Abstract: A touch control display device (100) includes a base plate (120), a touch screen panel (100) arranged on the base plate, a plurality of touch-controlled light-emitting modules (130) arranged on the base plate, and a plurality of trigger electrodes (140) arranged on the touch screen. Each touch-controlled light-emitting module includes a light-emitting diode (131) and a silicon controlled rectifier (132) electrically connected to the corresponding light-emitting diode in series. The silicon controlled rectifier is configured for turning on or off the corresponding light-emitting diode based on a control signal. The trigger electrodes spatially correspond to the respective touch-controlled light-emitting modules. Each trigger electrode is electrically connected to one corresponding silicon controlled rectifier and configured for receiving the control signal and transmitting the control signal to the corresponding silicon controlled rectifier.

Abstract: An exemplary light emitting diode (LED) lamp is provided. The LED lamp includes a base, an encapsulation, a circuit carrier, a first LED chip, a second LED chip, a first electrode, and a second electrode. The base and the encapsulation cooperatively define a sealed space. The circuit board, along with the first and the second LED chips carried thereon, are received in the sealed space. The first and the second LED chips are electrically connected to the circuit board. The first LED chip is electrically connected with the second LED chip in anti-parallel. The first and the second electrodes are electrically connected to the circuit board so as to supply power to the first and the second LED chips. A LED assembly and a LED string, both employing the aforementioned LED lamp therein, also are provided.

Abstract: An exemplary light emitting diode (LED) assembly includes a cover, a substrate, a LED unit, a first electrode terminal, and a second electrode terminal. The substrate includes a first surface and a second surface on an opposite side of the substrate thereto. The substrate and the cover cooperatively define a cavity. The LED unit is received in the cavity. The first and the second electrode terminals extend from the second surface. The first electrode terminal is electrically connected to one of a positive lead and a negative lead of the LED unit and the second electrode terminal is electrically connected to the other. The second electrode terminal includes a first electrode portion and a second electrode portion symmetrically arranged at opposite sides of the first electrode terminal. The first and the second electrode portions are at least partially symmetrical with respect to the first electrode terminal.

Abstract: A display device includes a display module and a magnetic bar. The display module includes a plurality of display cells. Each display cell includes an LED module, a supporting member located a side of the LED module and supporting the LED module and a control device disposed in the supporting member. The control device includes a switch connecting with the LED module and a magnet received in the supporting member. The LED module connects with poles of a power. When the magnetic bar moves towards or away from the display module, a magnetic force is generated between the magnet and the magnetic bar to control the magnet moves adjacent to or away from the LED module to illumine or quench the LED module.

Abstract: The specification discloses a highly heat dissipative chip module along with its substrate. The chip module contains a highly heat dissipative substrate with several chips installed thereon. The highly heat dissipative substrate is prepared by forming an insulating layer on the surface of a metal compound plate. A copper wired layer is installed on the insulating layer. The copper wired layer can be used to adhere to the chip. The material of the substrate is preferably an aluminum compound material with a high thermal conduction coefficient. It has the advantages of having a light weight and reducing thermal deformations. The insulating layer is also formed using a material with good thermal conductivity, particularly metal oxides with thermal conduction coefficients higher than resins or fibers. The chip can thus homogeneously distribute heat to the whole printed circuit board, dissipating heat into the ambient space.