Patents by Inventor Yu-Ting Cheng

Yu-Ting Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microstructures
    Patent number: 6436853
    Abstract: A method for making a microstructure assembly, the method including the steps of providing a first substrate and a second substrate; depositing an electrically conductive material on the second substrate; contacting the second substrate carrying the electrically conductive material with the first substrate; and then supplying current to the electrically conductive material to locally elevate the temperature of said electrically conductive material and cause formation of a bond between the first substrate and the second substrate.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: August 20, 2002
    Assignee: University of Michigan
    Inventors: Liwei Lin, Yu-Ting Cheng, Khalil Najafi, Kensall D. Wise
  • Process for making microstructures and microstructures made thereby
    Publication number: 20010021570
    Abstract: A method for making a microstructure assembly, the method including the steps of providing a first substrate and a second substrate; depositing an electrically conductive material on the second substrate; contacting the second substrate carrying the electrically conductive material with the first substrate; and then supplying current to the electrically conductive material to locally elevate the temperature of said electrically conductive material and cause formation of a bond between the first substrate and the second substrate.
    Type: Application
    Filed: February 27, 2001
    Publication date: September 13, 2001
    Inventors: Liwei Lin, Yu-Ting Cheng, Khalil Najafi, Kensall D. Wise
  • Process for making microstructures and microstructures made thereby
    Patent number: 6232150
    Abstract: A method for making a microstructure assembly, the method including the steps of providing a first substrate and a second substrate; depositing an electrically conductive material on the second substrate; contacting the second substrate carrying the electrically conductive material with the first substrate; and then supplying current to the electrically conductive material to locally elevate the temperature of said electrically conductive material and cause formation of a bond between the first substrate and the second substrate.
    Type: Grant
    Filed: December 3, 1998
    Date of Patent: May 15, 2001
    Assignee: The Regents of the University of Michigan
    Inventors: Liwei Lin, Yu-Ting Cheng, Khalil Najafi, Kensall D. Wise