Patents by Inventor Yuan Cheng

Yuan Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230078200
    Abstract: The present invention relates to RNAi constructs for reducing expression of the LPA gene, which encodes apolipoprotein(a), a component of lipoprotein(a) (Lp(a)) particles. Methods of using such RNAi constructs to treat or prevent cardiovascular disease, such as coronary artery disease, peripheral artery disease, stroke, and myocardial infarction, and to reduce serum Lp(a) levels are also described.
    Type: Application
    Filed: December 8, 2020
    Publication date: March 16, 2023
    Applicant: AMGEN INC.
    Inventors: Bin WU, Michael OLLMANN, Oliver HOMANN, Yuan CHENG
  • Publication number: 20230080203
    Abstract: Medical imaging devices, systems, and methods thereof. The medical imaging system may include a movable station and a gantry. The movable station includes a gantry mount rotatably attached to the gantry. The gantry includes an outer C-arm slidably mounted to and operable to slide relative to the gantry mount, an inner C-arm slidably coupled to the outer C-arm and, an imaging signal transmitter and sensor attached to the C-arms. The two C-arms work together to provide a full 360 degree rotation of the imaging signal transmitter. In embodiment, the imaging signal transmitter and imaging sensor are offset from a center axis of the medical imaging system such that the portable medical imaging system is operable to capture an enlarged field of view.
    Type: Application
    Filed: November 21, 2022
    Publication date: March 16, 2023
    Inventors: Norbert Johnson, Robert Stevens, Hisham Salem, Yuan Cheng
  • Patent number: 11596200
    Abstract: An article may include a first polymeric material layer having a surface. A first conductive trace may form at least a portion of the first layer surface. The article may further include a second polymeric material layer. The second layer may have a first surface, a portion of the second layer first surface being bonded to a portion of the first layer surface. The second layer may have a portion of a channel defined therein, the channel at least partially coinciding with a portion of the first conductive trace. The article may also include a first patch interposed between the first layer surface and the second layer first surface. The first patch may span the channel and cover a portion of the first conductive trace.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: March 7, 2023
    Assignee: NIKE, Inc.
    Inventors: Steven H. Walker, Chin-yuan Cheng
  • Patent number: 11600097
    Abstract: A fingerprint sensing system including a plurality of micro-lenses, a sensor, a shielding structure and a controller is provided. The micro-lenses are arranged in an array. The sensor has a plurality of sensing pixels arranged in an array. The sensor, the shielding structure and the micro-lenses are sequentially arranged along an arrangement direction. The controller is electrically connected to the sensor. A pitch between the micro-lenses is greater than a pitch between the sensing pixels. The controller forms a fingerprint image according to signals of a plurality of output pixels of the sensor, wherein each of the output pixels is one of every at least four of neighboring sensing pixels. An operation method of a fingerprint sensing system is also provided.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: March 7, 2023
    Assignee: Egis Technology Inc.
    Inventors: Ming-Yuan Cheng, Tang-Hung Po, Yu-Hsuan Lin
  • Patent number: 11600356
    Abstract: The disclosure provides a memory device which includes a plurality of word lines grouped into a plurality of WL sets; and a plurality of redundant word lines grouped into M RWL sets; and a memory control circuit connected to the WL sets and the RWL sets and configured to replace a plurality of defective WL sets of the plurality WL sets by selecting from the RWL sets, wherein each of the plurality of defective WL sets comprises at least a defective word line, all of the M RWL sets are available for repairing the WL sets during a wafer stage, where M is an integer greater than 2, and N of M RWL sets is available for repairing the WL sets during the wafer stage, during a package stage and during a post package stage, where N is an integer less than M.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: March 7, 2023
    Assignee: Winbond Electronics Corp.
    Inventors: Kan-Yuan Cheng, Hee-Seong Kim, Sangho Shin, Tien-Chieh Huang
  • Publication number: 20230060978
    Abstract: Described herein are zinc-amino acid-lauryl sulfate complexes and oral care compositions comprising the same; and methods of making and using the same are also described.
    Type: Application
    Filed: June 29, 2022
    Publication date: March 2, 2023
    Applicant: Colgate-Palmolive Company
    Inventors: Tatiana BRINZARI, Michael STRANICK, Chi-Yuan CHENG, Zhigang HAO, Iraklis PAPPAS, Greggory MARRON, Viktor DUBOVOY, Long PAN
  • Publication number: 20230065884
    Abstract: A package structure includes a first semiconductor die, a first insulating encapsulation, a thermal coupling structure, and a heat dissipating component thermally coupled to the first semiconductor die through the thermal coupling structure. The first semiconductor die includes an active side, a rear side, and a sidewall connected to the active side and the rear side. The first insulating encapsulation extends along the sidewall of the first semiconductor die and includes a first side substantially leveled with the active side, a second side opposite to the first side, and topographic features at the second side. The thermal coupling structure includes a metallic layer overlying and the rear side of the first semiconductor die and the topographic features of the first insulating encapsulation. A manufacturing method of a package structure is also provided.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hao Chen, Po-Yuan Cheng, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Patent number: 11594805
    Abstract: An antenna assembly for a portable information handling system. The antenna assembly includes an antenna bounding component, the antenna bounding component being electrically and physically connected to a top cover portion of the portable information handling system; and, an antenna, the antenna being mounted to the antenna bounding portion, radio frequency (RF) radiation radiating via an RF radiation path, the RF radiation path being provided by a radiation slot, the radiation slot being located within a bottom cover portion of the portable information handling system.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: February 28, 2023
    Assignee: Dell Products L.P.
    Inventors: Mark Andrew Schwager, Sumana Pallampati, Kai-Yuan Cheng, Nicholas G. DiLoreto, Zhong-Chao Lee, Changsoo Kim, Ching Cheng Hsu, Yu-Feng Huang
  • Patent number: 11579478
    Abstract: In a display device using a substrate having flexibility, a drop in reliability due to defects such as cracks in the case where a substrate is made to curve is controlled. A display device is provided including a first substrate having flexibility, the first substrate including a curved part, an organic film covering a first surface of the first substrate and a second surface opposing the first surface in the curved part; and a pixel part and a drive circuit part arranged on the first surface.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: February 14, 2023
    Assignee: Japan Display Inc.
    Inventor: Hsiang Yuan Cheng
  • Publication number: 20230035912
    Abstract: A device implementable on a firearm includes a monolithic upper receiver, comprising an upper receiver portion and a handguard portion, which is configured to accommodate non-proprietary barrel assemblies dimensioned according to United States military standard (mil-spec) barrel assembly dimensions and non-proprietary bolt carrier groups (BCGs) dimensioned according to mil-spec BCG dimensions. The device also includes a charging handle assembly configured to be coupled to an operating rod of a gas system of the firearm and forward of a BCG of the firearm. The device further includes a barrel locking system including a locking plate and a locking screw. When the locking screw is screwed into a threaded hole on the locking plate, the locking plate engages with a side of a barrel extension of the barrel assembly in a radial directions perpendicular to a longitudinal axis of the barrel assembly.
    Type: Application
    Filed: September 27, 2022
    Publication date: February 2, 2023
    Inventors: Shanyao Lee, Chien Yuan Cheng
  • Patent number: 11569680
    Abstract: An electronic device includes a backup power supply unit, a first power management unit, a switch, a voltage detection unit, a processor and an electronic module. The first power management unit is coupled to the backup power supply unit and an external power supply unit. The switch is coupled to the first power management unit. The voltage detection unit is coupled to the external power supply unit and the switch. The processor is coupled to the voltage detection unit. The electronic module is coupled to the switch and the processor. When a voltage level of the external power supply unit is lower than a first predetermined level, the voltage detection unit outputs a detection signal. The switch is controlled by the detection signal to open to stop supplying power to the electronic module. The processor is controlled by the detection signal to execute a shutdown process.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: January 31, 2023
    Assignee: Qisda Corporation
    Inventors: Wen-Yuan Chen, Ren-Yuan Cheng, Chen-Kang Wang
  • Publication number: 20230026141
    Abstract: A semiconductor package includes a redistribution structure, a plurality of semiconductor devices, and a plurality of heat dissipation films. The plurality of semiconductor devices mounted on the redistribution structure. The plurality of heat dissipation films are respectively disposed on and jointly covering upper surfaces of the plurality of semiconductor devices. A plurality of trenches are respectively extended between each two of the plurality of heat dissipations and extended between each two of the plurality of semiconductor devices.
    Type: Application
    Filed: July 23, 2021
    Publication date: January 26, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hao Chen, Po-Yuan Cheng, Pu Wang, Li-Hui Cheng
  • Publication number: 20230014913
    Abstract: In an embodiment, a device includes: a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a front-side of the package component, the integrated circuit die exposed at a back-side of the package component; a heat dissipation layer on the back-side of the package component and on sidewalls of the package component; an adhesive layer on a back-side of the heat dissipation layer, a portion of a sidewall of the heat dissipation layer being free from the adhesive layer; and a package substrate connected to the conductive connectors.
    Type: Application
    Filed: March 4, 2022
    Publication date: January 19, 2023
    Applicants: Taiwan Semiconductor Manufacturing Co., Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Hao Chen, Po-Yuan Cheng, Pu Wang, Li-Hui Cheng
  • Publication number: 20230007710
    Abstract: A method of a relay user equipment (UE) can include receiving, at the relay UE, from a first neighbor UE, a communication request message for establishing a connection between an initiating UE and a target UE, the communication request message including first security-establishment-related information originating from the initiating UE for establishing a security association between the initiating UE and the target UE; modifying the communication request message to add second security-establishment-related information for establishing a security association between the relay UE and a second neighbor UE; and transmitting to the second neighbor UE the modified communication request message that includes the first security-establishment-related information originating from the initiating UE for establishing the security association between the initiating UE and the target UE, and the second security-establishment-related information added by the relay UE for establishing the security association between the rela
    Type: Application
    Filed: June 6, 2022
    Publication date: January 5, 2023
    Applicant: MEDIATEK SINGAPORE PTE. LTD.
    Inventors: Nathan Edward TENNY, Yuan-Chieh LIN, Ming-Yuan CHENG
  • Patent number: 11543198
    Abstract: A device implementable on a firearm includes a monolithic upper receiver, comprising an upper receiver portion and a handguard portion, which is configured to accommodate non-proprietary barrel assemblies dimensioned according to United States military standard (mil-spec) barrel assembly dimensions and non-proprietary bolt carrier groups (BCGs) dimensioned according to mil-spec BCG dimensions. The device also includes a charging handle assembly configured to be coupled to an operating rod of a gas system of the firearm and forward of a BCG of the firearm. The device further includes a barrel locking system including a locking plate and a locking screw. When the locking screw is screwed into a threaded hole on the locking plate, the locking plate engages with a side of a barrel extension of the barrel assembly in a radial directions perpendicular to a longitudinal axis of the barrel assembly.
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: January 3, 2023
    Assignee: Strike IP, LLC
    Inventors: Shanyao Lee, Chien Yuan Cheng
  • Publication number: 20220395441
    Abstract: Described herein are methods for improving or maintaining the barrier integrity of gingival tissue comprising administering an oral care composition comprising a curcurninoid, to the oral cavity of a subject in need thereof.
    Type: Application
    Filed: December 17, 2020
    Publication date: December 15, 2022
    Applicants: Colgate-Palmolive Company, The University of North Carolina at Chapel Hill
    Inventors: Payal Arora, Zhigang HAO, Paul THOMSON, Manish MANDHARE, Yu WANG, Chi-Yuan CHENG, Harsh TRIVEDI, Long PAN, Silvana BARROS
  • Patent number: 11523784
    Abstract: Medical imaging devices, systems, and methods thereof. The medical imaging system may include a movable station and a gantry. The movable station includes a gantry mount rotatably attached to the gantry. The gantry includes an outer C-arm slidably mounted to and operable to slide relative to the gantry mount, an inner C-arm slidably coupled to the outer C-arm and, an imaging signal transmitter and sensor attached to the C-arms. The two C-arms work together to provide a full 360 degree rotation of the imaging signal transmitter. In embodiment, the imaging signal transmitter and imaging sensor are offset from a center axis of the medical imaging system such that the portable medical imaging system is operable to capture an enlarged field of view.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: December 13, 2022
    Assignee: Globus Medical, Inc.
    Inventors: Norbert Johnson, Robert Stevens, Hisham Salem, Yuan Cheng
  • Patent number: 11524834
    Abstract: A receiving structure providing real-time information as to the materials constituting its contents includes a box body, a first side plate, and a second side plate. The box body, the first side plate, and the second side plate forming a receiving space, and the receiving space receives materials. A discharge port is formed between the second side plate and the first side plate, the discharge port is in communication with the receiving space, and the discharge port is configured to take out the material. A material checking unit is provided on the first side plate, the material checking unit detects and enables real time identification of the materials in the receiving structure.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: December 13, 2022
    Assignees: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Eddy Liu, Jun Yan, Chih-Yuan Cheng, Wei-Da Yang, Jun Chen, Er-Wei Chen, Xiao-Ming Lv, Qi Feng, Shu-Fa Jiang, Zhe-Qi Zhao, Hsin-Ta Lin, Han Yang, Jun-Hui Zhang
  • Publication number: 20220390409
    Abstract: Various embodiments may relate to a fluid transfer system. The fluid transfer system may include a chamber containing a fluid absorbing material in contact with a device. The fluid transfer system may also include a reservoir including rows of bendable support members, the reservoir connected to the chamber for transport of a fluid from the reservoir to the fluid absorbing material. The fluid transfer system may further include a mass including rows of protrusions configured to engage with the rows of bendable support members, the mass configured to be arranged in the reservoir such that forces acting on the mass include a gravitational force on the mass, a floating force exerted by the fluid on the mass, and a contact force exerted by the rows of bendable support members on the mass.
    Type: Application
    Filed: November 10, 2020
    Publication date: December 8, 2022
    Inventors: Yu Chen, Weiguo Chen, Ming-Yuan Cheng, Ruiqi Lim
  • Publication number: 20220384247
    Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a first isolation structure which has a first corner. The semiconductor device also includes a first well region with a first conductive type. The semiconductor device includes further includes a gate structure over the first well region and covers a portion of the first corner of the first isolation structure. In addition, the semiconductor device includes a first doped region and a second doped region disposed on two opposites of the gate structure. Each of the first doped region and the second doped region has the first conductive type. The semiconductor device also includes a first counter-doped region in the first well region with a second conductive type different from the first conductive type. The first counter-doped region covers the first corner of the first isolation structure.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 1, 2022
    Inventors: CHIA-CHEN CHANG, YUAN-CHENG YANG, YUN-CHI WU