Patents by Inventor Yu-Sheng Lin

Yu-Sheng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240191040
    Abstract: Synthetic amino acid-modified polymers and methods of making the same and using the same are disclosed. The synthetic amino acid-modified polymers possess distinct thermosensitive, improved water-erosion resistant, and enhanced mechanical properties, and are suitable of reducing or preventing formation of postoperative tissue adhesions. Additionally, the amino acid-modified polymers can also be used as a vector to deliver pharmaceutically active agents.
    Type: Application
    Filed: February 21, 2024
    Publication date: June 13, 2024
    Applicant: PROVIEW-MBD BIOTECH CO., LTD.
    Inventors: Yu-Chia CHANG, Yunn-Kuen CHANG, Wen-Yen HUANG, Ging-Ho HSIUE, Hsieh-Chih TSAI, Shuian-Yin LIN, Nai-Sheng HSU, Tzu-Yu LIN
  • Patent number: 12010928
    Abstract: A memory cell includes a bottom electrode, a storage element layer, a first buffer layer, and a top electrode. The storage element layer is disposed over the bottom electrode. The first buffer layer is interposed between the storage element layer and the bottom electrode, where a thermal conductivity of the first buffer layer is less than a thermal conductivity of the storage element layer. The top electrode is disposed over the storage element layer, where the storage element layer is disposed between the top electrode and the first buffer layer.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: June 11, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chao Lin, Yu-Sheng Chen, Carlos H. Diaz, Da-Ching Chiou
  • Patent number: 12010456
    Abstract: A frame interpolation method for generating a third image frame interpolated between a first image frame and a second image frame includes: performing motion estimation upon a first input image frame and a second input image frame, to obtain a single-directional motion, wherein the first input image frame is derived from the first image frame, and the second input image frame is derived from the second image frame; scaling the single-directional motion according to a time point of the third image frame, to generate a scaled motion; deriving a forward-warped result from a result of performing a forward warping operation and a first inverse operation upon the scaled motion; performing a second inverse operation upon the forward-warped result, to generate an inversed result; and generating the third image frame according to the first image frame, the second image frame, the forward-warped result, and the inversed result.
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: June 11, 2024
    Assignee: MEDIATEK INC.
    Inventors: Yao-Sheng Wang, Pei-Kuei Tsung, Chia-Ni Lu, Yu-Sheng Lin, Chien-Yu Huang, Chih-Wen Goo, Cheng-Lung Jen
  • Patent number: 12009278
    Abstract: Provided is a package structure including a substrate, a stiffener ring, an eccentric die, a lid layer, and a buffer layer. The stiffener ring is disposed on the substrate. The stiffener ring has an inner perimeter to enclose an accommodation area. The eccentric die is disposed within the accommodation area on the substrate. The eccentric die is offset from a center of the accommodation area to close to a first side of the stiffener ring. The lid layer is disposed on the stiffener ring and overlays the eccentric die. The buffer layer is embedded in the lid layer between the first side of the stiffener ring and the eccentric die. The buffer layer has a thickness less than a thickness of the lid layer.
    Type: Grant
    Filed: November 10, 2022
    Date of Patent: June 11, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shu-Shen Yeh, Yu-Sheng Lin, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng
  • Patent number: 12009276
    Abstract: A semiconductor package including a lid having one or more heat pipes located on and/or within the lid to provide improved thermal management. A lid for a semiconductor package having one or more heat pipes thermally integrated with the lid may provide more uniform heat loss from the semiconductor package, reduce the risk of damage to the package due to excessive heat accumulation, and may enable the lid to be fabricated using less expensive materials, thereby reducing the costs of a semiconductor package.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: June 11, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng
  • Publication number: 20240186417
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes first nanostructures and second nanostructures formed over a substrate, and a first gate structure formed over the first nanostructures. The semiconductor device structure includes a second gate structure formed over the second nanostructures, and the second gate structure includes a gate dielectric layer, a first type work function layer and a filling layer. The semiconductor device structure includes a first isolation layer between the first gate structure and the second gate structure, and the first isolation layer includes a first sidewall surface, and the first sidewall surface is in direct contact with a first interface between the gate dielectric layer and the first type work function layer and a second interface between the work function layer and the filling layer.
    Type: Application
    Filed: February 15, 2024
    Publication date: June 6, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chao LIN, Wei-Sheng YUN, Tung-Ying LEE
  • Patent number: 12001384
    Abstract: A processing element array includes N processing elements (PE) arranged linearly, N?2, and an operating method of the PE array includes: performing a first data transmission procedure, where an initial value of I is 1 and the first data transmission procedure includes: operating, by an ith PE, according to a first datum stored in itself, and sending the first datum to other PEs for their operations, adding 1 to I when I<N, and performing the first data transmission procedure again, performing a second data transmission procedure when I is equal to N, which includes: operating, by the Jth PE, according to a second datum stored in itself, and sending the second datum to other PEs for their operations, reducing J by 1 when J>1 and the (J?1)th PE has the second datum, and performing the second data transmission procedure again.
    Type: Grant
    Filed: November 17, 2022
    Date of Patent: June 4, 2024
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Yu-Sheng Lin, Trista Pei-Chun Chen, Wei-Chao Chen
  • Patent number: 11993025
    Abstract: A fixing assembly for mounting UV lamps includes a base, a first gear and a plurality of mounting modules. The first gear is arranged on one side of the base; the mounting modules are arranged around the first gear. The mounting module includes a first driving assembly, a second driving assembly and a support frame. The first driving assembly is used to drive the second driving assembly and the support frame to move circumferentially around the first gear in a considerably horizontal plane, and the second driving component is used to drive the support to move back in a considerably vertical direction. The support frame is used for mounting UV lamp. The flexibility of the fixing assembly is improved. The UV lamp may comprehensively irradiate and cure the photosensitive adhesive.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: May 28, 2024
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    Inventors: Yen-Sheng Lin, Yu-Wen Chen
  • Patent number: 11997480
    Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device transmits a device information of the first member device to the Bluetooth host device. The Bluetooth host device controls a display device to display a candidate device list, and to display a single device item in the candidate device list to represent the Bluetooth device set, but does not simultaneously display two device items in the candidate device list to represent the first member device and the second member device. The Bluetooth host device further establishes a connection with the first member device to conduct pairing procedure to generate a first cypher key after receiving a selection command. The first member device further establishes a connection with the Bluetooth host device to conduct pairing procedure to generate a second cypher key.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: May 28, 2024
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yu Hsuan Liu, Yung Chieh Lin, Po Sheng Chiu
  • Patent number: 11991517
    Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device transmits a device information of the first member device to the Bluetooth host device. The Bluetooth host device controls a display device to display a candidate device list, and to display a single device item in the candidate device list to represent the Bluetooth device set, but does not simultaneously display two device items in the candidate device list to represent the first member device and the second member device. The Bluetooth host device further establishes a connection with the first member device to conduct pairing procedure to generate a first cypher key after receiving a selection command. The first member device further establishes a connection with the Bluetooth host device to conduct pairing procedure to generate a second cypher key.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: May 21, 2024
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yu Hsuan Liu, Yung Chieh Lin, Po Sheng Chiu
  • Patent number: 11990418
    Abstract: A method for forming a chip package structure is provided. The method includes removing a first portion of a substrate to form a first recess in the substrate. The method includes forming a buffer structure in the first recess. A first Young's modulus of the buffer structure is less than a second Young's modulus of the substrate. The method includes forming a first wiring structure over the buffer structure and the substrate. The method includes bonding a chip package to the first wiring structure. The chip package has an interposer substrate and a chip structure over the interposer substrate, and a first corner of the interposer substrate and a second corner of the chip structure overlap the buffer structure in a top view of the chip package and the buffer structure.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Hua Wang, Po-Chen Lai, Ping-Tai Chen, Che-Chia Yang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng
  • Patent number: 11982019
    Abstract: A crystal growth doping apparatus and a crystal growth doping method are provided. The crystal growth doping apparatus includes a crystal growth furnace and a doping device that includes a feeding tube inserted to the furnace body along an oblique insertion direction, and a storage cover and a gate tube that are disposed in the feeding tube. The feeding tube extends from an outer surface thereof to form a placement opening, and the placement opening is recessed from an edge thereof to form an upper recessed portion and a lower recessed portion along the oblique insertion direction. The storage cover includes a storage tank and a handle. When the storage cover is disposed in the gate tube body, the gate tube body is configured to isolate an inner space of the feeding tube from the placement opening.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: May 14, 2024
    Assignee: GLOBALWAFERS CO., LTD.
    Inventors: Yu-Chih Chu, Tang-Chi Lin, Han-Sheng Wu, Hsien-Ta Tseng
  • Patent number: 11983351
    Abstract: A touch data transmission method of present disclosure includes: generating a header information by a first controller according to a detected touch event; generating a first checksum information by the first controller according to the header information; storing the header information and the first checksum information to a memory by the first controller; and, storing a plurality of position information of the detected touch event to the memory by the first controller.
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: May 14, 2024
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Chun-Kai Chuang, Jan-Ruei Lin, Yu-Hsiang Lin, I-Sheng Chao
  • Patent number: 11984378
    Abstract: A semiconductor package structure includes an interposer substrate formed over a package substrate. The structure also includes a die disposed over the interposer substrate. The structure also includes a first heat spreader disposed over the package substrate. The structure also includes a second heat spreader disposed over the die and connected to the first heat spreader. The coefficient of thermal expansion (CTE) of the first heat spreader and the coefficient of thermal expansion of the second heat spreader are different.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Shen Yeh, Po-Yao Lin, Chin-Hua Wang, Yu-Sheng Lin, Shin-Puu Jeng
  • Patent number: 11983848
    Abstract: Aspects of the disclosure provide a frame processor for processing frames with aliasing artifacts. For example, the frame processor can include a super-resolution (SR) and anti-aliasing (AA) engine and an attention reference frame generator coupled to the SR and AA engine. The SR and AA engine can be configured to enhance resolution and remove aliasing artifacts of a frame to generate a first high-resolution frame with aliasing artifacts and a second high-resolution frame with aliasing artifacts removed. The attention reference frame generator can be configured to generate an attention reference frame based on the first high-resolution frame and the second high-resolution frame.
    Type: Grant
    Filed: January 6, 2023
    Date of Patent: May 14, 2024
    Assignee: MEDIATEK INC.
    Inventors: Cheng-Lung Jen, Pei-Kuei Tsung, Chih-Wei Chen, Yao-Sheng Wang, Shih-Che Chen, Yu-Sheng Lin, Chih-Wen Goo, Shih-Chin Lin, Tsung-Shian Huang, Ying-Chieh Chen
  • Publication number: 20240153839
    Abstract: A semiconductor package structure includes an interposer substrate formed over a package substrate. The structure also includes a die disposed over the interposer substrate. The structure also includes a first heat spreader disposed over the package substrate. The structure also includes a second heat spreader disposed over the die and connected to the first heat spreader. The coefficient of thermal expansion (CTE) of the first heat spreader and the coefficient of thermal expansion of the second heat spreader are different.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 9, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Shen YEH, Po-Yao LIN, Chin-Hua WANG, Yu-Sheng LIN, Shin-Puu JENG
  • Patent number: 11978392
    Abstract: A precharge method for a data driver includes steps of: outputting a display data to a plurality of output terminals of the data driver; outputting a second precharge voltage to an output terminal among the plurality of output terminals prior to outputting the display data to the output terminal, to precharge the output terminal to a voltage level closer to an output voltage; and outputting a first precharge voltage to the output terminal prior to outputting the second precharge voltage. The first precharge voltage provides a faster voltage transition on the output terminal than the second precharge voltage.
    Type: Grant
    Filed: May 31, 2023
    Date of Patent: May 7, 2024
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Min-Yang Chiu, Yu-Sheng Ma, Jin-Yi Lin, Hsuan-Yu Chen, Jhih-Siou Cheng, Chun-Fu Lin
  • Publication number: 20240142961
    Abstract: A method of estimating greenhouse gas emission, performed by a processing device, includes: obtaining at least one time period of a number of working stations for a target manufacturing process of a product; obtaining a number of first power consumption data of the target manufacturing process, wherein the first power consumption data correspond to the working stations respectively; calculating a number of second power consumption data based on the at least one time period and the first power consumption data; searching for a number of target coefficients corresponding to the plurality of working stations respectively in coefficient database based on the target manufacturing process; and calculating greenhouse gas emission data of the target manufacturing process based on the second power consumption data and the target coefficients.
    Type: Application
    Filed: October 27, 2022
    Publication date: May 2, 2024
    Applicant: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Tsung-Hsi LIN, Yun Sheng LI, Yu Ling LEE, Hsiao Pin LIN, Chia Hou CHEN
  • Publication number: 20240139990
    Abstract: An internal rotor type nail drive device of electric nail gun, comprising a nailing rod and an internal rotor type rotary actuator that can output a specific rotation angle and can drive the nailing rod to move downward for nailing. Specifically, the rotary actuator comprises a stator and a rotor arranged inside the stator, even groups of electromagnetic mutual action components are configured in pairs between the stator and the rotor, to generate a tangential force to drive the rotor to rotate for a specific rotation angle, and to drive the nailing rod to move for a nailing stroke. The nailing stroke can be determined by a specific rotation angle. Thus, through the above configuration of the rotary actuator, the structure of the electric nail gun can be simplified, and the kinetic energy for nailing can be increased.
    Type: Application
    Filed: August 22, 2023
    Publication date: May 2, 2024
    Inventors: I-TSUNG WU, CHIA-SHENG LIANG, YU-CHE LIN, WEN-CHIN CHEN
  • Publication number: 20240147711
    Abstract: The present disclosure provides a memory device, a semiconductor device, and a method of operating a memory device. A memory device includes a memory cell, a bit line, a word line, a select transistor, a fuse element, and a heater. The bit line is connected to the memory cell. The word line is connected to the memory cell. The select transistor is disposed in the memory cell. A gate of the select transistor is connected to the word line. The fuse element is disposed in the memory cell. The fuse element is connected to the bit line and the select transistor. The heater is configured to heat the fuse element.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 2, 2024
    Inventors: PERNG-FEI YUH, YIH WANG, MENG-SHENG CHANG, JUI-CHE TSAI, KU-FENG LIN, YU-WEI LIN, KEH-JENG CHANG, CHANSYUN DAVID YANG, SHAO-TING WU, SHAO-YU CHOU, PHILEX MING-YAN FAN, YOSHITAKA YAMAUCHI, TZU-HSIEN YANG