Patents by Inventor Yu Shen

Yu Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230044130
    Abstract: A floating connector and an assembly thereof are provided.
    Type: Application
    Filed: August 4, 2022
    Publication date: February 9, 2023
    Applicant: Molex, LLC
    Inventors: Yu SHEN, Feng CHEN
  • Publication number: 20230027774
    Abstract: To automatically evaluate the reasonable price of real estate according to the housing data, the present invention discloses a novel intelligent property evaluation system. The system includes the following components: a housing data input system, a pre-processing filter, a feature extractor, a housing price trainer, and a housing price predictor, wherein the housing price predictor further includes a regression model generator and a decision integrator. The pre-processing filter is used to filter unreasonable samples from housing data and integrate synonymous features. The feature extractor is used to choose required variables of housing price model. The housing price trainer generates housing price model which is trained by a great amount of housing data. The housing price predictor then generates a prediction by the trained model. Furthermore, to maintain the accuracy of prediction under the social evolution, the housing price predictor could be regularly or irregularly updated by a rolling-based method.
    Type: Application
    Filed: July 15, 2022
    Publication date: January 26, 2023
    Inventors: Tien-Hao Chang, Chin-Mei Chiang, Sheng-Wen Huang, Shau-Wei Huang, Po-Yu Shen, Li-Hao Zeng
  • Publication number: 20230013391
    Abstract: A copy of files of a primary storage system are stored at a secondary storage system. The metadata associated with the copy of the files of the primary storage system stored at the secondary storage system are analyzed to determine at least a portion of a hierarchical storage tier management plan for the primary storage system including by identifying one or more files to be migrated from a first tier of storage of the primary storage system to a different storage tier. An implementation of at least a portion of the hierarchical storage tier management plan is initiated.
    Type: Application
    Filed: September 19, 2022
    Publication date: January 19, 2023
    Inventors: Yu-Shen Ng, Nagapramod Mandagere, Karandeep Singh Chawla
  • Patent number: 11552052
    Abstract: A semiconductor device includes a first metal-oxide semiconductor (MOS) transistor on a first substrate, a first interlayer dielectric (ILD) layer on the first MOS transistor, a second substrate on the first ILD layer, and a second MOS transistor on a second substrate. Preferably, the semiconductor device includes a static random access memory (SRAM) and the SRAM includes a first pull-up device, a second pull-up device, a first pull-down device, a second pull-down device, a first pass-gate device, a second pass-gate device, a read port pull-down device, and a read port pass-gate device, in which the read port pull-down device includes the first MOS transistor and the read port pass-gate device includes the second MOS transistor.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: January 10, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yen-Yu Shen, Tsung-Hsun Wu, Liang-Wei Chiu, Shih-Hao Liang
  • Publication number: 20220408547
    Abstract: A method for manufacturing an embedded component structure includes providing a circuit board having a through hole and a heat dissipation layer; disposing a chip in the through hole; forming a dielectric layer on a first surface and a second surface of the circuit board to seal the chip and cover a lower surface of the heat dissipation layer; removing a first part of the dielectric layer to form a first opening from which a upper surface of the heat dissipation layer is exposed and a second opening from which the lower surface of the heat dissipation layer is exposed; and forming a thermal conductive material layer in the first and the second opening to form a heat dissipation element surrounding the chip. The upper surface of the heat dissipation layer is exposed from the through hole. The chip, the circuit board, and the heat dissipation element are electrically connected.
    Type: Application
    Filed: August 25, 2022
    Publication date: December 22, 2022
    Applicant: Unimicron Technology Corp.
    Inventor: Yu-Shen Chen
  • Patent number: 11531712
    Abstract: Metadata associated with content stored in a corresponding primary storage system is received receiving from each secondary storage cluster of a plurality of different secondary storage clusters included in different storage domains. The metadata received from the plurality of different secondary storage clusters is stored and indexed together. A unified metadata search interface is provided for stored data of the corresponding primary storage systems and the plurality of different secondary storage clusters of the different storage domains.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: December 20, 2022
    Assignee: Cohesity, Inc.
    Inventors: Anubhav Gupta, Subramanian Sethumadhavan, Naga Venkata Sai Indubhaskar Jupudi, Jeffrey Howard, Manvendra Tomar, Yu-Shen Ng
  • Patent number: 11523505
    Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: December 6, 2022
    Assignee: Unimicron Technology Corp.
    Inventors: Yu-Shen Chen, I-Ta Tsai, Chien-Chih Chen
  • Publication number: 20220382654
    Abstract: A request to restore a plurality of files to a first storage system from a backup stored at a second storage system is received. Corresponding file relocation metadata for each of the plurality of files is provided to the first storage system. The corresponding file relocation metadata for each of the plurality of files enables accessibility of contents of the plurality of files at the first storage system without storing entire contents of the plurality of files at the first storage system. A corresponding full content version for at least one of the plurality of files that is to be utilized by the first storage system is provided to enable direct access at the first storage system to contents of the at least one of the plurality of files instead of utilizing corresponding file relocation metadata for the at least one of the plurality of files to access the contents of the at least one of the plurality of files.
    Type: Application
    Filed: June 14, 2022
    Publication date: December 1, 2022
    Inventors: Nagapramod Mandagere, Yu-Shen Ng, Karandeep Singh Chawla
  • Publication number: 20220366161
    Abstract: A device detecting system is provided. The device detecting system includes a bar code scanner, a plurality of device accommodating spaces, a screen, and a server. The server obtains bar code information via the bar code scanner and opens one of the device accommodating spaces based on the bar code information to accommodate an electronic device. The server performs a test procedure on the electronic device to generate a test result, and displays the test result and operation information corresponding to the test result on the screen.
    Type: Application
    Filed: May 5, 2022
    Publication date: November 17, 2022
    Inventors: Chien-Chih CHANG, Pei-Yin CHEN, Wei-Han LIN, Bo-Rong CHU, Yen-Ting LIU, Yu-Shen MAI, Kuan-Yu HSIAO, Chia-Hsien LIN, Pei-Yu LIAO, Chun-Yen LAI, Sheng-Yi CHEN
  • Patent number: 11500018
    Abstract: Circuits, methods, and systems are provided which facilitate testing of asynchronous circuits having one or more global or local feedback loops. A circuit includes a data path and a scan path. The data path has an input configured to receive a data input signal, and a first output. The scan path includes a first multiplexer having a first input configured to receive the data input signal, a latch coupled to an output of the first multiplexer, a scan isolator coupled to an output of the latch, and a second multiplexer having a first input coupled to the first output of the data path and a second input coupled to an output of the scan isolator. The second multiplexer is configured to output a data output signal.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: November 15, 2022
    Assignees: Taiwan Semiconductor Manufacturing Co., Ltd., National Taiwan University
    Inventors: Ting-Yu Shen, Chien-Mo Li
  • Patent number: 11494105
    Abstract: A copy of files of a primary storage system are stored at a secondary storage system. The metadata associated with the copy of the files of the primary storage system stored at the secondary storage system are analyzed to determine at least a portion of a hierarchical storage tier management plan for the primary storage system including by identifying one or more files to be migrated from a first tier of storage of the primary storage system to a different storage tier. An implementation of at least a portion of the hierarchical storage tier management plan is initiated.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: November 8, 2022
    Assignee: Cohesity, Inc.
    Inventors: Yu-Shen Ng, Nagapramod Mandagere, Karandeep Singh Chawla
  • Publication number: 20220342122
    Abstract: An optical material for making an optical product is provided. The optical material includes a light-resistant material undergone surface modification by titanium dioxide, so that the optical product is at least resistant to light having a wavelength between 280 nm and 380 nm. The optical product and a manufacturing method thereof are also provided.
    Type: Application
    Filed: July 4, 2021
    Publication date: October 27, 2022
    Applicant: Tianchen Innovative Materials Technology Co., Ltd
    Inventors: Yu-Shen Mai, Kuan-Lin Ku, Ko-Sen Lee, Tzu-Chu Wangwong
  • Patent number: 11467223
    Abstract: A device for simulating intermittent arc grounding faults in a power distribution network includes a sliding rail, a first and a second support frames, an insulated electrode disk, and an electrode disk motor. The first support frame is fixed on the left side of the slide rail, and the position of the second support frame relative to the first support frame can be adjusted through the sliding rail. The second support frame is provided with an electrode disk motor for driving the insulated electrode disk to rotate. An upper and a lower conductive bars are installed on the first support frame, their adjacent ends provided with an upper and a lower arc-shaped conductor sheets, and the insulated electrode disk having two circles of conductive pillars is located between the conductor sheets. The conductor sheets are respectively installed on the side of the conductive bars close to the conductive pillar.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: October 11, 2022
    Assignee: State Grid Hubei Electric Power Research Institute
    Inventors: Fan Yang, Yu Shen, Wanting Deng, Zhichun Yang, Yang Lei, Yao Yao, Lei Su, Wei Hu, Wei Jiang, Zeyang Tang, Fangbin Yan
  • Patent number: 11470715
    Abstract: An embedded component structure includes a circuit board, a chip, and a heat dissipation element. The chip is embedded in the circuit board. The heat dissipation element surrounds the chip. The chip, the circuit board, and the heat dissipation element are electrically connected. The heat dissipation element includes a first part, a second part, and a third part located between the first part and the second part. The first part is in direct contact with a side wall of the chip. The second part is a ground terminal. A method for manufacturing an embedded component structure is also provided.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: October 11, 2022
    Assignee: Unimicron Technology Corp.
    Inventor: Yu-Shen Chen
  • Patent number: 11451066
    Abstract: Provided are a control method and a device for active power of a wind power plant cluster. The wind power plant cluster includes wind power plants of m priorities, wherein m is a positive integer. The control method includes: monitoring the consumption capability of a power grid in real time, and determining object active power of the wind power plant cluster according to the consumption capability of the power grid; determining a command active power of the wind power plant within each priority according to the object active power of the wind power plant cluster in a descending order of the priorities; and controlling real active power of the wind power plant within each priority according to the command active power.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: September 20, 2022
    Inventors: Jingran Wang, Bingxu Zhai, Rongfu Sun, Haibo Lan, Ruoyang Wang, Ran Ding, Haixiang Xu, Zhifeng Liang, Tao Lun, Zongxiang Lu, Chen Xu, Li Shu, Yu Shen, Xiaobo Wu
  • Publication number: 20220289555
    Abstract: A stuffing structure, including a stuffing substrate and a carbon layer, is provided. The carbon layer is directly attached to a surface of the stuffing substrate. The carbon layer exhibits an irregular shape, and the carbon layer is configured to radiate infrared. A manufacturing method of the stuffing structure is also provided.
    Type: Application
    Filed: September 7, 2021
    Publication date: September 15, 2022
    Applicant: Tianchen Innovative Materials Technology Co., Ltd
    Inventors: Yu-Shen Mai, Kuan-Lin Ku, Ko-Sen Lee
  • Patent number: 11431936
    Abstract: A readout circuit for use in an image sensor includes a plurality of comparators. Each one of the plurality of comparators is coupled to receive a ramp signal and a respective analog image data signal from a respective one of a plurality of column bit lines to generate a respective comparator output. Each one of a plurality of arithmetic logic units (ALUs) is coupled to receive phase-aligned Gray code (GC) outputs generated by a GC generator. Each one of the plurality of ALUs is further coupled to a respective one of the plurality of comparators to receive the respective comparator output. Each one of the plurality of ALUs is coupled to latch the phase-aligned GC outputs in response to the respective comparator output to generate a respective digital image data signal.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: August 30, 2022
    Assignee: OmniVision Technologies, Inc.
    Inventors: Lihang Fan, Min Qu, Yu-Shen Yang, Charles Qingle Wu
  • Patent number: 11422727
    Abstract: A request to restore a plurality of files to a first storage system from a backup stored at a second storage system is received. Corresponding file relocation metadata for each of the plurality of files is provided to the first storage system. The corresponding file relocation metadata for each of the plurality of files enables accessibility of contents of the plurality of files at the first storage system without storing entire contents of the plurality of files at the first storage system. A corresponding full content version for at least one of the plurality of files that is to be utilized by the first storage system is provided to enable direct access at the first storage system to contents of the at least one of the plurality of files instead of utilizing corresponding file relocation metadata for the at least one of the plurality of files to access the contents of the at least one of the plurality of files.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: August 23, 2022
    Assignee: Cohesity, Inc.
    Inventors: Nagapramod Mandagere, Yu-Shen Ng, Karandeep Singh Chawla
  • Publication number: 20220263842
    Abstract: Systems and methods for detecting intrusions, attacks, and sub-attacks launched against a network under observations are provided. A method, according to one implementation, includes obtaining network traffic information regarding data traffic in a network under observation and obtaining system log information regarding operations of the network under observation. The method further includes the step of inserting the network traffic information and system log information into one or more analysis procedures, where each analysis procedure is configured to detect a respective sub-attack of a multi-stage attack to which the network under observation is susceptible. Also, the method includes the step of combining the outputs of the one or more analysis procedures to detect whether one or more sub-attacks have been launched against the network under observation.
    Type: Application
    Filed: January 7, 2022
    Publication date: August 18, 2022
    Inventors: Zhiyan Chen, Murat Simsek, Burak Kantarci, Petar Djukic, James P'ford't Carnes, III, Mehran Bagheri, Jinxin Liu, Yu Shen
  • Patent number: D971708
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: December 6, 2022
    Assignee: SUNDOVE INDUSTRIAL CO., LTD.
    Inventor: Yu-Shen Hsu