Patents by Inventor Yu Shi
Yu Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240379535Abstract: An embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. The redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. The third redistribution layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.Type: ApplicationFiled: July 22, 2024Publication date: November 14, 2024Inventors: Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng, Tsung-Ding Wang, Yu-Min Liang, Li-Wei Chou
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Patent number: 12142560Abstract: An embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. The redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. The third redistribution layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.Type: GrantFiled: August 23, 2021Date of Patent: November 12, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng, Tsung-Ding Wang, Yu-Min Liang, Li-Wei Chou
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Publication number: 20240371647Abstract: A semiconductor structure includes a die, a molding surrounding the die, and a polymer over the die and the molding. The die has a top surface. The molding has a top surface. The polymer has a first bottom surface contact the die and a second surface contacting the molding. The first bottom surface is at a level substantially same as the second bottom surface.Type: ApplicationFiled: July 18, 2024Publication date: November 7, 2024Inventors: YU-HSIANG HU, WEI-YU CHEN, HUNG-JUI KUO, WEI-HUNG LIN, MING-DA CHENG, CHUNG-SHI LIU
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Publication number: 20240360374Abstract: The present invention provides a high-energy-density slurry fuel, a preparation method, and an application. The high-energy-density slurry fuel comprises the following components in percentage by mass: 3%-40% of aluminum-based-metal hydride composite fuel; 53.6%-96% of high-density liquid hydrocarbon fuel; 0.2%-2% of anti-settling agent; and 0.2%-5% of other performance regulators, wherein an aluminum-based-metal hydride is a composite material that disperses and distributes a metal hydride inside aluminum powder particles. The high-energy-density slurry fuel may be used as a fuel for an engine such as a ramjet engine or a rocket engine. Compared with the existing liquid fuel, the present high-energy-density slurry fuel has the characteristics of high density (?20° C.>0.Type: ApplicationFiled: August 26, 2022Publication date: October 31, 2024Inventors: Xiang GUO, Wei LI, Fang WANG, Gen TANG, Wei WANG, Xiaomeng FU, Yu SHI, Pu HUANG, Chengshuo CAO, Xinke SUN
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Publication number: 20240353304Abstract: The present disclosure relates to a method and a device for predicting ability of a temporary plugging agent to plug cracks and a storage medium, and includes the following steps: calculating a plane elastic modulus of a core through experiments, acquiring a maximum force load of a specimen, calculating rock fracture toughness through the maximum force load, manufacturing an artificial crack model and placing it in a core holder, preparing temporary plugging deflection fluid by selecting a temporary plugging agent, injecting the temporary plugging deflection fluid into the artificial crack so as to calculate apparent fracture toughness of the temporarily plugged crack, and finally calculating a fracture pressure of the temporarily plugged crack based on the calculated rock fracture toughness and the plane elastic modulus of the core. Through the above method, the present disclosure provides a standard fracture pressure calculation method.Type: ApplicationFiled: April 19, 2024Publication date: October 24, 2024Inventors: Daobing Wang, Bo Yu, Haiyan Zhu, Fujian Zhou, Dongliang Sun, Xiongfei Liu, Tiankui Guo, Xiuhui Li, Xuanhe Tang, Xian Shi, Qing Liu, Yu Suo, Yang Shi
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Publication number: 20240352090Abstract: Provided are a protein containing an amino acid sequence capable of binding to a peptide fragment of a substrate GPRP, a fibrinogen-like protein 1 (FGL1) containing the amino acid sequence, and a fibrinogen domain (FD) of the FGL1, wherein a single FD protein also has a function the same as or similar to that of the FGL1. The FGL1 and FD, which have different action mechanisms from existing drugs, can inhibit fibrin assembly in the process of thrombogenesis by means of competing for fibrin substrate binding pockets. The FGL1 and FD can have a stronger affinity to the substrate by means of mutation, thereby effectively enhancing a usage effect of drugs for treating thrombus.Type: ApplicationFiled: April 29, 2024Publication date: October 24, 2024Applicants: NANJING UNIVERSITY, CENTER FOR EXCELLENCE IN MOLECULAR CELL SCIENCE, HUAZHONG AGRICULTURAL UNIVERSITYInventors: Xianchi DONG, Wen LIU, Jianping DING, Yu SHI, Shutong XU, Jianbo XU
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Publication number: 20240354178Abstract: An event processing method is provided, applied to filtering of events in a server. The method includes: matching a to-be-filtered event with an event matching rule, where the event matching rule is used for performing filtering to obtain an event that meets one or more first conditions and one or more second conditions, and the second condition indicates duration or repeatability of the one or more first conditions; and sending an instruction to a destination address when the to-be-filtered event meets the event matching rule. The event processing method provided in this application supports condition rule configuration of duration or repeatability, for example, a timing rule or a count rule.Type: ApplicationFiled: June 28, 2024Publication date: October 24, 2024Inventors: Yuankun HAN, Hongyu SHI, Yang WANG, Feiping DAI, Yu HUANG
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Publication number: 20240357874Abstract: A display panel includes a drive backplane; a first electrode layer, including a plurality of first electrodes distributed in an array; a leakage cut-off layer, provided on the same surface of the drive backplane as the first electrode layer; a light-emitting function layer, at least partially covering a top of the leakage cut-off layer and a partial area of the first electrode; and a second electrode, covering the light-emitting function layer; where the second electrode includes a plurality of flat parts and a separating part located between the plurality of flat parts; the separating part includes a protruding area and a first recessed area, the first recessed area is located between the protruding area and the flat part, and a bottom of the first recessed area is located on a side of the leakage cut-off layer away from the drive backplane.Type: ApplicationFiled: July 3, 2024Publication date: October 24, 2024Inventors: Yu WANG, Kuanta HUANG, Qing WANG, Yongfa DONG, Chao YANG, Shipeng LI, Hui TONG, Shangquan SHI, Xiong YUAN, Dongsheng LI, Xiaobin SHEN
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Patent number: 12122992Abstract: A large-flux in-situ filtration device for marine microorganism based on a multi-channel circulation distributor is provided, comprising an energy and control module, a circulation distribution module, a filtration module, a pump module, a filtration volume measurement module, a pipeline connection, and a main body support frame. The circulation distribution module may include a multi-channel circulation distributor, a deep-sea servo motor, etc. The filtration module may include a plurality of filter film holders. The pump module may include a stainless steel gear pump, a deep-sea drive motor, etc. The filtration volume measurement module may include a water meter, a camera, and an LED light.Type: GrantFiled: March 7, 2023Date of Patent: October 22, 2024Assignee: ZHEJIANG UNIVERSITYInventors: Shuo Liu, Zhiyong Sun, Yu Zhang, Shanmin Zhou, Jingyang Li, Yang Shi, Yong Cai, Jiwei Tian, Xiao Zhang, Yu Xin
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Patent number: 12118719Abstract: A method for training a machine learning algorithm that classifies predictive regions-of interest (“ROI”) of progression of idiopathic pulmonary fibrosis. The method includes acquiring a set of computed tomography (CT) images of a plurality of patients and selecting a plurality of ROIs within the set of images. Each of the ROIs designates a label that indicates progression of pulmonary fibrosis and training a machine learning algorithm by inputting the plurality of ROIs and the associated labels into the algorithm. The algorithm identifies the ROIs in the set of images as indicating regions of pulmonary fibrosis within the set of images based on the features.Type: GrantFiled: September 3, 2020Date of Patent: October 15, 2024Assignee: The Regents of the University of CaliforniaInventors: Hyun Kim, Yu Shi, Jonathan Gerald Goldin, Weng Kee Wong
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Patent number: 12119229Abstract: A method of manufacturing a semiconductor structure includes receiving a die comprising a top surface and a sacrificial layer covering the top surface; disposing a molding surrounding the die; removing the sacrificial layer from the die; disposing a polymer over the die and the molding, wherein the polymer has a first bottom surface contacting the die and a second bottom surface contacting the molding, and the first bottom surface is at a level substantially same as the second bottom surface.Type: GrantFiled: April 22, 2022Date of Patent: October 15, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Yu-Hsiang Hu, Wei-Yu Chen, Hung-Jui Kuo, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu
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Patent number: 12109086Abstract: A teeth whitening system that emits electromagnetic radiation onto surfaces of a user's teeth and may also dispense a tooth whitening material for contact with the user's teeth. In one aspect, the teeth whitening system includes a mouthpiece comprising a wall and a bite platform extending from the wall that collectively define a first channel for receiving a user's teeth and an electromagnetic radiation source coupled to the mouthpiece and configured to emit electromagnetic radiation onto surfaces of the user's teeth that are positioned in the first channel. The teeth whitening system may also include an opening in the wall through which a tooth whitening material may be dispensed into the channel. The tooth whitening system may alternatively include apertures in the wall or bite platform through which a tooth whitening material can be dispensed.Type: GrantFiled: November 20, 2020Date of Patent: October 8, 2024Assignee: Colgate-Palmolive CompanyInventors: Scott Demarest, Stacey Lavender, Richard Adams, Yu Shi
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Publication number: 20240329396Abstract: A display waveguide is configured to direct a first portion of display light to an eye along a first optical path. A disparity waveguide is configured to direct a second portion of the display light to a disparity sense circuit along a second optical path separated from the first optical path.Type: ApplicationFiled: June 13, 2024Publication date: October 3, 2024Inventors: Karol Constantine Hatzilias, Tamer Elazhary, Yu Shi, Guohua Wei, Michiel Koen Callens, Nicholas Mcgee
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Patent number: 12106434Abstract: A computer-implemented method for generating a 3D geological model of a subsurface volume of a geographic site. The method includes processing, based on a machine-learning-based model, borehole data of a plurality of boreholes at the geographic site and trusted geological data associated with the geographic site, so as to generate a plurality of geological cross-sections of the subsurface volume of the geographic site. The borehole data includes data related to subsurface soil and/or rock information along at least part of each of the plurality of boreholes. The trusted geological data includes data related to prior stratigraphic information associated with the geographic site. Each of the geological cross-sections contains respective stratigraphic information. The method also includes forming the 3D geological model based on the generated geological cross-sections for display.Type: GrantFiled: October 7, 2022Date of Patent: October 1, 2024Assignee: City University of Hong KongInventors: Yu Wang, Chao Shi
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Patent number: 12108322Abstract: A method for enhancing network coverage based on adaptive generation of resource cell. A traditional cell in a network is taken as an initial state of the network. A correlation matrix in a current network state is generated. Whether |?i,jt??i,jt-1|/?i,jt-1>? is determined. Each access point is divided into a plurality of resource cells. A CU-DU network mapping table is generated. A middlehaul link of each of the plurality of resource cells is constructed according to the CU-DU network mapping table.Type: GrantFiled: December 17, 2021Date of Patent: October 1, 2024Assignee: Xidian UniversityInventors: Junyu Liu, Min Sheng, Ziwen Xie, Jiandong Li, Yu Su, Yan Shi, Xiayu Zhang
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Publication number: 20240321780Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern.Type: ApplicationFiled: June 4, 2024Publication date: September 26, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai, Shih-Wei Chen, Chia-Hung Liu, Hao-Yi Tsai, Chung-Shi Liu
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Publication number: 20240321621Abstract: A method includes forming an adhesive layer over a carrier, forming a sacrificial layer over the adhesive layer, forming through-vias over the sacrificial layer, and placing a device die over the sacrificial layer. The Method further includes molding and planarizing the device die and the through-vias, de-bonding the carrier by removing the adhesive layer, and removing the sacrificial layer.Type: ApplicationFiled: June 4, 2024Publication date: September 26, 2024Inventors: Yu-Hsiang Hu, Chung-Shi Liu, Hung-Jui Kuo, Ming-Da Cheng
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Patent number: 12099190Abstract: A waveguide is provided. The waveguide includes a substrate having two outer surfaces for propagating a beam of light in the substrate by reflecting the beam from the two outer surfaces. The waveguide includes at least one polarization volume hologram (PVH) grating to couple light in and/or out of the waveguide. The PVH grating may be a multi-layer PVH grating with graded birefringence.Type: GrantFiled: December 13, 2021Date of Patent: September 24, 2024Assignee: Meta Platforms Technologies, LLCInventors: Sihui He, Maxwell Parsons, Fenglin Peng, Miaomiao Xu, Yang Yang, Yu Shi, Dianmin Lin
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Patent number: 12095706Abstract: Provided are an information determination method and device, an information adjustment method, a threshold usage method, a terminal, and a storage medium. The information determination method includes: determining a second threshold of a target subcarrier spacing according to the number of cells that meet a first set condition, the total number of downlink cells, the number of supported cells reported by a terminal, and a first threshold.Type: GrantFiled: September 17, 2020Date of Patent: September 17, 2024Assignee: ZTE CorporationInventors: Jing Shi, Peng Hao, Xianghui Han, Yu Ngok Li
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Patent number: 12094728Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.Type: GrantFiled: May 26, 2023Date of Patent: September 17, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo, Hung-Jui Kuo, Chung-Shi Liu, Chen-Hua Yu, Meng-Wei Chou