Abstract: A side-inserted cord rolling device for a non-pull cord window blind includes a base, first and second wheels disposed on the base and respectively located near an end plate and an opening provided at two ends of the base, a torsion spring, and two lift transmission cords. The first wheel has top, middle and bottom layers separated by disc portions. The torsion spring connects the bottom layer of the first wheel and the second wheel. An end of the lift transmission cords are connected to the top and middle layers of the first wheel respectively. Another end of the lift transmission cords are inserted through the opening of the base to be located out of the base for being connected with a bottom beam.

Abstract: A method includes reserving a routing track within a cell, the cell includes signal lines for connection to elements within the cell, the cell further includes a plurality of routing tracks, the reserved routing track is one of the plurality of routing tracks, and the reserved routing track is free of the signal lines. The method includes placing the cell in a chip-level layout, wherein the chip-level layout includes a plurality of power rails. The method includes determining whether any of the plurality of power rails overlaps with any of the plurality of routing tracks other than the reserved routing track. The method includes adjusting a position of the cell in the chip-level layout in response to a determination that at least one power rail of the plurality of power rails overlaps with at least one routing track of the plurality of routing tracks other than the reserved routing track.

Abstract: A light bulb includes a housing, an illuminating component, a driving circuit board, a light transmitting component and a lens. The housing has a circumferential opening and a cavity chamber therein. The illuminating component is disposed within the cavity chamber. The driving circuit board is disposed inside the cavity chamber. The driving circuit board is also electrically coupled to the illuminating component. In addition, the driving circuit board drives the illuminating component while being powered up. The light transmitting component is disposed within the cavity chamber and affixed to the illuminating component. The light transmitting component includes a plurality of transmitting microstructures on its surface that uniformly distribute lights emitted from the illuminating component along an axial direction of the light bulb. The lens is disposed within the cavity chamber. The lens also focuses the uniformly distributed lights on a predetermined range along the axial direction of the light bulb.

Abstract: A liquid level sensing device and a packing structure are provided. An outer tube fastener is connected to a signal module. A protective soft tube is connected to the outer tube fastener. An end of a double-layer flexible tube is connected to the protective soft tube. The double-layer flexible tube includes a flexible conductive outer tube and a fluorine-containing plastic inner tube coaxially attached in the flexible conductive outer tube. The fluorine-containing plastic inner tube is made of a flexible material. The flexible conductive outer tube is made of a conductive flexible material to form a grounding layer. A sensing module is disposed in the fluorine-containing plastic inner tube. A magnetic floater is assembled outside the double-layer flexible tube. A hanger is connected to another end of the double-layer flexible tube.

Abstract: A computer implemented method, computer system and computer program product are provided for acoustic event detection in polyphonic acoustic data, according to the method, polyphonic acoustic data is inputted by one or more processing units into a trained neural network trained by labeled monophonic acoustic data, a first output from a hidden layer of the trained neural network is obtained by one or more processing units, and at least one acoustic classification of the polyphonic acoustic data is determined by one or more processing units based on the first output and a feature dictionary learnt from the trained neural network.

Abstract: A method for forming a bond pad structure includes forming an interconnect structure on a semiconductor device, forming a passivation layer on the interconnect structure, forming at least one opening through the passivation layer, forming an oxidation layer at least in the opening, and forming a pad metal layer on the oxidation layer. A portion of the interconnect structure is exposed by the at least one opening.

Abstract: Disclosed is a method of manufacturing a three dimensional (3D) metal-insulator-metal (MIM) capacitor in the back end of line, which can provide large and tunable capacitance values and meanwhile, does not interfere with the existing BEOL fabrication process.

Abstract: Provided is a heterojunction bipolar transistor (HBT), including a collector layer. The collector layer includes a bandgap graded. A quasi-electric field generated by the bandgap graded will enable electrons in the bandgap graded layer to be accelerated.

Abstract: A high electron mobility transistor (HEMT) device and a method of forming the same are provided. The method includes forming a first III-V compound layer over a substrate. A second III-V compound layer is formed over the first III-V compound layer. The second III-V compound layer has a greater band gap than the first III-V compound layer. A third III-V compound layer is formed over the second III-V compound layer. The third III-V compound layer and the first III-V compound layer comprise a same III-V compound. A passivation layer is formed along a topmost surface and sidewalls of the third III-V compound layer. A fourth III-V compound layer is formed over the second III-V compound layer. The fourth III-V compound layer has a greater band gap than the first III-V compound layer.

Abstract: An opening structure of a tool grip includes a left grip and a right grip that are intersected and pivoted. An elastic connecting strap is provided between the left and right grips. The left grip has at least two left studs. The right grip has at least two right studs. The connecting strap has a length greater than a distance between the left and right grips. One end of the connecting strap has at least two left recessed portions for engagement of the left studs. Another end of the connecting strap has at least two right recessed portions for engagement of the right studs. By selecting the position where the left recessed portions are engaged with the left studs and the position where the right recessed portions are engaged with the right studs, a force that the connecting strap pushes against the left and right grips to open is adjustable.

Abstract: A foldable display device, including a display panel, a pad portion, and a driving element, is provided. The display panel has a display region and a peripheral region connected to at least one side of the display region. The pad portion is disposed in the peripheral region. The driving element is electrically connected to the pad portion. A first display region folding line, extending along a first direction, is provided in the display region to divide the display region into a first sub-display region and a second sub-display region. A first peripheral region folding line and a second peripheral region folding line, extending along a second direction, are parallelly disposed in the peripheral region. A first notch is disposed at a position in the peripheral region. Along the first direction, the first notch has a first folding interval. Along the second direction, the first notch has a second folding interval.

Abstract: Extreme ultraviolet (EUV) lithography systems are provided. A EUV scanner is configured to perform a lithography exposure process in response to EUV radiation. A light source is configured to provide the EUV radiation to the EUV scanner. A measuring device is configured to measure concentration of debris caused by unstable target droplets in the chamber. A controller is configured to adjust a first gas flow rate and a second gas flow rate in response to the measured concentration of the debris and a control signal from the EUV scanner. A exhaust device is configured to extract the debris out of the chamber according to the first gas flow rate. A gas supply device is configured to provide a gas into the chamber according to the second gas flow rate. The control signal indicates the lithography exposure process is completed.

Abstract: A ceiling fan includes a fan body, a sensing unit and a control unit. The fan body includes a base seat, a plurality of fan blades mounted to the base seat, and a motor mounted to the base seat for driving rotation of the fan blades about the base seat. The sensing unit includes an outer casing, a room temperature sensor, and a body temperature sensor. The control unit is mounted to the fan body, in communication with the room temperature sensor, the body temperature sensor and the motor, and operable to adjust a rotational speed of the fan blades by controlling the motor according to a room temperature and a body temperature respectively sensed by the room temperature sensor and the body temperature sensor.

Abstract: A method and apparatus are disclosed from the perspective of a UE (User Equipment). In one embodiment, the method includes transmitting a Scheduling Request (SR) on a first uplink bandwidth part (BWP). The method further includes receiving a response for the SR on a first downlink BWP. The method also includes detecting a beam failure when using the first uplink BWP and the first downlink BWP. In addition, the method includes transmitting a beam failure recovery (BFR) request to a network node on the first uplink BWP. Furthermore, the method includes receiving a control signalling on a second downlink BWP from the network node after transmitting the BFR request, wherein the control signalling is a response for the BFR request and the second downlink BWP is associated with the first uplink BWP.

Abstract: A workpiece holder includes a chuck body and a seal ring. The chuck body includes a receiving surface configured to receive a workpiece and at least one vacuum port configured to apply a vacuum seal. The seal ring surrounds a side surface of the chuck body. A top surface of the seal ring is higher than the receiving surface of the chuck body, and the workpiece leans against the seal ring when the vacuum seal is applied between the workpiece and the chuck body.

Abstract: An electronic cylinder lock has a main body. The main body is provided with a rotary cam. A first shaft is connected to the rotary cam. The first shaft has a first engaging portion. The main body is provided with a second shaft. The second shaft has a second engaging portion. A control lever is connected to the second shaft. A driving source is connected to the control lever. The driving source can drive the control lever to pull the second shaft to approach the first shaft, so that the second engaging portion is engaged with the first engaging portion, thereby improving the joint stability between the second engaging portion and the first engaging portion.

Abstract: A fabricating method of a non-enzyme sensor element includes a printing step, a coating step and an electroplating step. In the printing step, a conductive material is printed on a surface of a substrate to form a working electrode, a reference electrode and an auxiliary electrode, and a porous carbon material is printed on the working electrode to form a porous carbon layer. In the coating step, a graphene film material is coated on the porous carbon layer of the working electrode to form a graphene layer. In the electroplating step, a metal is electroplated on the graphene layer by a pulse constant current to form a catalyst layer including a metal oxide.

Abstract: A semiconductor device and a fabrication method thereof are provided. The semiconductor device includes a semiconductor structure, a dielectric layer, a metal-semiconductor compound film and a cover layer. The semiconductor structure has an upper surface and a lateral surface. The dielectric layer encloses the lateral surface of the semiconductor structure and exposes the upper surface of the semiconductor structure. The metal-semiconductor compound film is on the semiconductor structure, wherein the dielectric layer exposes a portion of a surface of the metal-semiconductor compound film. The cover layer encloses the portion of the surface of the metal-semiconductor compound film exposed by the dielectric layer, and exposes the dielectric layer.

Abstract: An imaging optical lens assembly includes seven lens elements, the seventh lens elements being, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, and a seventh lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The second lens element has negative refractive power. The seventh lens element has an image-side surface being concave in a paraxial region thereof and having a critical point in an off-axis region thereof. The image-side surface and an object-side surface of the seventh lens element are both aspheric.