Patents by Inventor Yu-To Chen

Yu-To Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11089323
    Abstract: A method and apparatus for a video coding system with the current picture referencing (CPR) mode enabled are disclosed. According to one method, the luma and chroma blocks of the current image are jointly coded using a same coding unit (CU) structure if the CPR mode is selected for the luma and the chroma blocks. Alternatively, if the luma and chroma components are partitioned into the luma and the chroma blocks separately using separate CU structures, the luma and chroma blocks are encoded or decoded using a coding mode selected from a coding mode group excluding the CPR mode. According to another method, the luma and chroma blocks of the current image are coded separately using a different CU structure if the CPR mode is selected for the luma and chroma blocks. In yet another method, reconstructed reference data is disclosed for the CPR mode with CU equal to PU.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: August 10, 2021
    Assignee: MEDIATEK INC.
    Inventors: Tzu-Der Chuang, Ching-Yeh Chen, Yu-Chen Sun, Yu-Wen Huang, Shan Liu, Xiaozhong Xu
  • Patent number: 11088079
    Abstract: A package structure includes a first through via structure formed in a substrate and a semiconductor die formed below the first through via structure. The package structure further includes a conductive structure formed in a passivation layer over the substrate. The conductive structure includes a first via portion and a second via portion, the first via portion is directly over the first through via structure, and there is no conductive material directly below and in direct contact with the second via portion.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: August 10, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Kai Cheng, Tsung-Shu Lin, Tsung-Yu Chen, Hsien-Pin Hu, Wen-Hsin Wei
  • Patent number: 11088203
    Abstract: An RRAM cell stack is formed over an opening in a dielectric layer. The dielectric layer is sufficiently thick and the opening is sufficiently deep that an RRAM cell can be formed by a planarization process. The resulting RRAM cells may have a U-shaped profile. The RRAM cell area includes contributions from a bottom portion in which the RRAM cell layers are stacked parallel to the substrate and a side portion in which RRAM cell layers are stacked roughly perpendicular to the substrate. The combined side and bottom portions of the curved RRAM cell provide an increased area in comparison to a planar cell stack. The increased area lowers forming and set voltages for the RRAM cell.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: August 10, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Te-Hsien Hsieh, Tzu-Yu Chen, Kuo-Chi Tu, Yuan-Tai Tseng
  • Patent number: 11088048
    Abstract: The present disclosure provides a semiconductor structure. The semiconductor includes a substrate, a block bonded on the substrate, a first die bonded on the block, a second die disposed over the first die, and a heat spreader covering the block and having a surface facing toward and proximal to the block. A thermal conductivity of the heat spreader is higher than a thermal conductivity of the block.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: August 10, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chi-Hsi Wu, Wensen Hung, Tsung-Shu Lin, Shih-Chang Ku, Tsung-Yu Chen, Hung-Chi Li
  • Patent number: 11088137
    Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a first region and a second region; forming a first fin-shaped structure on the first region and a second fin-shaped structure on the second region; forming a patterned mask on the second region; and performing a process to enlarge the first fin-shaped structure so that the top surfaces of the first fin-shaped structure and the second fin-shaped structure are different.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: August 10, 2021
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Hao Lin, Hsin-Yu Chen, Shou-Wei Hsieh
  • Publication number: 20210242119
    Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a redistribution structure, a circuit substrate, and an insulating encapsulation. The redistribution structure includes a first under-bump metallization (UBM) pattern covered by a first dielectric layer, and the first UBM pattern includes a surface substantially leveled with a surface of the first dielectric layer. The circuit substrate is electrically coupled to the redistribution structure through a conductive joint disposed on the surface of the first UBM pattern. The insulating encapsulation is disposed on the redistribution structure to cover the circuit substrate.
    Type: Application
    Filed: June 29, 2020
    Publication date: August 5, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kuan-Lin Ho, Chin-Liang Chen, Jiun-Yi Wu, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen
  • Publication number: 20210239941
    Abstract: A photographing optical lens assembly includes seven lens elements, which are, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The second lens element has positive refractive power. The sixth lens element with positive refractive power has an image-side surface being convex in a paraxial region thereof. The seventh lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof and including at least one convex critical point in an off-axis region thereof.
    Type: Application
    Filed: April 20, 2021
    Publication date: August 5, 2021
    Inventors: Hsiang-Chi TANG, Chun-Yen CHEN, Hung-Shuo CHEN, Wei-Yu CHEN
  • Publication number: 20210242092
    Abstract: A semiconductor device includes a first gate structure that includes a first interfacial layer, a first gate dielectric layer disposed over the first interfacial layer, and a first gate electrode disposed over the first gate dielectric layer. The semiconductor device also includes a second gate structure that includes a second interfacial layer, a second gate dielectric layer disposed over the second interfacial layer, and a second gate electrode disposed over the second gate dielectric layer. The first interfacial layer contains a different amount of a dipole material than the second interfacial layer.
    Type: Application
    Filed: July 10, 2020
    Publication date: August 5, 2021
    Inventors: Yen-Yu Chen, Chung-Liang Cheng
  • Publication number: 20210241321
    Abstract: Disclosed is a computer-implemented method for requesting and transmitting marketing images or video. The method includes receiving a communication from a remote terminal, identifying a user or a group of users that are associated with the received communication, identifying data associated with the identified user or the group of users, identifying goods or services using the identified data associated with the identified user or group of users, requesting marketing images or video from a marketing images or video supplying system that are relating to the identified goods or services, receiving the requested marketing images or video from the marketing images or video supplying system, and transmitting the received marketing images or video to the remote terminal.
    Type: Application
    Filed: April 23, 2019
    Publication date: August 5, 2021
    Inventors: Jim DOWNING, Vikesh SHAH, Yu CHEN, Tom ADEYOOLA
  • Publication number: 20210240903
    Abstract: An IC layout diagram generation system includes a processor and a non-transitory, computer readable storage medium including computer program code for one or more programs. The non-transitory, computer readable storage medium and the computer program code are configured to, with the processor, cause the system to align a border segment of a cell at a predetermined location relative to a plurality of second metal layer tracks, position the cell relative to a first metal layer cut region alignment pattern based on the plurality of second metal layer tracks, overlap the cell with a first metal layer cut region based on the first metal layer cut region alignment pattern, and generate an IC layout diagram of an IC device based on the cell and the first metal layer cut region.
    Type: Application
    Filed: April 22, 2021
    Publication date: August 5, 2021
    Inventors: Jung-Chan YANG, Ting Yu CHEN, Li-Chun TIEN, Fong-Yuan CHANG
  • Publication number: 20210241090
    Abstract: A processing system including at least one processor may obtain operational data from a radio access network (RAN), format the operational data into state information and reward information for a reinforcement learning agent (RLA), processing the state information and the reward information via the RLA, where the RLA comprises a plurality of sub-agents, each comprising a respective neural network, each of the neural networks encoding a respective policy for selecting at least one setting of at least one parameter of the RAN to increase a respective predicted reward in accordance with the state information, and where each neural network is updated in accordance with the reward information. The processing system may further determine settings for parameters of the RAN via the RLA, where the RLA determines the settings in accordance with selections for the settings via the plurality of sub-agents, and apply the plurality of settings to the RAN.
    Type: Application
    Filed: January 31, 2020
    Publication date: August 5, 2021
    Inventors: Jie Chen, Wenjie Zhao, Ganesh Krishnamurthi, Huahui Wang, Huijing Yang, Yu Chen
  • Publication number: 20210241500
    Abstract: Disclosed is a computer-implemented method for providing photorealistic changes for a digital image. The method includes receiving a digital image of dressable model, receiving digital cutout garment textures that are indexed according to an outfitting layering order and aligned with body shape and pose of the dressable model, receiving binary silhouettes of the digital cutout garment textures, generating a garment layer index mask by compositing the binary silhouettes of the digital cutout garment textures indexed according to the outfitting layering order, receiving a composite image obtained by overlaying the digital cutout garment textures according to the indexed outfitting layering order on the digital image of the dressable model, inputting the composite image and the garment layer index mask into a machine learning system for providing photorealistic changes, and receiving from the machine learning system a digital file including photorealistic changes for application to the composite image.
    Type: Application
    Filed: April 23, 2019
    Publication date: August 5, 2021
    Inventors: Yu CHEN, Jim DOWNING, Tom ADEYOOLA, Sukrit SHANKER
  • Publication number: 20210238522
    Abstract: A biomimetic system is provided for evaluating an effect of a test sample in vitro, and includes at least one organ chip, at least one medium container, a liquid pump, a nebulizer, a gas pump, and a chamber device. The liquid pump is provided to drive a liquid medium in the medium container to flow into a lower sub-channel of the organ chip and then to be discharged back into the medium container. The nebulizer is provided for atomizing a test solution including the test sample into an aerosol. The gas pump is provided to generate a pressurized gas which force the aerosol to flow out of a chamber of the chamber device and then to flow through an upper sub-channel of the organ chip.
    Type: Application
    Filed: June 11, 2020
    Publication date: August 5, 2021
    Inventors: Guan-Yu Chen, Jia-Wei Yang, Ko-Chih Lin
  • Publication number: 20210242337
    Abstract: Various embodiments of the present disclosure are directed toward an integrated chip including an undoped layer overlying a substrate. A first barrier layer overlies the undoped layer. A doped layer overlies the first barrier layer. Further, a second barrier layer overlies the first barrier layer, where the second barrier layer is laterally offset from a perimeter of the doped layer by a non-zero distance. The first and second barrier layers comprise a same III-V semiconductor material. A first atomic percentage of a first element within the first barrier layer is less than a second atomic percentage of the first element within the second barrier layer.
    Type: Application
    Filed: May 12, 2020
    Publication date: August 5, 2021
    Inventors: Yun-Hsiang Wang, Chun Lin Tsai, Jiun-Lei Jerry Yu, Po-Chih Chen, Chia-Ling Yeh, Ching Yu Chen
  • Publication number: 20210241738
    Abstract: A method for adjusting accompaniment music is disclosed. The method transposes the musical key of at least one section of the accompaniment music such that a song will have different musical key transpositions for different sections of the accompaniment music, so that singers whose vocal ranges are narrow can sing songs after the adjustment.
    Type: Application
    Filed: December 9, 2020
    Publication date: August 5, 2021
    Inventors: Hsuan-Yu CHEN, Chun-Lung CHEN, I-Ting LEE, Kuan-Li CHAO, Kuo-Wei KAO, Neo Bob Chih-Yung YOUNG, Kuo-Ping YANG
  • Publication number: 20210238731
    Abstract: A physical vapor deposition (PVD) target for performing a PVD process is provided. The PVD target includes a backing plate and a target plate coupled to the backing plate. The target plate includes a sputtering source material and a dopant, with the proviso that the dopant is not impurities in the sputtering source material. The sputtering source material includes a diffusion barrier material.
    Type: Application
    Filed: December 8, 2020
    Publication date: August 5, 2021
    Inventors: Chia-Hsi WANG, Yen-Yu CHEN, Yi-Chih CHEN, Shih Wei BIH
  • Publication number: 20210239736
    Abstract: The present disclosure provides a wafer test system and methods thereof. The test system includes a probe apparatus, a data server, an automation subsystem, and a probe mark assessment subsystem. The probe apparatus includes a probe card, a tester, and a camera. The probe card includes probe pins for contacting test pads in the wafer, and the camera captures an image of the test pads. The automation subsystem obtains an image specification from the probe apparatus and triggers an automated assessment of a probe mark in the image of the test pads. The probe mark assessment subsystem performs the automated assessment of the probe mark in the image of the test pads. The probe mark assessment subsystem performs an image-processing operation to obtain a probe mark assessment result, and the automation subsystem stops the probe apparatus if the probe mark assessment result indicates a probe test failure.
    Type: Application
    Filed: January 31, 2020
    Publication date: August 5, 2021
    Inventors: CHIA-LIN TSAI, WUN-YE KU, TIEN-YU CHEN, CHIA-YI LIN
  • Publication number: 20210242057
    Abstract: An overhead transport vehicle is described for association with an Automated Material Handling System (AMHS). The overhead transport vehicle provides features to the AMHS by which the AMHS is able to reduce a number of manual urgent lot rescues by the fab operator when a logistic algorithm controlling traffic in the AMHS is unable to transport the front opening unified pods (FOUP) from one tool to the subsequent tool in the sequence of the process steps within the q-time due to unexpected problems. An indicator on the overhead transport vehicle which helps the fab operator with spotting a lot in trouble is described. A backup power source on the overhead transport vehicle used in case of a main power failure is also described.
    Type: Application
    Filed: December 18, 2020
    Publication date: August 5, 2021
    Inventors: Yen Le LEE, Yen-Yu CHEN, Wei Chih CHEN, Tai Hsiang LIAO, Kai-Ping JHAN
  • Patent number: 11082687
    Abstract: A video decoder selects a source affine block. The source affine block is an affine-coded block that spatially neighbors a current block. Additionally, the video decoder extrapolates motion vectors of control points of the source affine block to determine motion vector predictors for control points of the current block. The video decoder inserts, into an affine motion vector predictor (MVP) set candidate list, an affine MVP set that includes the motion vector predictors for the control points of the current block. The video decoder also determines, based on an index signaled in a bitstream, a selected affine MVP set in the affine MVP set candidate list. The video decoder obtains, from the bitstream, motion vector differences (MVDs) that indicate differences between motion vectors of the control points of the current block and motion vector predictors in the selected affine MVP set.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: August 3, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Yi-Wen Chen, Wei-Jung Chien, Li Zhang, Yu-Chen Sun, Jianle Chen, Marta Karczewicz
  • Patent number: 11079496
    Abstract: Precise point positioning (PPP) method and a PPP device are provided. The precise point positioning method includes obtaining a first satellite signal of a target satellite and a second satellite signal of a reference satellite. The first satellite signal and the second satellite signal are combined to eliminate a signal error and obtain a combined satellite signal. A smoothing process is performed on a code data of the combined satellite signal, to obtain a satellite positioning data for positioning process. The satellite positioning data includes modified code data and modified carrier-phase data.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: August 3, 2021
    Assignee: Industrial Technology Research Institute
    Inventors: Yi-Huai Hsu, Ying-Yu Chen, Hao-Yu Wang, Jyh-Ching Juang