Abstract: In an embodiment, a method includes: receiving a first wafer and a second wafer, the first wafer including a first alignment mark, the first alignment mark including a first grid of first magnetic features, the second wafer including a second alignment mark, the second alignment mark including a second grid of second magnetic features; aligning the first alignment mark with the second alignment mark in an optical alignment process; after the optical alignment process, aligning the first alignment mark with the second alignment mark in a magnetic alignment process, north poles of the first magnetic features being aligned with south poles of the second magnetic features, south poles of the first magnetic features being aligned with north poles of the second magnetic features; and forming bonds between the first wafer and the second wafer.

Abstract: In an embodiment, a structure includes: a first device including a first dielectric layer and a first alignment mark in the first dielectric layer, the first alignment mark including a first magnetic cross, the first magnetic cross having a first north pole and a first south pole; and a second device including a second dielectric layer and a second alignment mark in the second dielectric layer, the second alignment mark including a second magnetic cross, the second magnetic cross having a second north pole and a second south pole, the first north pole aligned with the second south pole, the first south pole aligned with the second north pole, the first dielectric layer bonded to the second dielectric layer by dielectric-to-dielectric bonds, the first alignment mark bonded to the second alignment mark by metal-to-metal bonds.

Abstract: An image classifying device is provided in the invention. The image classifying device includes a storage device, a calculation circuit and a classifying circuit. The storage device stores information corresponding to a plurality of image classes. The calculation circuit obtains a target image from an image extracting device and obtains the feature vector of the target image. The calculation circuit obtains a first estimation result corresponding to the target image based on the information corresponding to the plurality of image classes and the feature vector and obtains a second estimation result corresponding to the target image based on a reference image, wherein the reference image corresponds to one of the image classes. The classifying circuit adds the target image into one of the image classes based on the first estimation result and the second estimation result.

Abstract: An integrated circuit includes a first active region of a first set of transistors of a first type, a second active region of a second set of transistors of the first type, a third active region of a third set of transistors of the first type, a fourth active region of a fourth set of transistors of the first type and a fifth active region of a fifth set of transistors of a second type. The first, second, fourth and fifth active region have a first width in a second direction, and are on a first level. The third active region is on the first level, and has a second width different from the first width. The second active region is adjacent to the first boundary, and is separated from the first active region in the second direction. The fourth active region is adjacent to the second boundary.

Abstract: A package structure includes first and second package components, an underfill layer disposed between the first and second package components, and a metallic layer. The first package component includes semiconductor dies, a first insulating encapsulation laterally encapsulating the semiconductor dies, and a redistribution structure underlying first surfaces of the semiconductor dies and the first insulating encapsulation. The second package component underlying the first package component is electrically coupled to the semiconductor dies through the redistribution structure. The underfill layer extends to cover a sidewall of the first package component, the metallic layer overlying second surfaces of the semiconductor dies and the first insulating encapsulation, and a peripheral region of the second surface of the first insulating encapsulation is accessibly exposed by the metallic layer, where the first surfaces are opposite to the second surfaces.

Abstract: The present invention discloses a smart clothing and its device mount, wherein the device mount includes an upper casing and a lower casing, a circuit board is arranged between the upper casing and the lower casing, and a metal contact of the top surface of the circuit board penetrates through the upper casing to form a plurality of metal contact points, and the cable interface of the bottom surface of the circuit board passes through the lower casing, and the bottom surface of the lower casing is formed with individual cable grooves toward each cable interface for guiding the transmission wire to insert into the cable interface along the cable groove, and the device mount is combined with a soft gasket on the clothing body and is equipped with a waterproof protective layer to avoid damage to the circuit components and transmission wire during cleaning; when the device mount is installed with the electronic device, the motion status can be monitored.

Abstract: The subject application relates to a method and server for handling streaming data, and includes: Obtaining a request for entering the live streaming as an invisible viewer; in response to obtaining the request, starting to provide a first user terminal of a first viewer with the streaming data for the live streaming while setting information on the first viewer invisible to other viewers and a streamer; and in response to detecting a first action of the first viewer in the live streaming, setting at least a part of the information visible to at least a part of the other viewers and the streamer. According to the subject application, it is possible to encourage further communication between the streamer and the viewer, and enhance user-user interactions through the live streaming.

Abstract: System and method for semantic segmentation of point clouds. The method may include: generating, via a first neural network, a birds-eye-view (BEV) image of the environment from the aggregated point cloud; generating, via a second neural network, a labelled BEV image from the BEV image, wherein each pixel in the labelled BEV image is associated with a class label from a set of class labels; generating a BEV feature map; and generating, via a third neural network, the road surface segmentation map in the form of a refined labelled BEV image based on the labelled BEV image by smoothing the labelled BEV image using the BEV feature map, wherein each pixel in the refined labelled BEV image is associated with a class label from the set of class labels.

Abstract: A display device is provided. The display device includes a substrate having a surface including a display area; a plurality of light-emitting diodes disposed on the display area of the substrate, wherein the light-emitting diode includes an electrode; and a plurality of bonding pads disposed on the substrate; a conductive element disposed between one of the plurality of bonding pads and the electrode of the at least one of the plurality of light-emitting diodes; and a first matrix element disposed on the substrate, wherein in a cross-sectional view, the first matrix element is disposed between adjacent two of the plurality of light-emitting diodes, and the electrode has a sidewall profile and at least a part of the sidewall profile of the electrode is in a shape of a curve.

Abstract: A preclean process may be omitted from a eutectic bonding sequence. To remove oxide from one or more surfaces of a device wafer of a micro-electromechanical-system (MEMS) structure, a duration of an acid-based etch process in the eutectic bonding sequence may be increased relative to the duration of the acid-based etch process when the preclean process is performed. The increased duration of the acid-based etch process enables the acid-based etch process to remove the oxide from the one or more surfaces of the device wafer without the use of a preceding preclean process. This reduces the complexity and cycle time of the eutectic bonding sequence, reduces the risk of stiction between suspended mechanical components of the MEMS structure, and/or reduces the likelihood that the MEMS structure may be rendered defective or inoperable during manufacturing, which increases process yield.

Abstract: An electronic structure includes a packaging structure, a circuit pattern structure, an underfill and a protrusion structure. The circuit pattern structure is disposed over the packaging structure. A gap is between the circuit pattern structure and the packaging structure. The underfill is disposed in the gap. The protrusion structure is disposed in the gap, and is configured to facilitate the distributing of the underfill in the gap.

Abstract: In a method of manufacturing a semiconductor device, initial connection patterns are prepared, initial cutting patterns for cutting the initial connection patterns are prepared, non-functional connection patterns at least from the initial connection patterns are identified, final cutting patterns are prepared from the initial cutting patterns and the non-functional connection patterns, a photo mask is prepared from the final cutting patterns, a photo resist pattern is formed over a target layer by a lithography operation using the photo mask, the target layer is patterned to form openings in the target layer by using the photo resist pattern, and connection layers are formed by filling the openings with a conductive material.

Abstract: A processing chamber includes a grid and a first disk. The grid includes a plurality of holes arranged in the processing chamber. The grid partitions the processing chamber into a first chamber in which plasma is generated and a second chamber in which a pedestal is configured to support a substrate. The first disk is arranged in the second chamber. The first disk is movable between the grid and the substrate when supported on the pedestal.

Abstract: A semiconductor device structure includes a dielectric layer, a first source/drain feature in contact with the dielectric layer, wherein the first source/drain feature comprises a first sidewall. The structure also includes a second source/drain feature in contact with the dielectric layer and adjacent to the first source/drain feature, wherein the second source/drain feature comprises a second sidewall. The structure also includes an insulating layer disposed over the dielectric layer and between the first sidewall and the second sidewall, wherein the insulating layer comprises a first surface facing the first sidewall, a second surface facing the second sidewall, a third surface connecting the first surface and the second surface, and a fourth surface opposite the third surface. The structure further includes a sealing material disposed between the first sidewall and the first surface, wherein the sealing material, the first sidewall, the first surface, and the dielectric layer are exposed to an air gap.

Abstract: The present invention relates to a sweetener liquid for preventing and relieving intestinal sugar alcohol intolerance. The sweetener liquid per 100ml includes 0.01 to 0.04 g of low-esterification pectin, 0.01 g to 0.1 g of ?-carrageenan, 0.01 g to 0.3 g of locust bean gum, 30 g to 60 g of xylitol, 5 g to 15 g of maltitol and 1 g to 10 g of sorbitol and remaining water; the low-esterification pectin is a pectin concentrate including, based on parts by weight, 15 parts of calcium citrate, 60 parts of low-molecular-weight pectin, 85 parts of ethylene glycol, 5 parts of carboxymethyl cellulose sodium and 30 parts of sodium citrate; the low-molecular-weight pectin includes a low-sugar fruit juice and a lemon juice; the sweetener liquid has a pH of 5-6.5 and a viscosity of 0.1 to 25 mPa•S. The present invention further provides a method of preparing a sweetener liquid and an application thereof.

Abstract: A method for supporting Sidelink (SL) Discontinuous Reception (DRX) operation is provided. A User Equipment (UE) maintains SL DRX configuration which includes one of a transmission pattern and a reception pattern that the UE expects to perform transmission and reception to a peer UE. The UE exchanges the SL DRX configuration with the peer UE. Based on the exchange of the SL DRX configuration, the UE determines when to perform transmission or reception to or from the peer UE during an SL DRX operation. Based on the determination, the UE performs transmission or reception to or from the peer UE during the SL DRX operation.

Abstract: An electronic device, including a circuit board and a back plate, is provided. The circuit board has a first opening. The back plate includes a bottom portion, a protruding portion, and a column. The protruding portion protrudes from the bottom portion, and the column is located on the protruding portion. In a first direction, the column has a first outer diameter and a second outer diameter. A first width of the first opening is less than the first outer diameter and greater than the second outer diameter to limit the movement of the circuit board. The electronic device of the disclosure limits the movement of the circuit board through the column of the back plate, so as to reduce the number of screws used, thereby achieving the effects of reducing costs and/or reducing man-hours for locking the screws.

Abstract: The present invention provides methods, compositions, combinations, and kits for treating a subject with a viral infection (e.g., COVID-19) by administering or providing an estrogen receptor modulator and an anti-inflammatory agent or by administering or providing an anti-inflammatory agent (e.g., melatonin) to the subject.

Abstract: An asymmetric fused aromatic ring derivative containing sulfonyl group, which includes a structure represented by formula (I). Formula (I) is defined as in the specification. A use of the asymmetric fused aromatic ring derivative containing sulfonyl group, which is used as a photocatalyst. A hydrogen production device, which includes the asymmetric fused aromatic ring derivative containing sulfonyl group. An optoelectronic component, which includes the asymmetric fused aromatic ring derivative containing sulfonyl group.

Abstract: A firearm launcher for holding a projectile includes a launcher body attached to a firearm barrel; and a tension member cooperated with the launcher body. In one embodiment, the tension member is connected with the projectile.