Abstract: An exemplary outdoor lamp includes a light source, a light-pervious cover, and a heating element. The light source is configured for emitting light. The light-pervious cover is for transmission of the light emitted from the light source therethrough. The heating element is in thermal contact with the light-pervious cover and is configured for heating the light-pervious cover.

Abstract: An exemplary light emitting diode (LED) assembly includes a cover, a substrate, a LED unit, a first electrode terminal, and a second electrode terminal. The substrate includes a first surface and a second surface on an opposite side of the substrate thereto. The substrate and the cover cooperatively define a cavity. The LED unit is received in the cavity. The first and the second electrode terminals extend from the second surface. The first electrode terminal is electrically connected to one of a positive lead and a negative lead of the LED unit and the second electrode terminal is electrically connected to the other. The second electrode terminal includes a first electrode portion and a second electrode portion symmetrically arranged at opposite sides of the first electrode terminal. The first and the second electrode portions are at least partially symmetrical with respect to the first electrode terminal.

Abstract: A lamp assembly (10) is provided. The lamp assembly includes a lamp cover (12) having a first end (120) and an opposite second end (122). The lamp cover tapers from the second end to the first end. A hydrophobic coating (128) is formed on and covers an outer surface of the lamp cover. A light source (16) is received in the lamp cover.

Abstract: The present invention relates to a light source assembly and a backlight module including the same. The light source assembly (10) includes a light source (12) and a light guide plate (16). The light source (12) includes a light-emitting layer (122). The light source assembly (10) further includes a transparent filling layer (14) is interposed between the light source (12) and the light guide plate (16). The light source assembly (10) can reduce reflection and refraction loss when the light beam enters the light guide plate (16).

Abstract: An exemplary light emitting diode (LED) assembly includes a cover, a substrate, a LED unit, a first electrode terminal, and a second electrode terminal. The substrate includes a first surface and a second surface on an opposite side of the substrate thereto. The substrate and the cover cooperatively define a cavity. The LED unit is received in the cavity. The first and the second electrode terminals extend from the second surface. The first electrode terminal is electrically connected to one of a positive lead and a negative lead of the LED unit and the second electrode terminal is electrically connected to the other. The second electrode terminal includes a first electrode portion and a second electrode portion symmetrically arranged at opposite sides of the first electrode terminal. The first and the second electrode portions are at least partially symmetrical with respect to the first electrode terminal.

Abstract: An exemplary light emitting diode (LED) assembly includes a cover, a substrate, a LED unit, a first electrode terminal, and a second electrode terminal. The substrate includes a first surface and a second surface on an opposite side of the substrate thereto. The substrate and the cover cooperatively define a cavity. The LED unit is received in the cavity. The first and the second electrode terminals extend from the second surface. The first electrode terminal is electrically connected to one of a positive lead and a negative lead of the LED unit and the second electrode terminal is electrically connected to the other. The second electrode terminal includes a first electrode portion and a second electrode portion symmetrically arranged at opposite sides of the first electrode terminal. The first and the second electrode portions are at least partially symmetrical with respect to the first electrode terminal.

Abstract: An exemplary solid-state light emitting device includes a substrate, a light emitting structure, a first electrode and a second electrode have opposite polarities with each other. The light emitting structure is formed on the substrate and includes a first-type semiconductor layer and a second-type semiconductor layer. The first electrode is electrically connected with the first-type semiconductor layer. The second electrode includes a transparent conductive layer formed on the second-type semiconductor layer and a metallic conductive layer formed on a region of the transparent conductive layer and in electrical contact therewith. Any point on the region is no more than 300 micrometers from a nearest part of the metallic conductive layer, and an exposed portion uncovered by the metallic conductive layer of the region has an area of at least 80% of a total area of the transparent conductive layer.

Abstract: A light source module includes a plurality of light emitting diodes (21), a heat dissipation device (27) and a thermoelectric cooler (24) having a cold side (241) and a hot side (242). The light emitting diodes thermally contact with the cold side of the thermoelectric cooler. The heat dissipation device thermally contacts with the hot side of the thermoelectric cooler.

Abstract: A light emitting diode (80) includes a first and a second semiconductor structures (30, 40), and an adhesive layer (34, 46) between the first and the second semiconductor structures. The first semiconductor structure includes a n-type AlGaInP cladding layer (13), a p-type AlGaInP cladding layer (17), an AlGaInP active layer (15) between the n-type and the p-type AlGaInP cladding layers, a transparent conducting layer (62) on the n-type AlGaInP cladding layer, a first electrical contact (82) on the transparent conducting layer, ohmic electrodes (21) ohmic contact the p-type AlGaInP cladding layer, and a reflecting layer (32) on an opposite side of the p-type AlGaInP cladding layer to the AlGaInP active layer. The second semiconductor structure includes a carrier substrate (42), an ohmic contact layer (44) on the carrier substrate, and a second electrical contact (74) on an opposite side of the carrier substrate to the ohmic contact layer.

Abstract: A light emitting diode includes a first electrode, a second electrode, at least a first LED chip, at least a second LED chip, and an encapsulant. The second electrode has an opposite polarity with the first electrode and parallel with the first electrode. The first LED chip is electrically connected to the first electrode and the second electrode, for emitting first light of a first wavelength. The second LED chip is electrically connected to the first electrode and the second electrode, for emitting second light of a second wavelength being in a range from 570 nm to 670 nm. The encapsulant encapsulates the first and second LED chip therein, and has a phosphor material doped therein. The phosphor material is configured for emitting white light by excitation of the first light, and the second light is configured for adjusting a color temperature of the combined white light.

Abstract: A lamp assembly (10) is provided. The lamp assembly includes a lamp cover (12) having a first end (120) and an opposite second end (122). The lamp cover tapers from the second end to the first end. A hydrophobic coating (128) is formed on and covers an outer surface of the lamp cover. A light source (16) is received in the lamp cover.

Abstract: An exemplary outdoor lamp includes a light source, a light-pervious cover, and a heating element. The light source is configured for emitting light. The light-pervious cover is for transmission of the light emitted from the light source therethrough. The heating element is in thermal contact with the light-pervious cover and is configured for heating the light-pervious cover.

Abstract: A street lamp includes a lamp holder; a light generating unit, a brightness measuring unit and a display unit. The light generating unit is arranged on the lamp holder for emitting light. The brightness measuring unit is arranged on the lamp holder and exposed to light radiation of the light generating unit. The brightness measuring unit is configured for measuring a brightness of the light generating unit.

Abstract: A light emitting diode (80) includes a first and a second semiconductor structures (30, 40), and an adhesive layer (34, 46) between the first and the second semiconductor structures. The first semiconductor structure includes a n-type AlGaInP cladding layer (13), a p-type AlGaInP cladding layer (17), an AlGaInP active layer (15) between the n-type and the p-type AlGaInP cladding layers, a transparent conducting layer (62) on the n-type AlGaInP cladding layer, a first electrical contact (82) on the transparent conducting layer, ohmic electrodes (21) ohmic contact the p-type AlGaInP cladding layer, and a reflecting layer (32) on an opposite side of the p-type AlGaInP cladding layer to the AlGaInP active layer. The second semiconductor structure includes a carrier substrate (42), an ohmic contact layer (44) on the carrier substrate, and a second electrical contact (74) on an opposite side of the carrier substrate to the ohmic contact layer.

Abstract: A light source module includes a plurality of light emitting diodes (21), a heat dissipation device (27) and a thermoelectric cooler (24) having a cold side (241) and a hot side (242). The light emitting diodes thermally contact with the cold side of the thermoelectric cooler. The heat dissipation device thermally contacts with the hot side of the thermoelectric cooler.

Abstract: An exemplary solid-state light emitting device includes a substrate, a light emitting structure, a first electrode and a second electrode have opposite polarities with each other. The light emitting structure is formed on the substrate and includes a first-type semiconductor layer and a second-type semiconductor layer. The first electrode is electrically connected with the first-type semiconductor layer. The second electrode includes a transparent conductive layer formed on the second-type semiconductor layer and a metallic conductive layer formed on a region of the transparent conductive layer and in electrical contact therewith. Any point on the region is no more than 300 micrometers from a nearest part of the metallic conductive layer, and an exposed portion uncovered by the metallic conductive layer of the region has an area of at least 80% of a total area of the transparent conductive layer.

Abstract: The present invention relates to a light source assembly and a backlight module including the same. The light source assembly (10) includes a light source (12) and a light guide plate (16). The light source (12) includes a light-emitting layer (122). The light source assembly (10) further includes a transparent filling layer (14) is interposed between the light source (12) and the light guide plate (16). The light source assembly (10) can reduce reflection and refraction loss when the light beam enters the light guide plate (16).

Abstract: An exemplary writing board includes a deformable thin film, a backlight module, and a light-transmissive film. The thin film has a writing surface and a light incident surface on an opposite side of the thin film to the writing surface. The backlight module is arranged adjacent to the light incident surface and configured for providing light incident onto the light incident surface. The light-transmissive film is arranged between the thin film and the backlight module. A clearance is formed between the light-transmissive film and the thin film, and a distance of the clearance, along a thicknesswise direction of the thin film, is less than or equal to a maximum deformation amount of the thin film at the same direction.

Abstract: An exemplary touch controlled display device includes is provided. The touch controlled display device includes a touch screen, a light emitting diode (LED) array substrate, and a control unit electronically connected with the touch screen and the LED array substrate. The touch screen is configured for allowing a user to touch thereon to generate a touch point and generating an input signal associated with the location of the touch point. The LED array substrate includes a number of LED units and each of the LED units corresponds to a pixel element of the touch controlled display device. The control unit is configured for receiving the input signal from the touch screen, obtaining the location coordinates of the touch point and generating a command signal to control the on/off states of the one or more LED units corresponding to the touch point.

Abstract: A light-emitting diode includes: a light-emitting structure, a transparent electrically conductive thick film, a first electrical contact and a second electrical contact. The light-emitting structure includes a first-type cladding layer, a second-type cladding layer, and an active layer sandwiched between the first-type cladding layer and the second-type cladding layer. The transparent electrically conductive thick film is formed on the first-type cladding layer. The first electrical contact is located on the transparent electrically conductive thick film. The second electrical contact is located on the second-type cladding layer. The transparent electrically conductive thick film is made from a metal-doped metal oxide.