Patents by Inventor Yu Shen

Yu Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12051038
    Abstract: Disclosed are an order processing method, apparatus and device, and a storage medium. The method comprises: determining a logical partition to which a target order belongs from a plurality of logical partitions as a target logical partition, wherein one logical partition is associated with at least one station and a plurality of inventory containers, and at least one inventory container of a plurality of inventory containers associated with the target logical partition accommodates inventory items required by the target order; allocating the target order to a station associated with the target logical partition, and taking the station as a target station; and controlling a robot to carry a target inventory container, accommodating the inventory items required by the target order, of the plurality of inventory containers associated with the target logical partition to the target station.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: July 30, 2024
    Assignee: BEIJING GEEKPLUS TECHNOLOGY CO., LTD.
    Inventors: Hao Han, Wei Chen, Kai Sun, Yu Wang, Mo Shen
  • Publication number: 20240251686
    Abstract: Disclosed in embodiments of the present application are a linear resistive element and a preparation method therefor. The linear resistive element includes a substrate unit, a function unit and an electrode unit. The substrate unit includes a substrate layer, which is configured to connect the function unit and the electrode unit. The electrode unit includes a first electrode and a second electrode. The first and second electrodes are deposited on the substrate layer, and the function unit is connected between the first and second electrodes. The function unit includes first dielectric layers and resistive layers. The first dielectric layers and the resistive layers are deposited on the substrate layer in an alternately stacked manner. A number of the resistive layers is at least two, and a conductive filament for conductively connecting the first and second electrodes is formed in each of the resistive layers.
    Type: Application
    Filed: January 30, 2024
    Publication date: July 25, 2024
    Applicant: XIAMEN INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
    Inventors: SZU-CHUN KANG, Tingying SHEN, Lijun SHAN, Taiwei CHIU, Yu LIU, Yajun ZHANG
  • Publication number: 20240250909
    Abstract: In one embodiment, a method includes determining, by a first network component, a sender shaper drop value based on the following: a maximum sequence number; a minimum sequence number; and a sender sequence counter number associated with the first network component. The method also includes determining, by the first network component, a wide area network (WAN) link drop value based on the sender sequence counter number associated with the first network component and a receiver sequence counter number associated with a second network component. The method further includes determining, by the first network component, whether to adjust a sender shaper rate based on the sender shaper drop value and the WAN link drop value.
    Type: Application
    Filed: April 4, 2024
    Publication date: July 25, 2024
    Inventors: Hongbo Xia, Xiaorong Wang, Yu Zhang, Changhong Shen
  • Patent number: 12046811
    Abstract: An antenna connecting-switching apparatus includes a housing, a first connection structure, a second connection structure, an elastic body, an elastic piece structure and an electronic switch. The elastic piece structure includes a first elastic piece and a second elastic piece. When an external antenna is connected to the first connection structure, the first connection structure compresses the elastic body pushing the first elastic piece; the first elastic piece contacts the second elastic piece; the electronic switch is switched; a wireless communication circuit is electrically connected to the external antenna. When the external antenna stops connected to the first connection structure, the elastic body rebounds pushing the first connection structure; the first connection structure stops pushing the first elastic piece; the first elastic piece stops contacting the second elastic piece; the electronic switch is switched; the wireless communication circuit is electrically connected to an internal antenna.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: July 23, 2024
    Assignee: GRAND-TEK TECHNOLOGY CO., LTD.
    Inventors: Kung-Yu Shen, Chien-Wen Hung
  • Patent number: 12044844
    Abstract: An calibration kit includes a base, a combination of calibration parts, and a manipulation part. The combination of calibration parts is disposed on the base and includes a first calibration part and a second calibration part. The first calibration part has a first calibration surface. The second calibration part has a second calibration surface. The first calibration part and the second calibration part are relatively movable in a movement direction and are movable relative to the base. The manipulation part is movably or rotatably disposed on the base. The manipulation part is configured to be operable to drive the first calibration part and the second calibration part to move in the movement direction relative to the base, so that the combination of calibration parts forms a three-dimensional calibration surface configuration through the first calibration surface and the second calibration surface.
    Type: Grant
    Filed: September 6, 2021
    Date of Patent: July 23, 2024
    Assignee: Qisda Corporation
    Inventors: Tzu-Huan Hsu, Po-Fu Wu, Yuan-Yu Hsiao, Ching-Huey Wang, Chih-Kang Peng, Chun-Ming Shen, Chih-Ming Hu, Yi-Ling Lo
  • Publication number: 20240231800
    Abstract: Provided are a method for online updating a program of a network power supply, a network power supply and a communication system. The method includes: receiving cipher text of a to-be-updated program sent from a system side, where the cipher text of the to-be-updated program is generated by encrypting a to-be-updated program with a preset key; performing verification, according to a key pre-stored in the network power supply, on the cipher text of the to-be-updated program, to obtain a verification result; and decrypting the cipher text of the to-be-updated program and updating the to-be-updated program according to a decrypted program, if the verification result shows that the verification is passed.
    Type: Application
    Filed: September 18, 2023
    Publication date: July 11, 2024
    Inventors: Yu SHEN, Jian ZHOU, Hui HUANG
  • Patent number: 12015896
    Abstract: The invention discloses a piezoelectric speaker, including a substrate with a cavity therethrough a supporting structure covering the cavity a first drive structure stacked on the supporting structure, including alternately stacked first electrode layers and first piezoelectric layers a transmission structure stacked on the first drive structure, and a separation slot penetrating the supporting structure and the first drive structure to separate the first drive structure into a first piezoelectric driving part and a second piezoelectric driving part. A rigidity of the transmission structure is less than or equal to a rigidity of the first drive structure, and the rigidity of the first drive structure is less than or equal to a rigidity of the supporting structure. Compared with the prior art, the sound pressure level generated at the same moment is higher.
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: June 18, 2024
    Assignee: AAC KAITAI TECHNOLOGIES (WUHAN) CO., LTD
    Inventors: Yu Shen, Qiang Dan, Yiwei Zhou, Shiyang Cheng, Yang Li
  • Publication number: 20240189419
    Abstract: The present disclosure provides a method for the treatment or prophylaxis of coronavirus infection, comprising administering a therapeutically effective amount of an immunomodulator to a subject in need thereof or at risk of coronavirus infection. A vaccine composition comprising a pharmaceutically effective amount of an immunomodulator is also provided.
    Type: Application
    Filed: February 21, 2024
    Publication date: June 13, 2024
    Inventors: YU-SHEN HSU, SSU-WEI KANG, MING-I CHANG
  • Publication number: 20240174513
    Abstract: A MEMS loudspeaker manufacturing method and a MEMS loudspeaker are provided. The MEMS loudspeaker manufacturing method includes positioning a printed circuit board (PCB) substrate, inverting a MEMS chip and electrically connecting the PCB substrate to a first side of the PCB substrate having a first groove. filling and solidifying a polymer protection material in the gap between the MEMS chip and the PCB substrate, and combining the MEMS chip and the PCB substrate into a combination component. Since the PCB substrate and the MEMS chip are combined into the combination component through using the polymer protection component made of the polymer protection material, and the polymer protection component is coated with the conducting component, an overall packaging size of the MEMS loudspeaker basically is enabled to be consistent with a size of the MEMS chip, and sensitivity parameters of the MEMS loudspeaker may be significantly improved.
    Type: Application
    Filed: August 23, 2023
    Publication date: May 30, 2024
    Inventors: Qiang Dan, Rui Cai, Yiwei Zhou, Yu Shen, Yang Li
  • Patent number: 11986520
    Abstract: The present disclosure provides a method for the treatment or prophylaxis of coronavirus infection, comprising administering a therapeutically effective amount of an immunomodulator to a subject in need thereof or at risk of coronavirus infection. A vaccine composition comprising a pharmaceutically effective amount of an immunomodulator is also provided.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: May 21, 2024
    Assignee: ADVAGENE BIOPHARMA CO., LTD.
    Inventors: Yu-Shen Hsu, Ssu-Wei Kang, Ming-I Chang
  • Patent number: 11968507
    Abstract: One of the main objects of the present invention is to provide a speaker with optimized overall acoustic performance. To achieve the above-mentioned object, the present invention provides a speaker including: a base with an accommodation cavity; a vibration sounding assembly accommodated in the accommodation cavity, including a first diaphragm and a second diaphragm, and a driver fixed to the first diaphragm for driving the first diaphragm and the second diaphragm to vibrate and produce sound. The second diaphragm stacks on the first diaphragm, and a stiffness of the second diaphragm is different from a stiffness of the first diaphragm.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: April 23, 2024
    Assignee: AAC Kaital Technologies (Wuhan) CO., LTD
    Inventors: Shiyang Cheng, Qiang Dan, Yiwei Zhou, Yu Shen, Yang Li
  • Publication number: 20240121538
    Abstract: An embodiment of the present disclosure provides an earphone, which includes a housing with a cavity, a first speaker housed in the cavity for producing low-frequency sounds, a second speaker, and a sound damping mesh for producing mid to high frequency sounds. The housing includes a sound outlet penetrating therethrough, and the cavity is connected with the outside through the sound outlet. The second speaker is fixed to the sound damping mesh. The sound damping mesh completely separates the first speaker from the second speaker. The low-frequency sound emitted by the first speaker is to transmitted to the sound outlet through the sound damping mesh. Compared with the related art, the acoustic performance of the earphone of the present disclosure is good.
    Type: Application
    Filed: April 21, 2023
    Publication date: April 11, 2024
    Inventors: Yu Shen, Yiwei Zhou, Qiang Dan, Yang Li
  • Publication number: 20240114795
    Abstract: The present invention provides a micro electromechanical system (MEMS), which includes: a base with a cavity, a vibration structure includes a structural layer, a piezoelectric composite layer and a flexible layer; the structural layer includes a structural slab, a structural fixing portion and a plurality of structural springs; the piezoelectric composite layer includes a piezoelectric film, a first electrode layer and a second electrode layer; the stress of the piezoelectric composite layer can be released through the elastic actions of the structural springs. In addition, the rigidity of the overall structure is ensured and will not be too low. Therefore, the sound pressure level of the MEMS piezoelectric loudspeaker is improved, and the THD is reduced to improve the performance of the MEMS piezoelectric loudspeaker.
    Type: Application
    Filed: January 4, 2023
    Publication date: April 4, 2024
    Inventors: Yu Shen, Qiang Dan, Yiwei Zhou, Yang Li
  • Patent number: 11950070
    Abstract: A sound production device includes a substrate having a cavity and a plurality of cantilever diaphragms fixed on the substrate. Each of the plurality of the cantilever diaphragms includes a fixed end fixed on the substrate and a free end extending from the fixed end to a position suspended above the cavity. The free end includes a first surface and a second surface oppositely arranged. The free end and the substrate or other free ends are spaced to form a gap. The sound production device further includes a first dielectric elastomer actuator, a second dielectric elastomer actuator, and a flexible connector. The sound production device of the present disclosures adopts dielectric elastomer actuators on both of the upper and lower sides of the cantilever diaphragms to together act on the cantilever diaphragms, thereby improving the linearity of the sound production device.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: April 2, 2024
    Assignee: AAC KAITAI TECHNOLOGIES (WUHAN) CO., LTD
    Inventors: Qiang Dan, Yu Shen, Shiyang Cheng, Yiwei Zhou, Yang Li
  • Publication number: 20240105661
    Abstract: The present disclosure provides a circuit board with an embedded chip, which includes a dielectric layer, a first circuit layer, a chip, a conductive connector, and an insulating protection layer. The first circuit layer includes at least one first trace in the dielectric layer. The chip is in the dielectric layer and adjacent to the first trace, where the chip includes a plurality of chip pads at an upper surface of the chip. The conductive connector is on the upper surface of the chip and on the first circuit layer, where a lower surface of the conductive connector contacts at least one chip pad of the chip pads and an upper surface of the first trace. The insulating protection layer is on the chip, the first circuit layer, and the conductive connector, where the insulating protection layer contacts the upper surface of the chip.
    Type: Application
    Filed: November 8, 2022
    Publication date: March 28, 2024
    Inventors: Yu-Shen CHEN, I-Ta TSAI
  • Publication number: 20240086209
    Abstract: A computerized method of transforming an interactive graphical user interface according to machine learning includes generating a user interface element corresponding to a persona. In response to user interaction with the user interface element, data structures related to the persona are extracted from a first data store. The data structures are transformed into a set of input variables. The method includes generating a first output variable based on the set of input variables. A second output variable based on the first input variable is generated by: generating a set of intermediate output variables, determining a first intermediate output variable of the set of intermediate output variables, and determining a second intermediate output variable based on a machine learning model corresponding to the first intermediate output variable. In response to the second output variable exceeding a first threshold, the graphical user interface displays a first message.
    Type: Application
    Filed: November 9, 2023
    Publication date: March 14, 2024
    Inventor: Yu Shen Lin
  • Publication number: 20240064901
    Abstract: This disclosure provides a circuit board assembly and a manufacturing method thereof. The circuit board assembly includes circuit board, embedded chip, heat dissipation assembly and temperature switch structure. The temperature switch structure includes a first metal layer and a second metal layer stacked on each other. The first metal layer of the temperature switch structure is electrically connected to the circuit board and is thermally coupled to the embedded chip. A thermal expansion coefficient of the first metal layer is different from a thermal expansion coefficient of the second metal layer so that the temperature switch structure is deformed in response to a temperature change of the embedded chip to be in contact with or spaced apart from the second electrically conductive contact of the heat dissipation assembly.
    Type: Application
    Filed: October 19, 2022
    Publication date: February 22, 2024
    Applicant: UNIMICRON TECHNOLOGY CORP.
    Inventor: Yu-Shen CHEN
  • Patent number: D1016923
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: March 5, 2024
    Assignee: SHENZHEN RIDETECH ELECTRONICS CO., LTD
    Inventor: Yu Shen
  • Patent number: D1017715
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: March 12, 2024
    Assignee: SHENZHEN RIDETECH ELECTRONICS CO., LTD
    Inventor: Yu Shen
  • Patent number: D1027627
    Type: Grant
    Filed: March 8, 2022
    Date of Patent: May 21, 2024
    Assignee: Graco Minnesota Inc.
    Inventors: Guang Chen, Michael A. Cryer, Yu Shen