polymer protection component made of the polymer protection material, and the polymer protection component is coated with the conducting component, an overall packaging size of the MEMS loudspeaker basically is enabled to be consistent with a size of the MEMS chip, and sensitivity parameters of the MEMS loudspeaker may be significantly improved.

Abstract: The present disclosure provides a method for the treatment or prophylaxis of coronavirus infection, comprising administering a therapeutically effective amount of an immunomodulator to a subject in need thereof or at risk of coronavirus infection. A vaccine composition comprising a pharmaceutically effective amount of an immunomodulator is also provided.