Abstract: A headset charging system and a headset charging method thereof are provided. The headset charging system includes an earphone device and a charging device. The earphone device or the charging device adjusts a charge current to switch between a first current and a second current, so as to perform data transmission between the earphone device and the charging device.

Abstract: The present disclosure relates to a child carrier, including a frame and a lower leg resting assembly. The frame has a folded state. The lower leg resting assembly is connected to the frame. When the frame is in the folded state, the lower leg resting assembly is used as a carrying handle for lifting and pulling the frame.

Abstract: Some implementations described herein provide a semiconductor structure. The semiconductor structure includes a capacitor device within a recessed portion of a substrate. The recessed portion has sidewalls and a bottom surface below a top surface of the substrate. The semiconductor structure includes a dielectric material disposed below the capacitor device and within the recessed portion. The semiconductor structure includes a first conductive structure adjacent one or more of the sidewalls of the recessed portion. The first conductive structure may include a conductive portion of the substrate or a conductive material disposed within the recessed portion. The semiconductor structure includes a second conductive structure coupled to the first conductive structure, where the second conductive structure provides an electrical connection from the first conductive structure to a voltage source or a voltage drain.

Abstract: Provided are fan-out package structure and fan-out packaging method. Structure includes packaging element, plastic package body, first dielectric layer, and second dielectric layer, packaging element has first pad and second pad, height of first pad is lower than that of second pad, plastic package body plastic-seals packaging element, and end surface of first pad is exposed from surface of plastic package body, one side of first pad away from packaging element has first wiring layer, and first wiring layer has first solder ball; first dielectric layer is provided on one side of first wiring layer away from packaging element, end surface of second pad is exposed from surface of first dielectric layer, one side of second pad away from packaging element has second wiring layer, and second wiring layer has second solder ball; and one side of second wiring layer away from first wiring layer has second dielectric layer.

Abstract: An embodiment of the invention provides a method for a location tracking, applied to a mobile device, an indoor access point (AP) and at least one indoor Internet of Things (IoT) device, comprising: receiving, by the indoor AP, a first set of location information of the mobile device from the mobile device at outdoor, wherein the first set of location information is determined according to a Global Navigation Satellite System (GNSS); determining, by the indoor AP, a second set of location information of the indoor AP according to the first set of location information; determining, by the indoor AP, a third set of location information of the at least one indoor IoT device according to the second set of location information; and transmitting, by the indoor AP, the third set of location information to the at least one indoor IoT device.

Abstract: Provided are a method and system for manufacturing a thermal composite cell. The method for manufacturing a thermal composite cell includes the following steps: unwinding a diaphragm and unwinding the diaphragm by a diaphragm unwinding device; hot-pressing and compositing electrode plates, hot-pressing and compositing a first electrode plate on a first side of the diaphragm 1, and hot-pressing and compositing a second electrode plate on a second side of the diaphragm; performing Z-shaped folding on the diaphragm and the electrode plates; and performing pressing to form a cell. The system for manufacturing a thermal composite cell includes a diaphragm unwinding device, an electrode plate conveying device, a heat-pressing and compositing device, a folding thimble, and a pressing device.

Abstract: A fluidized bed processing system include a vessel having a vessel wall and a plurality of chemical feed distributors coupled to the vessel wall and extending into an internal volume of the vessel. Each of the chemical feed distributors includes a distributor body forming a chemical feed flow path and a plurality of chemical feed outlets. The fluidized bed processing system further includes at least one intermediate beam having at plurality of slots spaced apart along a beam length. That intermediate beam is coupled to the vessel wall at both ends, each chemical feed distributor passes through one slot of the intermediate beam, and the intermediate beam provides vertical support for each of the plurality of chemical feed distributors. The fluidized bed processing system can include lateral guides. The intermediate beams and lateral guides support the chemical feed distributors vertically and laterally.

Abstract: A polyisocyanate composition, a preparation method therefor and an application thereof. The value of the mass content of alkaline hydrolyzed chlorine minus the mass content of water hydrolyzed chlorine in the polyisocyanate composition is 0.1 ppm-100 ppm. The mass content of the alkaline hydrolyzed chlorine is the mass content obtained by calculating halogen dissociated under alkaline conditions and/or halogen dissociated under a temperature condition of 100° C. or more as the relative atomic mass of a chlorine atom.

Abstract: The present disclosure, in some embodiments, relates to a method of forming a capacitor structure. The method includes forming a capacitor dielectric layer over a lower electrode layer, and forming an upper electrode layer over the capacitor dielectric layer. The upper electrode layer is etched to define an upper electrode and to expose a part of the capacitor dielectric layer. A spacer structure is formed over horizontally extending surfaces of the upper electrode layer and the capacitor dielectric layer and also along sidewalls of the upper electrode. The spacer structure is etched to remove the spacer structure from over the horizontally extending surfaces of the upper electrode layer and the capacitor dielectric layer and to define a spacer. The capacitor dielectric layer and the lower electrode layer are etched according to the spacer to define a capacitor dielectric and a lower electrode.

Abstract: A method of semiconductor fabrication includes providing a semiconductor structure having a substrate and first, second, third, and fourth fins above the substrate. The method further includes forming an n-type epitaxial source/drain (S/D) feature on the first and second fins, forming a p-type epitaxial S/D feature on the third and fourth fins, and performing a selective etch process on the semiconductor structure to remove upper portions of the n-type epitaxial S/D feature and the p-type epitaxial S/D feature such that more is removed from the n-type epitaxial S/D feature than the p-type epitaxial S/D feature.

Abstract: The disclosure relates to a control method and system for a vehicle, a vehicle-mounted control device, and a vehicle. The control method for a vehicle in the disclosure includes: substituting an obtained vehicle control parameter of the vehicle into a preset first correlation matrix model to obtain a temperature, namely, a first temperature value, of a component; obtaining an actual temperature, namely, a second temperature value, of the component of the electric drive system; calculating a difference between the second temperature value and the first temperature value to obtain a temperature residual value; and determining health of the component of the electric drive system based on the temperature residual value.

Abstract: Technologies for dynamically managing a batch size of packets include a network device. The network device is to receive, into a queue, packets from a remote node to be processed by the network device, determine a throughput provided by the network device while the packets are processed, determine whether the determined throughput satisfies a predefined condition, and adjust a batch size of packets in response to a determination that the determined throughput satisfies a predefined condition. The batch size is indicative of a threshold number of queued packets required to be present in the queue before the queued packets in the queue can be processed by the network device.

Abstract: A method for preparing the memory are provided. The method includes forming a trench at a front side of a semiconductor substrate, wherein the trench defines laterally separate active areas formed of surface regions of the semiconductor substrate; filling an isolation structure in the trench, wherein the isolation structure is filled to a height lower than top surfaces of the active areas; recessing a first group of the active areas from top surfaces of the first group of the active areas, while having top surfaces of a second group of the active areas covered; and forming contact enhancement sidewall spacers to laterally surround top portions of the active areas, respectively.

Abstract: A neutron-capture therapy system includes a charged particle beam generation unit, a beam transmission unit and a neutron beam generation unit. The charged particle beam generation unit includes an ion source and an accelerator. The accelerator accelerates charged particles generated by the ion source, so as to obtain a charged particle beam of the required energy. The neutron beam generation unit includes a target, a beam shaping body and a collimator. The charged particle beam irradiates onto the target through the beam transmission unit to generate neutrons, which sequentially pass through the beam shaping body and the collimator to form a neutron beam for therapy. The neutron-capture therapy system is accommodated in a concrete building including an irradiation room, an accelerator chamber and a beam transmission chamber. The neutron beam generation unit is at least partially accommodated in a partition wall of the irradiation chamber and the beam transmission chamber.

Abstract: A pixel package includes a base material, a circuit structure, light-emitting semiconductor elements, a non-light-emitting semiconductor element, and a light-transmitting adhesive layer. The base material has an upper surface, a lower surface, and a side surface. The circuit structure is buried in the base material and includes an first circuit layer exposed from the upper surface, bottom electrodes exposed from the lower surface, and a middle circuit layer between the upper circuit layer and the plurality of bottom electrodes and covered by the base material. The light-emitting semiconductor elements are on the upper surface and electrically connected to the circuit structure. The non-light-emitting semiconductor element is buried in the base material and directly connected to the middle circuit layer, and at least one outside surface is exposed. The light-transmitting adhesive layer covers the light-emitting semiconductor elements and is in direct contact with the base material.

Abstract: A method for fabricating a semiconductor device includes the steps of first providing a substrate having a resistor region, forming a first gate structure on the resistor region, forming a first interlayer dielectric (ILD) layer around the first gate structure, transforming the first gate structure into a first metal gate having a gate electrode on the substrate and a hard mask on the gate electrode, and then forming a resistor on the first metal gate.

Abstract: An in-vehicle entertainment system having functionality of operation interface switchable is disclosed. The system comprises an in-vehicle host electronic device and a hub having a host-to-host transmission function. After at least two mobile electronic devices are coupled to the hub, the in-vehicle host electronic device firstly prioritizes a communication order between the two mobile electronic devices, and then lets a display unit show an operation interface (like CarPlay operation interface) corresponding to the mobile electronic device that is prioritized with a first ranked communication order. Moreover, in case of a peripheral electronic device being coupled to the hub as well as the display unit being showing the operation interface, the in-vehicle host electronic device is allowed to access a peripheral electronic device through the hub.

Abstract: This application discloses image coding methods and apparatuses. One method comprises obtaining a plurality of groups of human skeleton data associated with performing an action by a human body, wherein each group of the plurality of groups of human skeleton data comprises joint data associated with a joint for performing the action. Based on joint data comprised in at least a portion of the plurality of groups of human skeleton data, a motion feature corresponding to the plurality of groups of human skeleton data is extracted, and the motion feature is encoded to obtain a motion feature image.

Abstract: A display panel and control methods thereof are provided. In one example, the display panel includes, a first substrate and a second substrate opposite to each other, and a solution encapsulated between the first substrate and the second substrate. In some examples, the solution includes opaque charged particles. In some examples, the first substrate includes a first electrode, the first electrode including a plurality of discrete sub-electrodes, and the second substrate includes a second electrode. Further, the control method may include adjusting an electric field between each of the plurality of discrete sub-electrodes and the second electrode, causing the opaque charged particles to undergo a gathering motion or a scattering motion.

Abstract: The present disclosure belongs to the technical field of welding materials, and in particular relates to a Fe—Ni based alloy welding wire for welding 800H alloy and a preparation method thereof and a method for welding 800H alloy. The Fe—Ni based alloy welding wire for welding 800H alloy provided by the present disclosure has a reasonable chemical components, and after being used to weld 800H alloy, the obtained weld has a tensile strength of 557.6 MPa and an elongation of 37.5% at ambient temperature, and has a tensile strength of 420 MPa and an elongation of 17.25% at a temperature of 650° C.