Patents by Inventor Yu-Ting LU

Yu-Ting LU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
    Publication number: 20180061727
    Abstract: A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.
    Type: Application
    Filed: August 11, 2017
    Publication date: March 1, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Li-Hao LYU, Chieh-Ju TSAI, Yu-Kai LIN, Wei-Ming HSIEH, Yu-Pin TSAI, Man-Wen TSENG, Yu-Ting LU