Patents by Inventor Yu

Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250062867
    Abstract: Systems, methods, and devices for wireless sidelink operations may include a first device including a transceiver and one or more processors configured to establish, via the transceiver, a sidelink connection with a second UE. The first UE may determine to operate in a carrier aggregation mode, for communication via the sidelink connection. The first UE may operate the sidelink connection according to a set of predefined parameters per component carrier (CC), responsive to determining to operate in the carrier aggregation mode.
    Type: Application
    Filed: July 10, 2024
    Publication date: February 20, 2025
    Applicant: Meta Platforms Technologies, LLC
    Inventors: Suhwan Lim, Liwen Yu, Curt Wong, Zhu Ji
  • Publication number: 20250062454
    Abstract: A top cover assembly comprises: a body, the body being provided with a first electrode hole and a second electrode hole in a thickness direction of the body itself, and the first electrode hole and the second electrode hole being spaced in a length direction of the body; and a protruding portion protruding in the thickness direction of the body to be formed on a side surface of the body that is configured to face an interior of the shell, the protruding portion being located between the first electrode hole and the second electrode hole in the length direction of the body, wherein the protruding portion is located on a side close to the first electrode hole in the length direction of the body, and the length direction of the body is perpendicular to the thickness direction of the body.
    Type: Application
    Filed: November 6, 2024
    Publication date: February 20, 2025
    Inventors: Bangyong WANG, Chunmei SHI, Honggang YU, Yongfeng XIE
  • Publication number: 20250062082
    Abstract: An illuminated touchpad includes a panel, a light guide layer and a circuit board. The panel includes a first light transmitting region and a second light transmitting region. The light guide layer includes a first light guide region and a second light guide region. The circuit board includes a controller, a touch module, a first light source and a second light source. The controller controls the first light source to emit light, such that the first light guide region guides the light emitted by the first light source to the first light transmitting region. When the touch module senses that the first light transmitting region is touched, the controller controls the second light source to emit light, such that the second light guide region guides the light emitted by the second light source to the second light transmitting region.
    Type: Application
    Filed: August 14, 2024
    Publication date: February 20, 2025
    Applicant: DARFON ELECTRONICS CORP.
    Inventors: Heng-Yi Huang, Chao-Yu Chen, Hsin-Cheng Ho
  • Publication number: 20250062525
    Abstract: An antenna comprises a first radiation part, a second radiation part, a feed part, and a ground part. The first radiation part comprises a first radiator. The second radiation part comprises a second radiator. A first side of the feed part bends upward to form the first radiator, which is a part of the first radiation part. A second side of the feed part bends upward to form the second radiator, which is a part of the second radiation part. The first side is arranged relative to the second side. A height difference between the first radiator and the second radiator in the first direction is within a preset range. The first direction is perpendicular to a plane where the feed part is located. A vehicle is also provided.
    Type: Application
    Filed: October 9, 2023
    Publication date: February 20, 2025
    Inventors: CHING-LING WU, HSIANG-NENG WEN, YUNG-YU TAI, CHIH-WEI LIAO
  • Publication number: 20250062634
    Abstract: A power management system and a power management method that are adapted to an electronic device are provided. The power management system includes an alternative current power supply, a first battery, a first charger, a second battery, a second charger, and a control circuit. The control circuit is electrically connected to the first charger and the second charger. The control circuit is configured to detect capacities of the first battery and the second battery, to set a first system power of the first charger as a first rated power, and to set a second system power of the second charger to be less than the first rated power. The control circuit enables a turbo boost mode of the first charger and disables a turbo boost mode of the second charger.
    Type: Application
    Filed: June 19, 2024
    Publication date: February 20, 2025
    Inventor: CHIEN-PANG YU
  • Publication number: 20250061775
    Abstract: The present disclosure relates generally to a gaming system, device, and method supportive of playing a game of chance and/or skill in a centralized gaming system. Illustratively, a method may include receiving information from a centralized gaming server describing a prize value to award a player in response to the player playing a game at a gaming device; determining a game outcome of the game results in a payout value that is different from the prize value; and providing the player with a split award that reconciles the difference between the prize value and the payout value.
    Type: Application
    Filed: November 4, 2024
    Publication date: February 20, 2025
    Inventors: Nicholas Scheffel, Gunnar Wambaugh, Xin Yu
  • Publication number: 20250062067
    Abstract: A permanent magnet manufacturing method includes at least a magnetization target forming step of molding a magnetization target by applying a predetermined pressure to a magnet powder and a thermosetting resin, and a heating step of heating the magnet powder to the Curie point or higher while permanent magnets of a field magnet part are brought close to the magnetization target placed on a base member to magnetize the magnet powder and melting and curing the thermosetting resin to allow the magnetization target to fixedly adhere to the base member.
    Type: Application
    Filed: December 9, 2022
    Publication date: February 20, 2025
    Inventors: Yu OKAWARA, Haruhiro KOMURA
  • Publication number: 20250062222
    Abstract: The present disclosure is related to a semiconductor device and a fabricating method thereof, and the semiconductor device includes a first dielectric layer and a first conductive structure. The first dielectric layer includes a stacked structure including a low-k dielectric layer, an etching stop layer, and a carbon-rich dielectric layer between the low-k dielectric layer and the etching stop layer, wherein a carbon concentration within the carbon-rich dielectric layer is above 15%. The first conductive structure is disposed in the first dielectric layer.
    Type: Application
    Filed: October 13, 2023
    Publication date: February 20, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Tai-Cheng Hou, Da-Jun Lin, Fu-Yu Tsai, Bin-Siang Tsai
  • Publication number: 20250062096
    Abstract: A degree of freedom in an arrangement position of an electric field deflector is improved and a chromatic aberration is prevented from occurring. A charged particle beam apparatus includes electric field deflectors 130a and 130b and magnetic field deflectors 140a and 140b. Each of the electric field deflectors 130a and 130b is disposed on a plane different from a plane orthogonal to an optical axis of the beam 107 on which the magnetic field deflectors 140a and 140b are disposed.
    Type: Application
    Filed: January 18, 2022
    Publication date: February 20, 2025
    Inventors: Naoto ITO, Yu YAMAZAWA, Tsunenori NOMAGUCHI
  • Publication number: 20250062125
    Abstract: Disclosed is a substrate processing method including: a substrate loading operation of loading a substrate into a processing space provided by a body; a heating operation of placing the substrate, which has been loaded into the processing space, on a heating chuck and heating the substrate; and an atmosphere changing operation of changing an atmosphere of the processing space, in which the atmosphere changing operation includes: a gas discharging operation of injecting atmosphere changing gas in a state where the substrate is located closer to a baffle than in the heating operation, in which the baffle is provided on a top side of the heating chuck to face the heating chuck and injects the atmosphere changing gas; and a substrate lowering operation of lowering and placing the substrate onto the heating chuck while maintaining the injection of the atmosphere changing gas.
    Type: Application
    Filed: August 2, 2024
    Publication date: February 20, 2025
    Applicant: SEMES CO., LTD.
    Inventors: Gyeong Won SONG, Hee Man AHN, Sung Hun EOM, Jae Seung YU, Gu Won SEON
  • Publication number: 20250062127
    Abstract: A method of a semiconductor-on-insulator structure includes the following steps. A semiconductor donor substrate is provided. A first implantation process is performed to form an exfoliation layer of the semiconductor donor substrate with a first ion concentration. A second implantation process is performed on a perimeter region of the exfoliation layer to form a high concentration region of the exfoliation layer with a second ion concentration higher than the first ion concentration. The semiconductor donor substrate is bonded to a semiconductor handle substrate, so that the exfoliation layer with the high concentration region is bonded to the semiconductor handle substrate. An annealing process is performed to separate the exfoliation layer from the rest of the semiconductor donor substrate.
    Type: Application
    Filed: August 15, 2023
    Publication date: February 20, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Su-Chun Yang, Jui Hsuan Tsai, Jih-Churng Twu, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20250062139
    Abstract: Embodiments of the present disclosure provide a furnace for semiconductor processing that includes an inner tube defining a reaction chamber and including a sidewall defined along a longitudinal axis of the inner tube and including one or more slits defined through the sidewall in a radial direction with respect to the longitudinal axis. The one or more slits include at least one of a first slit with a width in a range between 10 mm and 100 mm, or a plurality of separate slits with a total number in a range between 2 and 15. The inner tube includes a closed end substantially enclosing the reaction chamber and an open end opposite the closed end with respect to the longitudinal axis. The reaction chamber is configured to be loaded with one or more semiconductor wafers via the open end.
    Type: Application
    Filed: August 17, 2023
    Publication date: February 20, 2025
    Inventors: De-Wei YU, Chien-Chia CHENG, Ming-Hua YU, Hsueh-Chang SUNG, Chii-Horng LI
  • Publication number: 20250061874
    Abstract: A server includes a chassis and a plurality of hard disk drive modules. The chassis includes a body, a partition, a cover plate, and at least one sound deadening structure. The body includes an opening and an accommodating space. The partition is disposed at the opening. The partition includes a first side surface, a second side surface opposite to the first side surface, and at least one flow channel. The first side surface faces the accommodating space, and the flow channel penetrates the first and the second side surfaces. The cover plate is disposed at the opening. The cover plate includes a plurality of ventilation holes. The sound deadening structure is disposed between the second side surface of the partition and the cover plate. The sound deadening structure includes a sound absorbing element and a reflecting element. The hard disk drive modules are accommodated in the accommodating space.
    Type: Application
    Filed: May 6, 2024
    Publication date: February 20, 2025
    Inventors: Chih-Chung HO, Chih-Wei YU
  • Publication number: 20250061888
    Abstract: The present application provides a model training method and apparatus, a speech-to-speech translation method and apparatus, and a medium. The method includes: obtaining a speech recognition sample and a real speech-to-speech translation sample; generating a pseudo-labeled speech-to-speech translation sample based on the speech recognition sample; and training a speech-to-speech translation model based on the pseudo-labeled speech-to-speech translation sample and the real speech-to-speech translation sample. Therefore, the model training precision can be improved.
    Type: Application
    Filed: April 14, 2023
    Publication date: February 20, 2025
    Inventors: Qianqian Dong, Fengpeng YUE, Yu Ting Ko, Mingxuan Wang, Qibing Bai
  • Publication number: 20250061951
    Abstract: A control gate voltage generating circuit for a non-volatile memory is provided. After the non-volatile memory leaves the factory, the control gate voltage is appropriately adjusted by the control gate voltage generating circuit according to the characteristics changes of the memory cells. When the read action is performed, the control gate voltage generating circuit provides the adjusted control gate voltage to the control gate line of the array structure. The magnitude of the reference current can be maintained in the range between the read current in the erase state and the read current in the program state. Consequently, the storage state of the selected memory cell can be accurately determined, and the life time of the non-volatile memory will be extended.
    Type: Application
    Filed: August 6, 2024
    Publication date: February 20, 2025
    Inventor: Yu-Hsuan CHENG
  • Publication number: 20250062716
    Abstract: A foldable solar panel includes a power generation layer (100) and two adhesive film layers (200) located on two opposite sides of the power generation layer (100). The power generation layer (100) includes a plurality of sub-power generation panels (110) arranged at intervals and an interconnection wire (120). A bent region (2000) is formed in a gap between two adjacent sub-power generation panels (110). The two adjacent sub-power generation panels (110) are electrically connected by the interconnect wire (120) passing through the bent region (2000). An isolation layer (300) is arranged between the interconnect wire (120) and the adhesive film layer (200).
    Type: Application
    Filed: November 4, 2024
    Publication date: February 20, 2025
    Inventors: Yanjun ZHU, Zhongwei SUN, Huajun YU, Minhuan ZHANG
  • Publication number: 20250062725
    Abstract: Aspects of the disclosure include a method of biasing a power amplifier including applying a drain voltage to a drain of the power amplifier, determining, based on the drain voltage, a range of acceptable gate voltages to apply to the power amplifier, determining a first optimal gate voltage within the range of acceptable gate voltages, determining a second optimal gate voltage within the range of acceptable gate voltages, selecting one of the first optimal gate voltage or the second optimal gate voltage to apply to the power amplifier, and applying either the first optimal gate voltage or the second optimal gate voltage to the gate of the power amplifier.
    Type: Application
    Filed: August 2, 2024
    Publication date: February 20, 2025
    Inventors: Yu Zhu, Oleksiy Klimashov, Dylan Charles Bartle, Paul T. DiCarlo
  • Publication number: 20250062195
    Abstract: A device includes a plurality of tracks, wherein at least one of the plurality of tracks comprises a first power rail for a first voltage. The device further includes a first via in electrical contact with the power rail. The device further includes a first contact in electrical contact with the first via. The device further includes a first transistor in electrical contact with the first contact. The device further includes a second transistor in electrical isolation with the first transistor. The device further includes a second contact in electrical contact with the second transistor. The device further includes a second via in electrical contact with the second contact. The device further includes a second power rail in electrical contact with the second via, wherein the second power rail is configured to carry a second voltage.
    Type: Application
    Filed: November 5, 2024
    Publication date: February 20, 2025
    Inventors: Chih-Yu LAI, Chih-Liang CHEN, Chi-Yu LU, Shang-Syuan CIOU, Hui-Zhong ZHUANG, Ching-Wei TSAI, Shang-Wen CHANG
  • Publication number: 20250059672
    Abstract: The present disclosure relates to an ion exchange resin used in solid electrolytic polishing of metal workpieces and a use method thereof. The ion exchange resin is an organic weak acid-type cation exchange resin with a porous structure; and the ion exchange resin contains an electrolyte inside pores and/or on the surface of the ion exchange resin. The ion exchange resin is used in solid electrolytic polishing of a metal workpiece. Compared to mechanical polishing and electrolytic polishing, the ion exchange resin can fully polish parts that are not easily accessible for grinding. The method does not require a large amount of chemical oxidizing agents and electrolytes during polishing, thus being environmentally friendly and highly safe. In addition, the modified ion exchange resin can be regenerated after a period of use, greatly increasing the service life and reducing costs.
    Type: Application
    Filed: December 13, 2022
    Publication date: February 20, 2025
    Applicant: Guangdong Weshining Technology Co., Ltd.
    Inventors: Hao Pang, Bing Liao, Peiping Hong, Yue Yu
  • Publication number: 20250058728
    Abstract: Disclosed is an automobile fender, and relates to the technical field of automobile parts. A kinetic energy absorber as a whole is continuously and vertically bent at right angles, so that when impacted, a fender main body is deformed at right angle bends of the kinetic energy absorber, so as to absorb the kinetic energy to the greatest extent, reduce the deformation range of the fender main body, and avoid the fender main body from moving to and squeezing a front side of an automobile. When the impact squeezing range is large and the fender main body is driven to move to a squeezing guide piece, a mounting inserting rod is broken first, and the fender main body moves outwards along a cambered surface of the squeezing guide piece, thereby avoiding the fender main body from squeezing a door body even under continuous impact.
    Type: Application
    Filed: August 15, 2023
    Publication date: February 20, 2025
    Applicant: JCsportline Co., Ltd.
    Inventor: Chunguang YU