Patents by Inventor Yuan Feng

Yuan Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250118475
    Abstract: Disclosed is an integrated magnetic element including a magnetic core structure, a transformer coil group and an excitation coil. The magnetic core structure includes a magnetic frame, at least one transformer magnetic column and at least one induction magnetic column, the transformer magnetic column connects a first side wall and a second side wall of the magnetic frame opposite to each other, there is no air gap between the first side wall and the transformer magnetic column and between the second side wall and the transformer magnetic column, the induction magnetic column is connected to the first side wall, and there is an air gap between the induction magnetic column and the second side wall. The transformer coil group is wound around the transformer magnetic column. The excitation coil is wound around the induction magnetic column and is connected in parallel with a primary-side coil of the transformer coil group.
    Type: Application
    Filed: August 2, 2024
    Publication date: April 10, 2025
    Inventors: Chen CHEN, Chi-Yuan FENG, De-Jia LU
  • Patent number: 12268600
    Abstract: A method of reshaping a severely stenosed aortic valve having leaflets with bicuspid malformation and severe calcification. The method includes delivering a balloon with an expandable distal end to the aortic valve, expanding the balloon so that the distal end of the balloon is expanded to push the leaflets upward from bottom of the aortic valve to reshape the leaflets, and forming a space compliant to a self-expandable interventional valve for release, thereby facilitating the following TAVR procedure, reducing the adverse consequences of the TAVR procedure, and improving the surgical stability and the surgical prognosis.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: April 8, 2025
    Assignee: VENUS MEDTECH (HANGZHOU) INC.
    Inventors: Mao Chen, Yuan Feng, Zhenjun Zi, Zhengang Zhao, Hou-Sen Lim
  • Patent number: 12272687
    Abstract: A semiconductor device package includes a redistribution layer, a plurality of conductive pillars, a reinforcing layer and an encapsulant. The conductive pillars are in direct contact with the first redistribution layer. The reinforcing layer surrounds a lateral surface of the conductive pillars. The encapsulant encapsulates the first redistribution layer and the reinforcing layer. The conductive pillars are separated from each other by the reinforcing layer.
    Type: Grant
    Filed: December 6, 2022
    Date of Patent: April 8, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ya Fang Chan, Yuan-Feng Chiang
  • Publication number: 20250029940
    Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a dielectric layer. The semiconductor device package further includes an antenna structure disposed in the dielectric layer. The semiconductor device package further includes a semiconductor device disposed on the dielectric layer. The semiconductor device package further includes an encapsulant covering the semiconductor device. The semiconductor device package further includes a conductive pillar having a first portion and a second portion. The first portion surrounded by the encapsulant and the second portion embedded in the dielectric layer.
    Type: Application
    Filed: October 1, 2024
    Publication date: January 23, 2025
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ya Fang CHAN, Yuan-Feng CHIANG, Po-Wei LU
  • Publication number: 20240413115
    Abstract: A package structure is provided. The package structure includes an electronic component, an encapsulant, a first conductive pillar, a first dielectric layer. The electronic component has an active surface. The encapsulant encapsulates the electronic component and exposes the active surface of the electronic component. The first conductive pillar is over the active surface of the electronic component, wherein an upper surface of the first conductive pillar includes a concave portion. The first dielectric layer is over the encapsulant and the active surface of the electronic component, wherein the first dielectric layer defines an opening exposing the concave portion of the first conductive pillar.
    Type: Application
    Filed: June 7, 2023
    Publication date: December 12, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Ling YEH, Yuan-Feng CHIANG, Chung-Hung LAI, Chin-Li KAO
  • Patent number: 12113360
    Abstract: A method and a device for forecasting an electric load, an electronic device, and a computer-readable storage medium are provided. The method includes: acquiring historical load data prior to a forecast date; generating a load sequence based on the historical load data; performing variational mode decomposition on the load sequence, to obtain multiple intrinsic mode components and a residual that are corresponding to the load sequence; and inputting the multiple intrinsic mode components and the residual into respective forecasting models, and determining a load value on the forecast date based on forecasting results of all the forecasting models.
    Type: Grant
    Filed: September 6, 2023
    Date of Patent: October 8, 2024
    Assignee: SHANGHAI MAKESENS ENERGY STORAGE TECHNOLOGY CO., LTD.
    Inventors: Decheng Wang, Peng Ding, Weikun Wu, Haowen Ren, Yuan Feng, Wei Song, Guopeng Zhou, Zonglin Cai, Xiao Yan, Enhai Zhao
  • Patent number: 12107056
    Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a dielectric layer. The semiconductor device package further includes an antenna structure disposed in the dielectric layer. The semiconductor device package further includes a semiconductor device disposed on the dielectric layer. The semiconductor device package further includes an encapsulant covering the semiconductor device. The semiconductor device package further includes a conductive pillar having a first portion and a second portion. The first portion surrounded by the encapsulant and the second portion embedded in the dielectric layer.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: October 1, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ya Fang Chan, Yuan-Feng Chiang, Po-Wei Lu
  • Publication number: 20240320223
    Abstract: A computer-implemented method, system and computer program product for recommending join operations of relational data among different tables. Relationships between one or more pairs of columns of relational data for one or more pairs of tables are identified by determining the semantic similarity between each pair of columns of relational data. The data content join converge for each of the identified relationships in connection with joining the tables involved in such identified relationships is determined. Furthermore, a join strength (indication of the degree that the relational data in the paired columns match) is calculated for each of the identified relationships based on the semantic similarity and the data content join coverage for such identified relationships. Based on the calculated join strength as well as other factors, a combination optimization algorithm identifies the best join combinations of relational data of the tables among a set of tables.
    Type: Application
    Filed: March 20, 2023
    Publication date: September 26, 2024
    Inventors: Yuan Feng, Ling Zhuo, Qi Min, Pei Pei Liang, Yue Yang, Jun Wang
  • Patent number: 12093263
    Abstract: A computer-implemented method, system and computer program product for recommending join operations of relational data among different tables. Relationships between one or more pairs of columns of relational data for one or more pairs of tables are identified by determining the semantic similarity between each pair of columns of relational data. The data content join converge for each of the identified relationships in connection with joining the tables involved in such identified relationships is determined. Furthermore, a join strength (indication of the degree that the relational data in the paired columns match) is calculated for each of the identified relationships based on the semantic similarity and the data content join coverage for such identified relationships. Based on the calculated join strength as well as other factors, a combination optimization algorithm identifies the best join combinations of relational data of the tables among a set of tables.
    Type: Grant
    Filed: March 20, 2023
    Date of Patent: September 17, 2024
    Assignee: International Business Machines Corporation
    Inventors: Yuan Feng, Ling Zhuo, Qi Min, Pei Pei Liang, Yue Yang, Jun Wang
  • Publication number: 20240297138
    Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first substrate and through vias formed through the first substrate. The package further includes redistribution layers formed over the first substrate and connected to the through vias and a first pillar layer formed over the redistribution layers. The package further includes a first barrier layer formed over the first pillar layer and a first cap layer formed over the first barrier layer. The package further includes an underfill layer formed over the redistribution layers and surrounding the first pillar layer, the first barrier layer, and the first cap layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first sidewall surface of the first pillar layer and a second sidewall surface of the first cap layer.
    Type: Application
    Filed: May 13, 2024
    Publication date: September 5, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Hung CHEN, Yu-Nu HSU, Chun-Chen LIU, Heng-Chi HUANG, Chien-Chen LI, Shih-Yen CHEN, Cheng-Nan HSIEH, Kuo-Chio LIU, Chen-Shien CHEN, Chin-Yu KU, Te-Hsun PANG, Yuan-Feng WU, Sen-Chi CHIANG
  • Publication number: 20240255576
    Abstract: A battery temperature monitoring point identification and abnormality detection method is provided according to the present disclosure. The method is applied to a battery module, and a temperature sensor inside the battery module is determined as a temperature monitoring point of a battery. The method includes: establishing a second-order RC equivalent circuit model of the battery in the battery module; performing parameter identification on the second-order RC equivalent circuit model to obtain an optimal parameter; obtaining distances between multiple temperature monitoring points in the battery module and the battery by using the obtained optimal parameter; and determining effectiveness of the temperature monitoring points based on the obtained distances between the temperature monitoring points and the battery.
    Type: Application
    Filed: December 27, 2023
    Publication date: August 1, 2024
    Applicant: Shanghai Makesens Energy Storage Technology Co., Ltd.
    Inventors: Haowen REN, Qiong WEI, Xiao YAN, Enhai ZHAO, Decheng WANG, Yuan FENG, Peng DING, Weikun WU, Fengwei TANG
  • Publication number: 20240257185
    Abstract: Systems and methods for estimating advertisement impressions needed for detecting sales lift are disclosed. In some embodiments, based on an impression estimation request received from a computing device, a disclosed system determines an item set including items proposed to be advertised with an advertising campaign, and a time period proposed for the advertising campaign. Based on at least one model and historical transaction data associated with the item set, control sales data in the time period is computed for the item set without the advertising campaign. Based on a trained model and additional data associated with the item set, the system computes a number of impressions needed to detect a target sales lift compared to the control sales data in the time period for the item set with the advertising campaign. Based on the number of impressions, the system generates and transmits estimated impression data to the computing device.
    Type: Application
    Filed: January 26, 2024
    Publication date: August 1, 2024
    Inventors: Hangjian Li, Yuan Feng, Dong Xu
  • Publication number: 20240249555
    Abstract: A method for detecting a human behavior includes: obtaining an image to be detected; obtaining a plurality of key points and a plurality of pieces of position information respectively corresponding to the plurality of key points by key-point recognition on the image to be detected; grouping the plurality of key points based on the plurality of pieces of position information to obtain a plurality of key-point groups, the plurality of key-point groups at least including a part of the plurality of key points; and determining a target human behavior based on key points in the plurality of key-point groups.
    Type: Application
    Filed: April 20, 2022
    Publication date: July 25, 2024
    Applicant: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.
    Inventors: Song Xue, Yuan Feng, Ying Xin, Bin Zhang, Chao Li, Xiaodi Wang, Yunhao Wang, Yi Gu, Xiang Long, Honghui Zheng, Yan Peng, Zhuang Jia, Shumin Han
  • Patent number: 12039011
    Abstract: An embodiment generates an initial set of training data from monitoring data. The initial set of training data is generated by combining outputs from a plurality of pretrained classifiers. The embodiment trains a new classification model using the initial set of training data to identify anomalies in monitoring data. The embodiment performs a multiple-level clustering of the data samples resulting in a plurality of clusters of sub-clusters of data samples, and generates a review list of data samples by selecting a representative data sample from each of the clusters. The embodiment receives an updated data sample from the expert review that includes a revised target classification for at least one of the data samples of the expert review list. The embodiment then trains another replacement classification model using a revised set of training data that includes the updated data sample and associated revised target classification.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: July 16, 2024
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Ke Wei Wei, Jun Wang, Shuang YS Yu, Guang Ming Zhang, Yuan Feng, Yi Dai, Ling Zhuo, Jing Xu
  • Publication number: 20240225823
    Abstract: A heart valve prosthesis device includes a stent and leaflets. The stent includes an annular part and guide parts. A first end of the annular part includes cell sections arranged in sequence in a circumferential direction of the annular part. The guide parts are arranged at intervals in the circumferential direction of the annular part, one side of each guide part is connected to a corresponding cell section, and the other side gradually tapers to an end where a retrieval cell is provided for a pulling wire to pass through. Each guide part includes a first region being the retrieval cell, a second region aligned with the first region and configured as a central region, and a third region and a fourth region distributed on two sides of the central region in the circumferential direction of the annular part.
    Type: Application
    Filed: December 25, 2023
    Publication date: July 11, 2024
    Inventors: Quangang Gong, Mao Chen, Yuan Feng, Yaru Li, Dan Rui
  • Publication number: 20240193923
    Abstract: A method of training a target object detection model includes: extracting a plurality of feature maps of a sample image according to a training parameter, fusing the plurality of feature maps to obtain at least one fused feature map, and obtaining an information of a target object based on the at least one fused feature map, by using the target object detection model; determining a loss of the target object detection model based on the information of the target object and a tag information of the sample image, and adjusting the training parameter according to the loss of the target object detection model. A method of detecting a target object and an apparatus are also provided.
    Type: Application
    Filed: January 29, 2022
    Publication date: June 13, 2024
    Inventors: Xiaodi WANG, Shumin HAN, Yuan FENG, Ying XIN, Yi GU, Bin ZHANG, Chao LI, Xiang LONG, Honghui ZHENG, Yan PENG, Zhuang JIA, Yunhao WANG
  • Patent number: 12001517
    Abstract: A positioning method includes clustering points in a first point cloud through multi-clustering to obtain a target point cloud, where the target point cloud represents a feature of a target object, and the first point cloud includes the target point cloud and a point cloud that represents a feature of an interfering object; and determining a position of the target object based on the target point cloud.
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: June 4, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Sunpei Zhang, Yuan Feng, Wei Li, Peng Zhou
  • Publication number: 20240178469
    Abstract: A method and an apparatus for monitoring energy storage cell abnormality, an electronic device, and a medium are provided. The method includes: obtaining valid state data of a first cell in a battery module at a preset time; obtaining a discrete statistical state characteristic of the first cell based on the valid state data of the first cell; calculating distances between the discrete statistical state characteristic of the first cell and discrete statistical state characteristics of each remaining cells in the battery module separately, averaging the set of distances, to obtain a distance characteristic associated with the first cell; and determining whether the first cell is abnormal based on the distance characteristic of the first cell. Consistency monitoring of each cell in the battery module is implemented based on the state data of each cell, so that an early warning indicative of a possible fault can be issued.
    Type: Application
    Filed: November 24, 2023
    Publication date: May 30, 2024
    Applicant: Shanghai Makesens Energy Storage Technology Co., Ltd.
    Inventors: Weikun WU, Danfei GU, Peng DING, Xiao YAN, Enhai ZHAO, Haowen REN, Decheng WANG, Yuan FENG
  • Publication number: 20240170975
    Abstract: A method, system, device, and medium for recharging a battery module are disclosed. The method comprises: identifying initial rechargeable batteries within the battery module; selecting from the initial rechargeable batteries, a reference rechargeable battery that satisfies preset charging and discharging conditions, and designating the remaining batteries of the initial rechargeable batteries as target rechargeable batteries; and determining a target capacity for each of the target rechargeable batteries based on the historical charging and discharging parameters of the reference rechargeable battery and each of the target rechargeable batteries; establishing a recharge termination condition for each of the target rechargeable batteries based on the target capacity; and recharging each of the target rechargeable batteries in accordance with its respective recharge termination condition. Considering the unique conditions of each battery, settings for recharge are individualized.
    Type: Application
    Filed: November 19, 2023
    Publication date: May 23, 2024
    Applicant: Shanghai Makesens Energy Storage Technology Co., Ltd.
    Inventors: Peng DING, Xiao YAN, Enhai ZHAO, Qiqi YIN, Haowen REN, Yuan FENG, Weikun WU, Decheng WANG
  • Patent number: 11984419
    Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li, Shih-Yen Chen, Cheng-Nan Hsieh, Kuo-Chio Liu, Chen-Shien Chen, Chin-Yu Ku, Te-Hsun Pang, Yuan-Feng Wu, Sen-Chi Chiang