Abstract: The disclosure provides a buffer bracket, which comprises a base, a moving part, an elastic buffer and a positioning pin. The base is provided with a group of holes, which comprises a plurality of positioning holes arranged in sequence along the first direction. The moving part is movably fitted to the base along the first direction. The elastic buffer is elastically compressed between the base and the moving part. The locating pin is installed on the moving part. When the moving part moves forward in the first direction relative to the base under external force, the positioning pin is restricted to a certain positioning hole. The beneficial effect of the disclosure is that it can absorb impact energy and avoid rebound.

Abstract: An information handling system includes a host processing system and a Liquid Crystal Display device. The host processing system includes a graphics processing unit (GPU) and the LCD device includes a memory device and a DisplayPort Configuration Data (DPCD) register. The host processing system 1) determines whether the first GPU supports a Dynamic Display Shifting (DDS) mode, 2) when the GPU does not support the DDS mode, provides a first indication to the LCD device that the GPU does not support the DDS mode, and 3) when the GPU supports the DDS mode, provides a second indication to the LCD device that the GPU supports the DDS mode. The LCD device retrieves a Panel Self Refresh (PSR) setting from the memory device and stores the PSR setting to the DPCD register in response to the first indication, and retrieves a DDS setting from the memory and stores the DDS setting to the DPCD register in response to the second indication.

Abstract: A rocking arm structure includes an arm body, a first wheel assembly connected to the arm body, a second wheel assembly connected to the arm body, and a shaft assembly disposed between the first wheel assembly and the second wheel assembly. The arm body can rotate relative to the main body around the shaft assembly, and drive the first wheel assembly and the second wheel assembly to revolve in a same direction around the shaft assembly. The first wheel assembly and the second wheel assembly are both steering wheel assemblies or both directional wheel assemblies.

Abstract: A lifting structure operating precisely and stably at all stages of a lifting and lowering action includes a lifting assembly and a driving assembly. The lifting assembly includes two first links, two second links, and two seats. A first connecting arm of each first link has first and second ends, the first end having a first gear structure. A second connecting arm of each second link has third and fourth ends, a second and complementary gear structure being provided on the third end. The first gear structures are engaged and the second gear structures are engaged. The second end is rotatably connected to the fourth end through one of the two seats. The driving assembly can drive the two seats towards each other to perform lifting or drive them away from each other to perform lowering.

Abstract: The disclosure provides a limit device and a robot using the same. The limit device comprises a first connecting member, a transmission rod and a second connecting member. The first connecting member comprising a first main body portion and two first connecting elements. The two first connecting elements are arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod comprising a first end and a second end. The first end and the second end are arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member provided with two indexing buckles. The two indexing buckles are arranged at intervals, each of the indexing buckles comprises a first limiting groove and a second limiting groove.

Abstract: A structure for holding a battery on an automated guided vehicle (AGV) so as to allow easy and convenient battery replacement includes two fixed supports and a bracket. The bracket is connected between the two supports and each support defines a vertical groove and two horizontal grooves. Two sliders at the ends of the bracket are insertable into either horizontal groove. The two sliders can move down along the vertical groove together until the bracket makes contact with the battery and holds it in place. The two sliders can move up along the vertical groove and sideways into the horizontal grooves, thereby unlatching and releasing the battery for rapid replacement. An AGV using the structure is also disclosed.

Abstract: A semiconductor device package includes an electronic component, an electrical contact and a reinforcement layer. The electronic component has a first conductive layer on a first surface of the electronic component. The electronic component has a through-silicon-via (TSV) penetrating the electronic component and electrically connected to the first conductive layer. The electrical contact is disposed on the first surface of the electronic component and electrically connected to the first conductive layer. The reinforcement layer is disposed on the first surface of the electronic component.

Abstract: A semiconductor device package includes an electronic component, an electrical contact and a reinforcement layer. The electronic component has a first conductive layer on a first surface of the electronic component. The electronic component has a through-silicon-via (TSV) penetrating the electronic component and electrically connected to the first conductive layer. The electrical contact is disposed on the first surface of the electronic component and electrically connected to the first conductive layer. The reinforcement layer is disposed on the first surface of the electronic component.

Abstract: A device for transferring liquids and liquid samples in certain quantities includes a pressing unit and a liquid extraction assembly. The pressing unit includes a first housing and a second housing. The first housing includes a first sidewall, a first top wall, and an extrusion portion. The second housing includes a second sidewall, a second top wall, and a receiving cavity. The first housing is received in the receiving cavity. The liquid extraction assembly includes a liquid extraction pipe, a liquid extraction head, and a first connecting portion. The first housing is configured to move back and forth along the receiving cavity to drive the extrusion portion to compress and deform the liquid extraction pipe. The liquid extraction assembly is detachably installed in pressing unit and is replaceable and suitable for single-use situations.

Abstract: A device for transferring liquids and liquid samples in certain quantities includes a first housing, a second housing, and a liquid extraction assembly. The first housing includes a first sidewall, a first top wall, an extrusion portion, and a first receiving cavity. The extrusion portion is disposed in the first receiving cavity. The second housing includes a second sidewall, a second top wall, and a second receiving cavity. The first housing is received in the second receiving cavity. The liquid extraction assembly includes a liquid extraction pipe and a liquid extraction head. By thumb or finger pressure, the first housing can be moved into the second receiving cavity to compress the extrusion portion to cause release of a sample, or released to gather a sample.

Abstract: A semiconductor device package includes an electronic component, an electrical contact and a reinforcement layer. The electronic component has a first conductive layer on a first surface of the electronic component. The electronic component has a through-silicon-via (TSV) penetrating the electronic component and electrically connected to the first conductive layer. The electrical contact is disposed on the first surface of the electronic component and electrically connected to the first conductive layer. The reinforcement layer is disposed on the first surface of the electronic component.

Abstract: A method includes forming a spacer layer on a top surface and sidewalls of a patterned feature, wherein the patterned feature is overlying a base layer. A protection layer is formed to contact a top surface and a sidewall surface of the spacer layer. The horizontal portions of the protection layer are removed, wherein vertical portions of the protect layer remain after the removal. The spacer layer is etched to remove horizontal portions of the spacer layer, wherein vertical portions of the spacer layer remain to form parts of spacers.

Abstract: A method for manufacturing a middle frame assembly for a mobile phone manufactures a middle frame by sheet metal machining processes, forms an antenna on the middle frame by injection-molding processes, and forms an outer frame as a coating on an edge of the middle frame by the other injection-molding processes. The disclosure further provides a middle frame assembly and an electronic device. The method is simple and low in processing cost.

Abstract: A method includes forming a spacer layer on a top surface and sidewalls of a patterned feature, wherein the patterned feature is overlying a base layer. A protection layer is formed to contact a top surface and a sidewall surface of the spacer layer. The horizontal portions of the protection layer are removed, wherein vertical portions of the protect layer remain after the removal. The spacer layer is etched to remove horizontal portions of the spacer layer, wherein vertical portions of the spacer layer remain to form parts of spacers.

Abstract: A method includes forming a spacer layer on a top surface and sidewalls of a patterned feature, wherein the patterned feature is overlying a base layer, A protection layer is formed to contact a top surface and a sidewall surface of the spacer layer. The horizontal portions of the protection layer are removed, wherein vertical portions of the protect layer remain after the removal. The spacer layer is etched to remove horizontal portions of the spacer layer, wherein vertical portions of the spacer layer remain to form parts of spacers.

Abstract: Systems and methods are provided that may be implemented to electronically link together and cool multiple graphics boards (also known as graphics cards) within an information handling system chassis, such as notebook computer chassis. The multiple graphics boards may be positioned at different levels relative to each other, and may be mounted separate from the main board (e.g., motherboard) in order to achieve a reduced total projective printed circuit board (PCB) area for the combination of the multiple graphics boards and main board. The multiple graphics boards may be stacked on opposite sides of the same thermal cooling module to allow a common thermal cooling module to simultaneously cool a GPU of each of the multiple linked graphics boards, as well as one or more other processors (e.g., central processing units and/or chipsets) mounted to the main board of the system.

Abstract: Systems and methods are provided that may be implemented to electronically link together and cool multiple graphics boards (also known as graphics cards) within an information handling system chassis, such as notebook computer chassis. The multiple graphics boards may be positioned at different levels relative to each other, and may be mounted separate from the main board (e.g., motherboard) in order to achieve a reduced total projective printed circuit board (PCB) area for the combination of the multiple graphics boards and main board. The multiple graphics boards may be stacked on opposite sides of the same thermal cooling module to allow a common thermal cooling module to simultaneously cool a GPU of each of the multiple linked graphics boards, as well as one or more other processors (e.g., central processing units and/or chipsets) mounted to the main board of the system.

Abstract: Provided is a method for manufacturing an optical lens with a frosted interface. The frosted interface is formed by laser marking between an optically effective portion and an outer portion on the optical lens. The frosted interface may resist a stray light emitted from the outer portion. This prevents the stray light from penetrating into the optically effective portion and affecting the imaging. Furthermore, also provided is a positioning structure around the optical lens. The positioning structure can help to align the optical lens and a laser instrument. Then the frosted interface can be manufactured between the optically effective portion and the outer portion accurately by the above positioning structure. The frosted interface within the optical lens enhances the imaging quality.

Abstract: A method embodiment for patterning a semiconductor device includes patterning a dummy layer over a hard mask to form one or more dummy lines. A sidewall aligned spacer is conformably formed over the one or more dummy lines and the hard mask. A first reverse material layer is formed over the sidewall aligned spacer. A first photoresist is formed and patterned over the first reverse material layer. The first reverse material layer using the first photoresist as a mask, wherein the sidewall aligned spacer is not etched. The one or more dummy lines are removed, and the hard mask is patterned using the sidewall aligned spacer and the first reverse material layer as a mask. A material used for forming the sidewall aligned spacer has a higher selectivity than a material used for forming the first reverse material layer.

Abstract: A molding apparatus is provided, including a mold, a measurement device configured for sensing a state of the mold, and a calibration device electrically connected to the measurement device and configured for determining a state of a sensing function of the measurement device. Therefore, the problem that the measurement device is too old to accurately sense the state of the mold is solved.