Patents by Inventor Yu Sheng

Yu Sheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240178128
    Abstract: A semiconductor device structure includes a first dielectric wall, a plurality of first semiconductor layers vertically stacked and extending outwardly from a first side of the first dielectric wall, a plurality of second semiconductor layers vertically stacked and extending outwardly from a second side of the first dielectric wall. The structure also includes a first gate electrode layer surrounding at least three surfaces of each of the first semiconductor layers, the first gate electrode layer having a first conductivity type, and a second gate electrode layer surrounding at least three surfaces of each of the second semiconductor layers, the second gate electrode layer having a second conductivity type opposite the first conductivity type. The structure further includes a gate bridge contact disposed on the first dielectric wall, and a gate via contact disposed on the gate bridge contact.
    Type: Application
    Filed: January 22, 2023
    Publication date: May 30, 2024
    Inventors: Hong-Chih CHEN, Chun-Sheng LIANG, Yu-San CHIEN, Wei-Chih KAO
  • Patent number: 11993025
    Abstract: A fixing assembly for mounting UV lamps includes a base, a first gear and a plurality of mounting modules. The first gear is arranged on one side of the base; the mounting modules are arranged around the first gear. The mounting module includes a first driving assembly, a second driving assembly and a support frame. The first driving assembly is used to drive the second driving assembly and the support frame to move circumferentially around the first gear in a considerably horizontal plane, and the second driving component is used to drive the support to move back in a considerably vertical direction. The support frame is used for mounting UV lamp. The flexibility of the fixing assembly is improved. The UV lamp may comprehensively irradiate and cure the photosensitive adhesive.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: May 28, 2024
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    Inventors: Yen-Sheng Lin, Yu-Wen Chen
  • Patent number: 11997480
    Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device transmits a device information of the first member device to the Bluetooth host device. The Bluetooth host device controls a display device to display a candidate device list, and to display a single device item in the candidate device list to represent the Bluetooth device set, but does not simultaneously display two device items in the candidate device list to represent the first member device and the second member device. The Bluetooth host device further establishes a connection with the first member device to conduct pairing procedure to generate a first cypher key after receiving a selection command. The first member device further establishes a connection with the Bluetooth host device to conduct pairing procedure to generate a second cypher key.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: May 28, 2024
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yu Hsuan Liu, Yung Chieh Lin, Po Sheng Chiu
  • Publication number: 20240166124
    Abstract: A light emitting device emitting an output light includes a light adjustment structure. A sub light is defined as the output light corresponding to an azimuth angle, a first value L1 is a sum of a luminance of the sub light corresponding to a polar angle from 115 to 125 degrees, a second value L2 is a sum of a luminance of the sub light corresponding to a polar angle from 95 to 105 degrees, a third value L3 is a sum of a luminance of the sub light corresponding to a polar angle from 75 to 85 degrees, a fourth value L4 is a sum of a luminance of the sub light corresponding to a polar angle from 55 to 65 degrees. The first value L1, the second value L2, the third value L3 and the fourth value L4 satisfy L3<L2, and 1.23?(L1*L3)/(L2*L4)?2.92.
    Type: Application
    Filed: October 22, 2023
    Publication date: May 23, 2024
    Applicant: InnoLux Corporation
    Inventors: Yu-Chia HUANG, Hong-Sheng HSIEH, Tsung-Han TSAI
  • Publication number: 20240170888
    Abstract: An electrical connection device includes a plug connector. The plug connector includes a conductive body, an outer conductor, an insulative body and a central terminal. The outer conductor has a rear end, a front latching portion and an elastic piece. The rear end electrically connects the conductive body, the front latching portion is opposite to the rear end and is positioned in front of the rear end, the elastic piece is positioned between the rear end and the front latching portion and connects the front latching portion. At least one of the conductive body and the outer conductor is formed with a stopping surface, a position of the stopping surface correspond to the elastic piece of the outer conductor and is close to the front latching portion. The electrical connection device assures and avoids interruption of power and signal transfer.
    Type: Application
    Filed: November 22, 2023
    Publication date: May 23, 2024
    Inventor: Yu-Sheng Su
  • Patent number: 11990182
    Abstract: An operation method for a memory device is provided. The memory device includes a two-terminal selector and a resistance variable storage element coupled to the two-terminal selector. The method includes providing a voltage pulse to the memory device. A voltage applied across the two-terminal selector during a falling part of the voltage pulse falls below a holding voltage of the two-terminal selector. A voltage falling rate of the falling part at which the voltage applied across the two-terminal selector reaches the holding voltage is raised for reducing threshold voltage drift of the two-terminal selector.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: May 21, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hengyuan Lee, Cheng-Hsien Wu, Yu-Sheng Chen, Elia Ambrosi, Chien-Min Lee, Xinyu Bao
  • Patent number: 11990418
    Abstract: A method for forming a chip package structure is provided. The method includes removing a first portion of a substrate to form a first recess in the substrate. The method includes forming a buffer structure in the first recess. A first Young's modulus of the buffer structure is less than a second Young's modulus of the substrate. The method includes forming a first wiring structure over the buffer structure and the substrate. The method includes bonding a chip package to the first wiring structure. The chip package has an interposer substrate and a chip structure over the interposer substrate, and a first corner of the interposer substrate and a second corner of the chip structure overlap the buffer structure in a top view of the chip package and the buffer structure.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Hua Wang, Po-Chen Lai, Ping-Tai Chen, Che-Chia Yang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng
  • Patent number: 11991517
    Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device transmits a device information of the first member device to the Bluetooth host device. The Bluetooth host device controls a display device to display a candidate device list, and to display a single device item in the candidate device list to represent the Bluetooth device set, but does not simultaneously display two device items in the candidate device list to represent the first member device and the second member device. The Bluetooth host device further establishes a connection with the first member device to conduct pairing procedure to generate a first cypher key after receiving a selection command. The first member device further establishes a connection with the Bluetooth host device to conduct pairing procedure to generate a second cypher key.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: May 21, 2024
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yu Hsuan Liu, Yung Chieh Lin, Po Sheng Chiu
  • Publication number: 20240158309
    Abstract: The invention provides a material surface treatment equipment, which is applied to a material substrate. The material surface treatment equipment includes a surface treatment device and at least one waveguide device. The surface treatment device is used to carry the material substrate to perform a surface treatment process. Each waveguide device is used for introducing electromagnetic waves to the material substrate to assist in performing the surface treatment process. Through the introduction of electromagnetic waves, the surface treatment process of the material substrate is easy to perform and can achieve the strengthening effect.
    Type: Application
    Filed: December 15, 2022
    Publication date: May 16, 2024
    Inventors: TIEN-HSI LEE, JUN-HUANG WU, YU-SHENG CHIOU, SHU-CHENG LI, WEI-CHI HUANG, HSIN CHEN
  • Patent number: 11982019
    Abstract: A crystal growth doping apparatus and a crystal growth doping method are provided. The crystal growth doping apparatus includes a crystal growth furnace and a doping device that includes a feeding tube inserted to the furnace body along an oblique insertion direction, and a storage cover and a gate tube that are disposed in the feeding tube. The feeding tube extends from an outer surface thereof to form a placement opening, and the placement opening is recessed from an edge thereof to form an upper recessed portion and a lower recessed portion along the oblique insertion direction. The storage cover includes a storage tank and a handle. When the storage cover is disposed in the gate tube body, the gate tube body is configured to isolate an inner space of the feeding tube from the placement opening.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: May 14, 2024
    Assignee: GLOBALWAFERS CO., LTD.
    Inventors: Yu-Chih Chu, Tang-Chi Lin, Han-Sheng Wu, Hsien-Ta Tseng
  • Patent number: 11983848
    Abstract: Aspects of the disclosure provide a frame processor for processing frames with aliasing artifacts. For example, the frame processor can include a super-resolution (SR) and anti-aliasing (AA) engine and an attention reference frame generator coupled to the SR and AA engine. The SR and AA engine can be configured to enhance resolution and remove aliasing artifacts of a frame to generate a first high-resolution frame with aliasing artifacts and a second high-resolution frame with aliasing artifacts removed. The attention reference frame generator can be configured to generate an attention reference frame based on the first high-resolution frame and the second high-resolution frame.
    Type: Grant
    Filed: January 6, 2023
    Date of Patent: May 14, 2024
    Assignee: MEDIATEK INC.
    Inventors: Cheng-Lung Jen, Pei-Kuei Tsung, Chih-Wei Chen, Yao-Sheng Wang, Shih-Che Chen, Yu-Sheng Lin, Chih-Wen Goo, Shih-Chin Lin, Tsung-Shian Huang, Ying-Chieh Chen
  • Patent number: 11984378
    Abstract: A semiconductor package structure includes an interposer substrate formed over a package substrate. The structure also includes a die disposed over the interposer substrate. The structure also includes a first heat spreader disposed over the package substrate. The structure also includes a second heat spreader disposed over the die and connected to the first heat spreader. The coefficient of thermal expansion (CTE) of the first heat spreader and the coefficient of thermal expansion of the second heat spreader are different.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Shen Yeh, Po-Yao Lin, Chin-Hua Wang, Yu-Sheng Lin, Shin-Puu Jeng
  • Patent number: 11983351
    Abstract: A touch data transmission method of present disclosure includes: generating a header information by a first controller according to a detected touch event; generating a first checksum information by the first controller according to the header information; storing the header information and the first checksum information to a memory by the first controller; and, storing a plurality of position information of the detected touch event to the memory by the first controller.
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: May 14, 2024
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Chun-Kai Chuang, Jan-Ruei Lin, Yu-Hsiang Lin, I-Sheng Chao
  • Publication number: 20240153839
    Abstract: A semiconductor package structure includes an interposer substrate formed over a package substrate. The structure also includes a die disposed over the interposer substrate. The structure also includes a first heat spreader disposed over the package substrate. The structure also includes a second heat spreader disposed over the die and connected to the first heat spreader. The coefficient of thermal expansion (CTE) of the first heat spreader and the coefficient of thermal expansion of the second heat spreader are different.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 9, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Shen YEH, Po-Yao LIN, Chin-Hua WANG, Yu-Sheng LIN, Shin-Puu JENG
  • Publication number: 20240154215
    Abstract: An aluminum plastic film for a lithium battery and a method for manufacturing the same are provided. The method includes steps as follows: preparing a polyolefin adhesive; coating the polyolefin adhesive onto one surface of an aluminum foil layer; disposing an inner polyolefin layer onto the polyolefin adhesive; and drying the polyolefin adhesive, so that a polyolefin adhesive layer is formed between the aluminum foil layer and the inner polyolefin layer. Components of the polyolefin adhesive include a modified polyolefin polymer and a hardener. The modified polyolefin polymer has a modified group, a structure of the modified group contains maleic anhydride, and a molecular weight of the modified polyolefin polymer ranges from 100,000 g/mol to 200,000 g/mol.
    Type: Application
    Filed: February 17, 2023
    Publication date: May 9, 2024
    Inventors: TE-CHAO LIAO, SHIOU-YEH SHENG, TENG-KO MA, CHING-YAO YUAN, Chao-Hsien Lin, CHIA-YU LIN, YUN-BIN HSI, HAN-YI LEE, SHUN-CHIEH YANG
  • Patent number: 11976018
    Abstract: Disclosed is a diamine compound represented by Formula (1), in which R1, R2, R3, R4, R5, X1, X2, X3, X4, m, n, a, b, c, and d are as defined herein. Also disclosed are a method for manufacturing the diamine compound, a composition including the diamine compound having a (chain alkoxy-methylene) phenyl group or a (hydroxyl-methylene) phenyl group, and a polymer including the (chain alkoxy-methylene) phenyl group or the (hydroxyl-methylene) phenyl group.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: May 7, 2024
    Assignee: DAXIN MATERIALS CORP.
    Inventors: Kai-Sheng Jeng, Yuan-Li Liao, You-Ming Chen, Yu-Ying Kuo, Shao-Chi Cheng
  • Patent number: 11978392
    Abstract: A precharge method for a data driver includes steps of: outputting a display data to a plurality of output terminals of the data driver; outputting a second precharge voltage to an output terminal among the plurality of output terminals prior to outputting the display data to the output terminal, to precharge the output terminal to a voltage level closer to an output voltage; and outputting a first precharge voltage to the output terminal prior to outputting the second precharge voltage. The first precharge voltage provides a faster voltage transition on the output terminal than the second precharge voltage.
    Type: Grant
    Filed: May 31, 2023
    Date of Patent: May 7, 2024
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Min-Yang Chiu, Yu-Sheng Ma, Jin-Yi Lin, Hsuan-Yu Chen, Jhih-Siou Cheng, Chun-Fu Lin
  • Patent number: D1026816
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: May 14, 2024
    Assignee: VOLTRONIC POWER TECHNOLOGY CORP.
    Inventors: You-Sheng Chiang, Yu-Cheng Lu, Juor-Ming Hsieh
  • Patent number: D1026817
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: May 14, 2024
    Assignee: VOLTRONIC POWER TECHNOLOGY CORP.
    Inventors: You-Sheng Chiang, Yu-Cheng Lu, Juor-Ming Hsieh
  • Patent number: D1027976
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: May 21, 2024
    Assignee: VIVOTEK INC.
    Inventors: Kuan-Hung Chen, Kai-Sheng Chuang, Chia-Chi Chang, Yu-Fang Huang, Kai-Ting Yu, Wen-Chun Chen, Shu-Jung Hsu, Tsao-Wei Hung