Patents by Inventor Yu Shi

Yu Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200294944
    Abstract: A package structure includes a semiconductor device, a molding compound, a first dielectric layer, and a through-via. The molding compound is in contact with a sidewall of the semiconductor device. The first dielectric layer is over the molding compound and the semiconductor device. The through-via is in the molding compound and the first dielectric layer. The through-via is a continuous element and in contact with the first dielectric layer.
    Type: Application
    Filed: May 31, 2020
    Publication date: September 17, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Hsuan TAI, Ting-Ting KUO, Yu-Chih HUANG, Chih-Wei LIN, Hsiu-Jen LIN, Chih-Hua CHEN, Ming-Da CHENG, Ching-Hua HSIEH, Hao-Yi TSAI, Chung-Shi LIU
  • Publication number: 20200295326
    Abstract: A method of manufacturing a battery includes introducing a first material to the battery, providing an anode, a cathode and a separator of the battery; and assembling the anode, the separator and the cathode. The first material is configured and arranged to increase the internal impedance of the battery upon mechanical or thermal loading.
    Type: Application
    Filed: June 1, 2020
    Publication date: September 17, 2020
    Inventors: Yu Qiao, Weiyi Lu, Yang Shi, Anh V. Le
  • Publication number: 20200290896
    Abstract: The present invention provides an improved catalytic fast pyrolysis process for increased yield of useful and desirable products. In particular, the process comprises an improved catalytic fast pyrolysis process for producing aromatic compounds, such as, for example, benzene, toluene and xylenes, from biomass feedstock containing impurities, such as, for example alkali and alkaline earth metal, sulfur and nitrogen components.
    Type: Application
    Filed: June 2, 2020
    Publication date: September 17, 2020
    Inventors: Jian Shi, Charles Sorensen, Terry Mazanec, Ruozhi Song, Sandeep Goud, Scott Han, Yu-Ting Cheng, Victoria L. Frank, William F. Igoe, JR., Marc Schneidkraut
  • Publication number: 20200294916
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes semiconductor dies, an encapsulant and a redistribution structure. The semiconductor dies are disposed side by side. Each semiconductor die has an active surface, a backside surface, and an inner side surface connecting the active surface and the backside surface. The encapsulant wraps the semiconductor dies and exposes the active surfaces of the semiconductor dies. The redistribution structure is disposed on the encapsulant and the active surfaces of the semiconductor dies. The inner side surfaces of most adjacent semiconductor dies face each other. The redistribution structure establishes single-ended connections between most adjacent semiconductor dies by crossing over the facing inner side surfaces of the most adjacent semiconductor dies.
    Type: Application
    Filed: March 14, 2019
    Publication date: September 17, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Chia Lai, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Kuo-Chung Yee, Chen-Hua Yu
  • Patent number: 10777794
    Abstract: The present application discloses a battery pack, comprising a first battery module, a second battery module, a housing and a fireproof member. The first battery module includes a plurality of battery cells which are provided with vents; the second battery module includes a plurality of battery cells which are provided with vents. Both the first battery module and the second battery module are arranged in the housing; the fireproof member is vertically disposed and located between the vents of the first battery module, where the vents of the first battery module and the vents of the second battery module both face the fireproof member. The battery pack prevents collective thermal runaway of the battery cells by using the fireproof member to separate the battery cells of the first battery modules and the battery cells of the second battery modules.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: September 15, 2020
    Assignee: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
    Inventors: Kaijie You, Haizu Jin, Dongyang Shi, Fei Hu, Yu Tang, Yuepan Hou, Ziyuan Li, Jun Ma
  • Publication number: 20200287570
    Abstract: The disclosure discloses an algebraic decoding method and a decoder for a (n, n(n?1), n?1) permutation group code in a communication modulation system. The basic principle of the decoding method is: assuming that two code elements p(r1)=s1 and p(r2)=s2 can be correctly detected in a received real vector with a length of n, including their element values s1, s2 and position indices r1, r2 in the vector, an intermediate parameter w is determined by solving an equation (r1?r2)w=(s1?s2)(mod n); and each code element is calculated by w according to p(i)=(s1+(n?r1+i)w)(mod n), i=1, 2, . . . , n. The decoder is mainly composed of multiple n-dimensional registers, a w calculator, n code element calculators, and a code element buffer. In the disclosure, in a case where a receiver only correctly detects two code elements in a transmitted codeword with a length of n, the codeword can be correctly decoded by using the received information of the two code elements.
    Type: Application
    Filed: December 27, 2019
    Publication date: September 10, 2020
    Applicant: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Li Peng, Si Jia Chen, Ying Long Shi, Ya Yu Gao, Bin Dai, Lin Zhang, Kun Liang, Bo Zhou
  • Publication number: 20200286803
    Abstract: In an embodiment, a device includes: a first integrated circuit die having a first contact region and a first non-contact region; an encapsulant contacting sides of the first integrated circuit die; a dielectric layer contacting the encapsulant and the first integrated circuit die, the dielectric layer having a first portion over the first contact region, a second portion over the first non-contact region, and a third portion over a portion of the encapsulant; and a metallization pattern including: a first conductive via extending through the first portion of the dielectric layer to contact the first integrated circuit die; and a conductive line extending along the second portion and third portion of the dielectric layer, the conductive line having a straight portion along the second portion of the dielectric layer and a first meandering portion along the third portion of the dielectric layer.
    Type: Application
    Filed: May 26, 2020
    Publication date: September 10, 2020
    Inventors: Chien-Hsun Chen, Yu-Ling Tsai, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu
  • Publication number: 20200287774
    Abstract: The present disclosure provides an encoding method and an encoder for a (n, n(n?1), n?1) permutation group code in a communication modulation system, in which 2k k-length binary information sequences are mapped to 2k n-length permutation codeword signal points in a n-dimensional modulation constellation ?n. The constellation ?n with the coset characteristics is formed by selecting 2k n-length permutation codewords from n(n?1) permutation codewords of a code set Pn,xi of the (n, n(n?1), n?1) permutation group code based on coset partition. The constellation ?n is a coset code in which 2k1 cosets are included and each coset includes 2k2 permutation codewords, where k=k1+k2, and 2k?n(n?1). The present disclosure utilizes the coset characteristics to realize one-to-one correspondence mapping of the binary information sequence set to the permutation code constellation, so that the time complexity of executing the encoder is at most the linear complexity of the code length n.
    Type: Application
    Filed: December 27, 2019
    Publication date: September 10, 2020
    Applicant: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Li Peng, Si Jia Chen, Ying Long Shi, Ya Yu Gao, Bin Dai, Lin Zhang, Kun Liang, Bo Zhou, Zhen Qin
  • Publication number: 20200279837
    Abstract: A semiconductor package includes a semiconductor device including a first UBM structure, wherein the first UBM structure includes multiple first conductive strips, the first conductive strips extending in a first direction, multiple second conductive strips separated from and interleaved with the multiple first conductive strips, the second conductive strips extending in the first direction, wherein the multiple first conductive strips are offset in the first direction from the multiple second conductive strips by a first offset distance, and a substrate including a second UBM structure, the second UBM structure including multiple third conductive strips, each one of the multiple third conductive strips bonded to one of the multiple first conductive strips or one of the multiple second conductive strips.
    Type: Application
    Filed: May 18, 2020
    Publication date: September 3, 2020
    Inventors: Chih-Hsuan Tai, Chi-Hui Lai, Ying-Cheng Tseng, Ban-Li Wu, Ting-Ting Kuo, Yu-Chih Huang, Chiahung Liu, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Patent number: 10759654
    Abstract: The present disclosure relates to a method for manufacturing a microelectromechanical systems (MEMS) package. The method comprises providing a CMOS IC including CMOS devices arranged within a CMOS substrate. The method further comprises forming and patterning a metal layer over the CMOS substrate to form an anti-stiction layer and a fixed electrode plate and forming a rough top surface for the anti-stiction layer. The method further comprises providing a MEMS IC comprising a moveable mass arranged within a recess of a MEMS substrate and bonding the CMOS IC to the MEMS IC to enclose a cavity between the moveable mass and the fixed electrode plate and the anti-stiction layer.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: September 1, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Jui Chen, I-Shi Wang, Ren-Dou Lee, Jen-Hao Liu
  • Publication number: 20200266750
    Abstract: An active reflected wave canceller (ARWC, or RWC) can attached to each phase at the output of a motor drive (i.e., inverter). The reflected wave canceller is generally comprised of a pulse generator and a power inductor. The power inductor is used to by-pass the load current, so it doesn't flow through the pulse generator. The pulse generator injects an accurately controlled nanoseconds narrow-width pulse into the system. The injected narrow pulse breaks the rising and falling edge of the inverter output voltage into two steps, which generates two traveling waves along the cable that cancel each other at the motor terminals.
    Type: Application
    Filed: November 22, 2019
    Publication date: August 20, 2020
    Inventors: Hui Li, Yu Zhang, Yanjun Shi
  • Publication number: 20200254427
    Abstract: Disclosed is an acid-resistant alloy catalyst comprising nickel, one or more rare earth elements, stannum and aluminum. The acid-resistant alloy catalyst is low-cost and stable, and does not need a carrier, and can be stably used in continuous industrial production, thus achieving a low production cost.
    Type: Application
    Filed: January 14, 2020
    Publication date: August 13, 2020
    Inventors: Jing Liu, Hongbin Qi, Haiyu Ren, Indra Prakash, Yu Shi
  • Patent number: 10743413
    Abstract: The present disclosure provides a method for manufacturing a flexible substrate. The method includes forming at least two flexible substrate layers in a stacking form on a surface of a glass baseplate, wherein a first flexible substrate layer of the flexible substrate layers relatively close to the glass baseplate has a refractive index less than a refractive index of a second flexible substrate layer of the flexible substrate layers relatively far from the glass baseplate; forming a water and oxygen blocking layer on a surface of the second flexible substrate layers, wherein the water and oxygen blocking layer has a refractive index greater than the refractive index of the second flexible substrate layers disposed below the water and oxygen blocking layer.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: August 11, 2020
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
    Inventors: Yu Shi, Lixuan Chen
  • Publication number: 20200248070
    Abstract: A perovskite luminescent nanocrystal has a chemical formula represented by: Cs4BX6, wherein B includes one or more selected from the group consisting of Ge, Pb, Sn, Sb, Bi, Cu, and Mn, and X includes one or more selected from the group consisting of Cl, Br, and I, wherein the Cs4BX6 perovskite luminescent nanocrystal has a pure phase, and a molar ratio of Cs to B (Cs/B) in the Cs4BX6 perovskite luminescent nanocrystal is greater than 1 and less than 4.
    Type: Application
    Filed: September 11, 2019
    Publication date: August 6, 2020
    Inventors: Zhen BAO, Yu-Jui TSENG, Ru-Shi LIU, Hung-Chun TONG, Hung-Chia WANG, Yu-Chun LEE, Tzong-Liang TSAI
  • Publication number: 20200251397
    Abstract: A three dimensional integrated circuit (3D-IC) module socket system includes an integrated Fan-Out (InFO) adapter having one or more integrated passive devices (IPDs) embedded in the InFO adapter. The InFO adapter is also integrated into the 3D-IC module socket system by stacking the InFO adapter between a socket and a SoW package. The InFO adapter with embedded IPDs allows for more planar area of the SoW package to be available for interfacing the socket and provides a short distance between the embedded IPDs and computing dies of the SoW package which enhances a power distribution network (PDN) performance and improves current handling of the 3D-IC module socket system.
    Type: Application
    Filed: September 3, 2019
    Publication date: August 6, 2020
    Inventors: Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Patent number: 10733163
    Abstract: Embodiments of the present invention disclose a method, computer program product, and system for inserting one or more records into a database table. An insert request for inserting a new record to a database table is received, wherein the new record includes at least one key field. a partial identity of at least one record matching the at least one key field of the new record is searched for. A partial identity is assigned to the new record based on a result of the searching.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: August 4, 2020
    Assignee: International Business Machines Corporation
    Inventors: Mei Zhen Cao, Min Fang, Di Jin, Zhen Yu Shi, Nigel G. Slinger, Shu Wang, Li Fei Zheng, Wen Jie Zhu
  • Patent number: 10733126
    Abstract: An FPGA-based square-wave generator and a square-wave generation method.
    Type: Grant
    Filed: January 18, 2016
    Date of Patent: August 4, 2020
    Assignee: University of Science and Technology of China
    Inventors: Xi Qin, Yijin Xie, Xing Rong, Yu He, Lin Wang, Zhifu Shi, Jiangfeng Du
  • Publication number: 20200243370
    Abstract: A method comprises forming a plurality of interconnect structures including a dielectric layer, a metal line and a redistribution line over a carrier, attaching a semiconductor die on a first side of the plurality of interconnect structures, forming an underfill layer between the semiconductor die and the plurality of interconnect structures, mounting a top package on the first side the plurality of interconnect structures, wherein the top package comprises a plurality of conductive bumps, forming an encapsulation layer over the first side of the plurality of interconnect structures, wherein the top package is embedded in the encapsulation layer, detaching the carrier from the plurality of interconnect structures and mounting a plurality of bumps on a second side of the plurality of interconnect structures.
    Type: Application
    Filed: April 13, 2020
    Publication date: July 30, 2020
    Inventors: Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu
  • Publication number: 20200239470
    Abstract: The present invention discloses a substituted pyridine compound represented by formula I, and a pharmaceutically acceptable salt, stereoisomer and tautomer thereof. The compounds of the present invention are useful in the treatment of cancers.
    Type: Application
    Filed: April 15, 2020
    Publication date: July 30, 2020
    Inventors: Guangxin XIA, Qian WANG, Chen SHI, Xiong ZHAI, Hui GE, Xuemei LIAO, Yu MAO, Zhixiong XIANG, Yanan HAN, Guoyong HUO, Yanjun LIU
  • Publication number: 20200231606
    Abstract: Disclosed herein is a compound of formula (I), or a pharmaceutically acceptable salt thereof: Formula (I). Also disclosed herein are uses of the compounds disclosed herein in the potential treatment or prevention of an IDO-associated disease or disorder. Also disclosed herein are compositions comprising a compound disclosed herein. Further disclosed herein are uses of the compositions in the potential treatment or prevention of an IDO-associated disease or disorder.
    Type: Application
    Filed: August 24, 2017
    Publication date: July 23, 2020
    Applicant: Merck Sharp & Dohme Corp.
    Inventors: Kun Liu, Abdelghani Achab, Purakkattle Biju, Timothy A. Cernak, Yongqi Deng, Xavier Fradera, Liangqin Guo, Yongxin Han, Shuwen He, Joseph Kozlowski, Derun Li, Guoqing Li, Qinglin Pu, Zhi-Cai Shi, Wensheng Yu, Hongjun Zhang