Patents by Inventor Yuan An

Yuan An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11853504
    Abstract: A touch panel and a touch panel operation method are disposed. The touch panel includes a flexible element and a controller. The flexible element includes a plurality of sensing electrodes. In a stacked state, a first portion of the flexible element overlaps a second portion of the flexible element. The controller for receiving an active touch signal from the plurality of sensing electrodes in the second portion of the flexible element and a non-active touch signal from the plurality of the sensing electrodes in the first portion of the flexible element. In the stacked state, the controller allows the active touch signal subject to a subsequent process.
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: December 26, 2023
    Assignee: InnoLux Corporation
    Inventors: Yuan-Lin Wu, Tsung-Han Tsai
  • Patent number: 11855220
    Abstract: A device a includes a substrate, two source/drain (S/D) features over the substrate, and semiconductor layers suspended over the substrate and connecting the two S/D features. The device further includes a dielectric layer disposed between two adjacent layers of the semiconductor layers and an air gap between the dielectric layer and one of the S/D features, where a ratio between a length of the air gap to a thickness of the first dielectric layer is in a range of 0.1 to 1.0.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Chiang Chen, Wei-Yang Lee, Chia-Pin Lin, Yuan-Ching Peng
  • Patent number: 11850094
    Abstract: This invention provides an ultrasonic transducer with a zipper array of transducing elements, which includes a tail and a head. A surface of the head is embedded with a plurality of left transducing elements and a plurality of right transducing elements, wherein each left transducing element at least partially overlaps each right transducing element in an elevation axis.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: December 26, 2023
    Inventor: Cheng-Yuan Hsieh
  • Patent number: 11854530
    Abstract: An electronic audio file is received that comprises spontaneous speech responsive to a prompt in a non-native language of a speaker. Thereafter, the electronic audio file is parsed into a plurality of spoken words. The spoken words are then normalized to remove stop words and disfluencies. At least one trained content scoring model is then used to determine an absence of pre-defined key points associated with the prompt in the normalized spoken words. A list of the determined absent key points can be generated. This list can then be displayed/caused to be displayed in a graphical user interface along with feedback to improve content completeness. Related apparatus, systems, techniques and articles are also described.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: December 26, 2023
    Assignee: Educational Testing Service
    Inventors: Su-Youn Yoon, Ching-Ni Hsieh, Klaus Zechner, Matthew Mulholland, Yuan Wang
  • Patent number: 11856831
    Abstract: The present disclosure provides a color filter substrate and a method for manufacturing the same, and a display device, and the color filter substrate includes a base substrate, a black matrix and a color filter layer located on the base substrate, a quantum dot layer located on a side of the color filter layer away from the base substrate, a barrier layer located on a side of the black matrix away from the base substrate, and a first inorganic layer, and the first inorganic layer at least includes: a first portion located between the color filter layer and the quantum dot layer; a second portion located on the base substrate and between the quantum dot layer and the barrier layer; and a third portion located on a side of the barrier layer away from the base substrate.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: December 26, 2023
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Kai Sui, Xiaolei Zhang, Zhongyuan Sun, Yuan Jia, Dapeng Xue, Lubin Shi
  • Patent number: 11854297
    Abstract: Sensing pixels each store a sensing voltage level. A method for driving the plurality of sensing pixels includes providing a plurality of readout scan signals to the plurality of sensing pixels, and providing a plurality of reset scan signals to the plurality of sensing pixels. One of the plurality of readout scan signals enables one of the plurality of sensing pixels to output the sensing voltage level stored in the one of the plurality of sensing pixels. One of plurality of reset scan signals resets the sensing voltage level stored in one of the plurality of sensing pixels. An nth reset scan signal of the plurality of reset scan signals is started behind an nth readout scan signal of the plurality of readout scan signals in time domain.
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: December 26, 2023
    Assignee: InnoLux Corporation
    Inventors: Chien-Chih Liao, Hsing-Yuan Hsu, Po-Yang Chen, I-An Yao
  • Patent number: 11854867
    Abstract: A method for forming a semiconductor structure includes receiving a first die having a first interconnect structure and a first bonding layer over the first interconnect structure, and a second die having a second interconnect structure and a second bonding layer over the second interconnect structure; forming a recess indenting into the first bonding layer; and forming a positioning member on the second bonding layer. The method further includes bonding the second die over the first die; and disposing the positioning member into the recess. The positioning member includes dielectric, is surrounded by the first bonding layer, and is isolated from the first interconnect structure and the second interconnect structure.
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventor: Jen-Yuan Chang
  • Patent number: 11854844
    Abstract: A method of operating a transport system includes detecting an anomalous condition of a wafer transfer vehicle; sending the wafer transfer vehicle along a rail to a diagnosis station adjacent to the rail; and inspecting properties of the wafer transfer vehicle, such as a speed, a weight, an audio frequency, a noise level, a temperature, and an image of the wafer transfer vehicle, by using the diagnosis station.
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Yuan Chu, Jen-Ti Wang, Wei-Chih Chen, Kuo-Fong Chuang, Cheng-Ho Hung
  • Patent number: 11855506
    Abstract: The present disclosure provides a base assembly of voice coil motor and a voice coil motor. The base assembly includes a base body having an elastic piece connecting area with a protrusion; a lower elastic piece disposed on the elastic piece connecting area with a first connecting hole, a second connecting hole, and a first trench, the protrusion is exposed from the first connecting hole, and the first trench is disposed between the first connecting hole and the second connecting hole; a connecting piece; and a terminal having a conductive part and a terminal connecting part, wherein the conductive part is disposed in the base body, the terminal connecting part passes through the elastic piece connecting area and protrudes from the elastic piece connecting area, and a part of the terminal connecting part is exposed from the second connecting hole to be fixedly connected to the lower elastic piece.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: December 26, 2023
    Assignee: Lanto Electronic Limited
    Inventors: Wen-Yen Huang, Fu-Yuan Wu, Shang-Yu Hsu, Meng-Ting Lin, BingBing Ma, Jie Du, Yu-Cheng Lin
  • Patent number: 11855887
    Abstract: A data flow redirection method to overcome a disadvantage that a quantity of adjustable data flows is relatively small due to limited space of a flow specification forwarding table. The method includes receiving, by a network device, a control message sent by a control device, where the control message carries redirection routing information of a data flow and a redirection routing indication, the redirection routing indication instructing to convert the redirection routing information of the data flow into a forwarding entry in a target forwarding table, and tablespace of the target forwarding table is greater than tablespace of a flow specification forwarding table of the network device, and converting, by the network device, the redirection routing information of the data flow into the forwarding entry in the target forwarding table according to the redirection routing indication.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: December 26, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Haibo Wang, Shunwan Zhuang, Yuan Rao, Ruiqing Cao
  • Patent number: 11855126
    Abstract: A semiconductor device includes a substrate. The semiconductor device further includes a circuit layer over the substrate. The semiconductor device further includes a test line electrically connected to the circuit layer. The semiconductor device further includes a capacitor on the substrate. The capacitor includes a first conductor, wherein the first conductor is on a portion of the substrate exposed by the circuit layer. The capacitor further includes an insulator surrounding the first conductor.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yan-Jhih Huang, Chun-Yuan Hsu, Chien-Chung Chen, Yung-Hsieh Lin
  • Patent number: 11852707
    Abstract: The present disclosure provides a system for SMS MRI. During each of a plurality of frames, the system may cause an MRI scanner to apply a plurality of PE steps to each of a plurality of slice locations of a subject to acquire echo signals. A phase modulation magnetic field gradient may be applied during each of at least some of the PE steps in the frame. For each frame, the system may reconstruct an aliasing image representative of the slice locations in the frame based on the corresponding echo signals. The system may also generate a plurality of reference slice images based on the aliasing images. The system may further reconstruct at least one slice image based on the aliasing images and the reference slice images. Each of the slice image may be representative of one of the slice locations in one of the frames.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: December 26, 2023
    Assignee: SHANGHAI UNITED IMAGING HEALTHCARE CO., LTD.
    Inventors: Yuan Zheng, Lele Zhao, Jian Xu, Weiguo Zhang
  • Patent number: 11854795
    Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen
  • Patent number: 11852844
    Abstract: An optical system is provided and includes a fixed assembly, an optical module, a first movable assembly and a first driving assembly. The optical module has an optical axis. The first movable assembly is configured to be connected to the optical module. The first driving assembly is configured to drive the first movable assembly to move relative to the fixed assembly, and a gap is formed between the first movable assembly and the fixed assembly.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: December 26, 2023
    Assignee: TDK TAIWAN CORP.
    Inventors: Fu-Yuan Wu, Yu-Shan Chou, Chen-Hsin Huang
  • Patent number: 11855085
    Abstract: Methods of cutting gate structures, and structures formed, are described. In an embodiment, a structure includes first and second gate structures over an active area, and a gate cut-fill structure. The first and second gate structures extend parallel. The active area includes a source/drain region disposed laterally between the first and second gate structures. The gate cut-fill structure has first and second primary portions and an intermediate portion. The first and second primary portions abut the first and second gate structures, respectively. The intermediate portion extends laterally between the first and second primary portions. First and second widths of the first and second primary portions along longitudinal midlines of the first and second gate structures, respectively, are each greater than a third width of the intermediate portion midway between the first and second gate structures and parallel to the longitudinal midline of the first gate structure.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Chang Hung, Chia-Jen Chen, Ming-Ching Chang, Shu-Yuan Ku, Yi-Hsuan Hsiao, I-Wei Yang
  • Patent number: 11855133
    Abstract: Various embodiments of the present disclosure are directed towards a trench capacitor with a trench pattern for yield improvement. The trench capacitor is on a substrate and comprises a plurality of capacitor segments. The capacitor segments extend into the substrate according to the trench pattern and are spaced with a pitch on an axis. The plurality of capacitor segments comprises an edge capacitor segment at an edge of the trench capacitor and a center capacitor segment at a center of the trench capacitor. The edge capacitor segment has a greater width than the center capacitor segment and/or the pitch is greater at the edge capacitor segment than at the center capacitor segment. The greater width may facilitate stress absorption and the greater pitch may increase substrate rigidity at the edge of the trench capacitor where thermal expansion stress is greatest, thereby reducing substrate bending and trench burnout for yield improvements.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yuan-Sheng Huang, Yi-Chen Chen
  • Patent number: 11850799
    Abstract: A powdered surface monitoring system of additive manufacturing comprises an additive manufacturing processing cavity, having therein a working area carrying powder to be sintered; a laser source, generating a laser beam, which passes through a reflector, a dichroic mirror and a scanning vibration mirror and is transmitted to an upper surface of the powder in the working area; a polarization imaging device, having therein a beam expander group, a polarizer group and at least one photodetector, the polarizer group consisting of a plurality of linear polarizers, and the number of photodetectors being equal to the number of the linear polarizers.
    Type: Grant
    Filed: October 26, 2022
    Date of Patent: December 26, 2023
    Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Kuo-Kuang Jen, Yi-Cherng Ferng, Chia-Hsiang Chang, Chun-Hsiang Huang, Yuan-Yao Lin, Chao-Kuei Lee, Yi-Jen Chiu
  • Patent number: 11855179
    Abstract: A semiconductor device is described. An isolation region is disposed on the substrate. A plurality of channels extend through the isolation region from the substrate. The channels including an active channel and an inactive channel. A dummy fin is disposed on the isolation region and between the active channel and the inactive channel. An active gate is disposed over the active channel and the inactive channel, and contacts the isolation region. A dielectric material extends through the active gate and contacts a top of the dummy fin. The inactive channel is a closest inactive channel to the dielectric material. A long axis of the active channel extends in a first direction. A long axis of the active gate extends in a second direction. The active channel extends in a third direction from the substrate. The dielectric material is closer to the inactive channel than to the active channel.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Shih-Yao Lin, Hsiao Wen Lee, Ya-Yi Tsai, Shu-Uei Jang, Chih-Han Lin, Shu-Yuan Ku
  • Publication number: 20230409570
    Abstract: Machine-learning-based, adaptive updating of quantitative data in a database system is provided, which includes training one or more machine learning models to facilitate adaptively updating quantitative data in the database system, and ascertaining an update urgency index for updating the quantitative data for one or more data structures of the database system. The update urgency index is representative of an urgency for updating the quantitative data for the data structure(s) and is based, at least in part, on real-time query metrics. The machine learning model(s) is used to adaptively update the quantitative data, where the adaptively updating is based, at least in part, on the ascertained update urgency index. Processing of a database query is optimized in the database system using the adaptively updated quantitative data.
    Type: Application
    Filed: August 23, 2023
    Publication date: December 21, 2023
    Inventors: Ling QIN, Fu Fei XU, Jie ZHANG, Guo Dong WAN, Yi Lei WANG, Wen Jing SHI, Yuan CAO
  • Patent number: D1009261
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: December 26, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chia-Yuan Chang, Jung-Wen Chang, Kao-Yu Hsu