Abstract: A method for forming a bonded semiconductor structure is disclosed. A first device wafer having a first bonding layer and a first bonding pad exposed from the first bonding layer and a second device wafer having a second bonding layer and a second bonding pad exposed from the second bonding layer are provided. Following, a portion of the first bonding pad is removed until a sidewall of the first bonding layer is exposed, and a portion of the second bonding layer is removed to expose a sidewall of the second bonding pad. The first device wafer and the second device wafer are then bonded to form a dielectric bonding interface between the first bonding layer and the second bonding layer and a conductive bonding interface between the first bonding pad and the second bonding pad. The conductive bonding interface and the dielectric bonding interface comprise a step-height.

Abstract: A semiconductor device includes: first and second active regions extending in a first direction and separated by a gap relative to a second direction substantially perpendicular to the first direction; and gate structures correspondingly over the first and second active regions, the gate structures extending in the second direction; and each of the gate structures extending at least unilaterally substantially beyond a first side of the corresponding first or second active region that is proximal to the gap or a second side of the corresponding first or second active region that is distal to the gap; and some but not all of the gate structures also extending bilaterally substantially beyond each of the first and second sides of the corresponding first or second active region.

Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.

Abstract: A method for assembling a shoe upper and a bottom unit includes digitally determining a bite line on the shoe upper. The method further includes storing a set of data representing the bite line in a computing device. The method also includes utilizing the set of data to automatically indicate the location of an actual physical bite line on the shoe upper.

Abstract: A method for assembling a shoe upper and a bottom unit includes digitally determining a bite line on the shoe upper. The method further includes storing a set of data representing the bite line in a computing device. The method also includes utilizing the set of data to automatically indicate the location of an actual physical bite line on the shoe upper.

Abstract: A method for assembling a shoe upper and a bottom unit includes digitally determining a bite line on the shoe upper. The method further includes storing a set of data representing the bite line in a computing device. The method also includes utilizing the set of data to automatically indicate the location of an actual physical bite line on the shoe upper.

Abstract: A power management circuit includes a voltage sensing circuit and a supply voltage adjusting circuit. The voltage sensing circuit is arranged for sensing a plurality of voltages respectively of a plurality of nodes of a PCB to generate a sensing result. The supply voltage adjusting circuit is coupled to the voltage sensing circuit, and is arranged for determining a voltage level of a supply voltage supplied to a power plane of the PCB by referring to the sensing result.

Abstract: A power management circuit includes a voltage sensing circuit and a supply voltage adjusting circuit. The voltage sensing circuit is arranged for sensing a plurality of voltages respectively of a plurality of nodes of a PCB to generate a sensing result. The supply voltage adjusting circuit is coupled to the voltage sensing circuit, and is arranged for determining a voltage level of a supply voltage supplied to a power plane of the PCB by referring to the sensing result.

Abstract: An automatic correction device of a vehicle display system and method thereof, comprising following steps: firstly, transform an image of road in front into projection information, to calculate a coordinate model, then detect facial features of a driver, to calculate a face rotation angle and a facial features 3-D position of said driver, to estimate a position field of view for said driver looking to front. Then, said position field of view is substituted into an image overlap projection transformation formula, to generate an overlap error correction parameter. Subsequently, utilize said overlap error correction parameter to correct and update said coordinate model. Finally, utilize a display unit to project said corrected coordinate model to front of said driver, so that projection position of said coordinate model overlaps said position field of view of said driver.

Abstract: A power management circuit includes a voltage sensing circuit and a supply voltage adjusting circuit. The voltage sensing circuit is arranged for sensing a plurality of voltages respectively of a plurality of nodes of a PCB to generate a sensing result. The supply voltage adjusting circuit is coupled to the voltage sensing circuit, and is arranged for determining a voltage level of a supply voltage supplied to a power plane of the PCB by referring to the sensing result.

Abstract: The present invention discloses an information display system automatically adjusting the projection area and a method thereof. The method comprises steps: using a detection module to capture images of a driver and measure a distance between the detection module and the driver; recognize facial features of a driver (including a position of the driver's eye, a rotation angle of the driver's face, and a direction the driver fixates) to estimate a required displacement of the projection area on the windshield (i.e. the region inside the visual field of the driver); moving or rotating the projection device according to the required displacement of the projection area to make the projection device project images of driving information onto a correct region on the windshield.