Abstract: The disclosure provides a zinc-arginine complex, methods of making the same, and methods of using the same in oral care compositions.

Abstract: A power-adjusting method for uplink transmission is provided. The power-adjusting method is applied to user equipment (UE). In response to the UE transmitting a first packet carrying a specific message to a network node, the power-adjusting method includes the UE increasing the transmission power to transmit the first packet.

Abstract: A retrofitting method for a beam with an opening is disclosed. The retrofitting method provides a hoop cooperated with an inclined stirrup to form a reinforcement set. The hoop is used to enclose the opening; and the reinforcement set may be selectively adjusted according to the distance between the edge of opening and a column face. The retrofitting method and reinforcement set are not only suitable for openings located in the non-plastic hinge zone of the beam, but also suitable for the openings located in the plastic hinge zone.

Abstract: A foldable sight implementable on a firearm includes a base, a hinge and a sight body. The base is configured to be mounted on a portion of the firearm. The sight body is pivotably attached to the base by the hinge and contains a position holding device therein. The position holding device is configured to hold the sight body at either a first position or a second position responsive to the sight body being rotated from one of the first and second positions to another of the first and second positions.

Abstract: This application relates to the field of wireless charging technologies. The wireless charging transmitting apparatus includes a transmit antenna array and a first controller. The wireless charging receiving apparatus includes a power receiving antenna and a second controller. When receiving a charging request signal, the first controller controls the transmit antenna array to successively switch to each polarization state to transmit a power signal. The second controller sends feedback information indicating a magnitude of energy obtained from the power signal. The first controller determines an optimal polarization state based on the feedback information, so that the transmit antenna array transmits a power signal in the optimal polarization state.

Abstract: A medical imaging system includes a movable station and a gantry. The movable station includes a gantry mount rotatably attached to the gantry. The gantry includes an outer C-arm slidably mounted to and operable to slide relative to the gantry mount, an inner C-arm slidably coupled to the outer C-arm and, an imaging signal transmitter and sensor attached to the C-arms. The two C-arms work together to provide a full 360 degree rotation of the imaging signal transmitter.

Abstract: A device assembly system includes a control apparatus, a mobile apparatus, a lifting apparatus, and a plug in/out apparatus. The control apparatus is configured to control, based on an operation and maintenance instruction, the mobile apparatus, the lifting apparatus, and the plug in/out apparatus to complete an operation of the operation and maintenance instruction. The mobile apparatus is configured to move the device assembly system to a first location, and the first location identifies a rack in which a device is assembled. The lifting apparatus is configured to move the plug in/out apparatus to a target location in a first direction. The plug in/out apparatus is configured to place the device to be assembled at the target location, or obtain the device from the target location.

Abstract: Disclosed are methods and compositions for treating cell proliferative diseases and disorders such as cancers. Particularly disclosed are methods and composition for treating cancers such as glioblastoma by administering a therapeutic agent that inhibits the biological activity of the autophagy related 4B cysteine peptidase (ATG4B) protein in conjunction with additional therapeutic agents or treatments.

Abstract: A chip package and method for fabricating the same are provided that includes a power delivery network (PDN) with non-uniform electrical conductance. The electrical conductance through each current path of the PDN may be selected to balance the distribution of current flow across the current paths through the chip package, thus compensating for areas of high and low current draw found in conventional designs.

Abstract: A transport system is provided. The transport system includes a stocker configured to store an assigned wafer carrier and having a gate port. The transport system also includes a semiconductor apparatus configured to transmit a request signal including a processed time according to a processing wafer carrier loaded on the semiconductor apparatus. The transport system further includes a vehicle configured to transport the assigned wafer carrier from the gate port to the semiconductor apparatus and a control system configured to control the vehicle. When the control system receives the request signal, the control system controls the stocker to transport the assigned wafer carrier inside of the stocker to the gate port at a start time, which is earlier than the processed time, and the control system controls the vehicle to transport the assigned wafer carrier from the gate port to the semiconductor apparatus.

Abstract: Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.

Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a source region and a drain region arranged over and/or within a substrate. Further, a shallow trench isolation (STI) structure is arranged within the substrate and between the source and drain regions. A gate electrode is arranged over the substrate, over the STI structure, and between the source and drain regions. A portion of the gate electrode extends into the STI structure such that a bottommost surface of the portion of the gate electrode is arranged between a topmost surface of the STI structure and a bottommost surface of the STI structure.

Abstract: An integrated circuit includes a first active region of a first set of transistors of a first type, a second active region of a second set of transistors of the first type, a third active region of a third set of transistors of the first type, a fourth active region of a fourth set of transistors of the first type and a fifth active region of a fifth set of transistors of a second type. The first, second, fourth and fifth active region have a first width in a second direction, and are on a first level. The third active region is on the first level, and has a second width different from the first width. The second active region is adjacent to the first boundary, and is separated from the first active region in the second direction. The fourth active region is adjacent to the second boundary.

Abstract: A package structure includes first and second package components, an underfill layer disposed between the first and second package components, and a metallic layer. The first package component includes semiconductor dies, a first insulating encapsulation laterally encapsulating the semiconductor dies, and a redistribution structure underlying first surfaces of the semiconductor dies and the first insulating encapsulation. The second package component underlying the first package component is electrically coupled to the semiconductor dies through the redistribution structure. The underfill layer extends to cover a sidewall of the first package component, the metallic layer overlying second surfaces of the semiconductor dies and the first insulating encapsulation, and a peripheral region of the second surface of the first insulating encapsulation is accessibly exposed by the metallic layer, where the first surfaces are opposite to the second surfaces.

Abstract: The present invention discloses a smart clothing and its device mount, wherein the device mount includes an upper casing and a lower casing, a circuit board is arranged between the upper casing and the lower casing, and a metal contact of the top surface of the circuit board penetrates through the upper casing to form a plurality of metal contact points, and the cable interface of the bottom surface of the circuit board passes through the lower casing, and the bottom surface of the lower casing is formed with individual cable grooves toward each cable interface for guiding the transmission wire to insert into the cable interface along the cable groove, and the device mount is combined with a soft gasket on the clothing body and is equipped with a waterproof protective layer to avoid damage to the circuit components and transmission wire during cleaning; when the device mount is installed with the electronic device, the motion status can be monitored.

Abstract: A device implementable on a firearm includes a monolithic upper receiver, comprising an upper receiver portion and a handguard portion, which is configured to accommodate non-proprietary barrel assemblies dimensioned according to United States military standard (mil-spec) barrel assembly dimensions and non-proprietary bolt carrier groups (BCGs) dimensioned according to mil-spec BCG dimensions. The device also includes a charging handle assembly configured to be coupled to an operating rod of a gas system of the firearm and forward of a BCG of the firearm. The device further includes a barrel locking system including a locking plate and a locking screw. When the locking screw is screwed into a threaded hole on the locking plate, the locking plate engages with a side of a barrel extension of the barrel assembly in a radial directions perpendicular to a longitudinal axis of the barrel assembly.

Abstract: A firearm muzzle attachment mechanism includes a muzzle device; a tapering adapter having an outer tapering end configured to connect with the muzzle device; a hollow adapter having an internally threaded portion and configured to receive the muzzle device; a muzzle attachment having an inner tapering end configured to connect with the outer tapering end of the tapering adapter; and a means for providing tension being received in a receiving slot formed on the muzzle attachment.

Abstract: The present invention relates to RNAi constructs for reducing expression of the ASGR1 gene. Methods of using such RNAi constructs to treat or prevent cardiovascular disease, such as coronary artery disease and myocardial infarction, and to reduce serum non-HDL cholesterol levels are also described.

Abstract: A processing chamber includes a grid and a first disk. The grid includes a plurality of holes arranged in the processing chamber. The grid partitions the processing chamber into a first chamber in which plasma is generated and a second chamber in which a pedestal is configured to support a substrate. The first disk is arranged in the second chamber. The first disk is movable between the grid and the substrate when supported on the pedestal.

Abstract: An electronic device, including a circuit board and a back plate, is provided. The circuit board has a first opening. The back plate includes a bottom portion, a protruding portion, and a column. The protruding portion protrudes from the bottom portion, and the column is located on the protruding portion. In a first direction, the column has a first outer diameter and a second outer diameter. A first width of the first opening is less than the first outer diameter and greater than the second outer diameter to limit the movement of the circuit board. The electronic device of the disclosure limits the movement of the circuit board through the column of the back plate, so as to reduce the number of screws used, thereby achieving the effects of reducing costs and/or reducing man-hours for locking the screws.