Abstract: The present disclosure provides a method, a device and a terminal for testing a memory chip. The method may include setting an attack mode and random attack parameters, generating a random attack command according to the attack mode and random attack parameters, attacking the memory chip according to the random attack command, and testing the attacked memory chip and generating a test result. This method is able to simulate various types of attacks and can thus perform a suitable test on the memory chip for the types of the actual attack. In addition, since the attacks can be randomized to any memory cell of the memory chip, testing of the whole memory chip is made possible.

Abstract: A chip testing method, device, electronic apparatus, and computer readable medium are provided, relating to the field of chip testing. The method includes: determining a language rule of a chip to be tested; determining product and timing specifications of the chip to be tested; selecting a test pattern from a test pattern library according to the language rule and the product and timing specifications; generating a test code according to the product and timing specifications and the test pattern; and automatically testing the chip to be tested by using the test code. The chip testing method, device, electronic apparatus and computer readable medium can automatically generate a big-data test code for complex memories, and rapidly generate, in a standardized way, test codes for DDR4 memories of different specifications, thereby improving the efficiency of chip product verification analysis.

Abstract: A manufacture method of a low temperature poly-silicon array substrate is provided. A halftone mask is utilized to realize a patterning process applied to a polysilicon layer and an N type heavy doping process of a polysilicon section of an NMOS region. In comparison with prior art, one mask is saved, and thus, the production cost is reduced, and a low temperature poly-silicon array substrate manufactured with such a process possesses excellent electronic property.

Abstract: A low temperature polysilicon array substrate and a method for manufacturing the same are disclosed. The method includes forming a light shield layer, a buffer layer, and a polysilicon island on a glass substrate in sequence, performing channel doping on an NMOS area of the polysilicon island, performing P? light doping on two sides of a PMOS area of the polysilicon island, performing N+ heavy doping, forming a gate insulating layer and a gate layer, and performing N? light doping and P+ heavy doping.

Abstract: A manufacture method of a low temperature poly-silicon array substrate is provided. A halftone mask is utilized to realize a patterning process applied to a polysilicon layer and an N type heavy doping process of a polysilicon section of an NMOS region. In comparison with prior art, one mask is saved, and thus, the production cost is reduced, and a low temperature poly-silicon array substrate manufactured with such a process possesses excellent electronic property.

Abstract: Disclosed is a low temperature polysilicon array substrate and its manufacturing method. The method includes: forming a light-shielding layer, a buffer layer and U-type polysilicon patterns successively on a glass substrate; doping channels of the U-type polysilicon patterns in the active area and then heavily N+ doping these U-type polysilicon patterns; forming a gate insulation layer and etching first via holes; forming a gate line, a source and lightly-doped regions of the N-type double-gate transistor; and heavily P+ doping U-type polysilicon patterns in the non-active area.

Abstract: The present invention provides a manufacture method of a Low Temperature Poly-silicon array substrate. A halftone mask is utilized to realize the pattern process to the polysilicon layer and the N type heavy doping process of the polysilicon section of the NMOS region. In comparison with prior art, one mask is eliminated, and thus, the production cost is reduced, and the manufactured Low Temperature Poly-silicon array substrate possesses fine electronic property.

Abstract: A low temperature polysilicon array substrate and a method for manufacturing the same are disclosed. The method includes forming a light shield layer, a buffer layer, and a polysilicon island on a glass substrate in sequence, performing channel doping on an NMOS area of the polysilicon island, performing P? light doping on two sides of a PMOS area of the polysilicon island, performing N+ heavy doping, forming a gate insulating layer and a gate layer, and performing N? light doping and P+ heavy doping.

Abstract: Disclosed is a low temperature polysilicon array substrate and its manufacturing method. The method includes: forming a light-shielding layer, a buffer layer and U-type polysilicon patterns successively on a glass substrate; doping channels of the U-type polysilicon patterns in the active area and then heavily N+ doping these U-type polysilicon patterns; forming a gate insulation layer and etching first via holes; forming a gate line, a source and lightly-doped regions of the N-type double-gate transistor; and heavily P+ doping U-type polysilicon patterns in the non-active area.

Abstract: The present invention provides a manufacture method of a Low Temperature Poly-silicon array substrate. A halftone mask is utilized to realize the pattern process to the polysilicon layer and the N type heavy doping process of the polysilicon section of the NMOS region. In comparison with prior art, one mask is eliminated, and thus, the production cost is reduced, and the manufactured Low Temperature Poly-silicon array substrate possesses fine electronic property.

Abstract: The present invention provides an array substrate and a manufacturing method thereof. The manufacturing method of the array substrate according to the present invention forms a gate electrode in the same metal layer with source and drain electrodes and divides a common electrode layer that is conventionally in the form of an entire surface into two portions, of which one serves as a common electrode, while the other portion feeds an input of a gate scan signal thereby eliminating an operation of forming an interlayer insulation layer and thus reducing manufacturing cost of the operation. The array substrate of the present invention comprises a gate electrode that is formed in the same metal layer with source and drain electrodes so that no interlayer insulation layer is present between the gate electrode and the source and drain electrodes, thereby simplifying the structure and reducing the manufacturing cost of the array substrate.

Abstract: The present invention provides an array substrate and a manufacturing method thereof. The manufacturing method of the array substrate according to the present invention forms a gate electrode in the same metal layer with source and drain electrodes and divides a common electrode layer that is conventionally in the form of an entire surface into two portions, of which one serves as a common electrode, while the other portion feeds an input of a gate scan signal thereby eliminating an operation of forming an interlayer insulation layer and thus reducing manufacturing cost of the operation. The array substrate of the present invention comprises a gate electrode that is formed in the same metal layer with source and drain electrodes so that no interlayer insulation layer is present between the gate electrode and the source and drain electrodes, thereby simplifying the structure and reducing the manufacturing cost of the array substrate.

Abstract: A method and system for collaborative order are provided. The method may include receiving a collaborative order request, containing commodity information, sent by a subscriber. A related user of the subscriber may be identified from a set of users related to the subscriber. A collaborative order invitation for the commodity may be sent to the related user to invite the related user to send sub-order information for the commodity. Order information for the commodity sent by the subscriber and sub-order information for the commodity sent by the related user may be received and combined, to obtain combined order information. The combined order information may be sent to a trading platform for processing trade of the commodity by processing the combined order information.

Abstract: A toy vehicle comprises a frame, a suspension arm pivotally coupled to the frame and arranged under a portion of the frame, at least one wheel coupled to the suspension arm, and a height switching unit coupled to the frame and the suspension arm and configured to move the portion of the frame between a non-elevated position and an elevated position.

Abstract: An approach is provided for determining the level of trust among users of a social network with respect to their co-experiences from communicating with each other without violating their privacy.

Abstract: In a process for producing a TFT display, a polysilicon layer is patterned to define a first and a second TFT regions. A first doping material is implanted into a first exposed portion in the first TFT region to define a first doped region and a first channel region, and implanted into a second exposed portion in the second TFT region to define a second doped region and a second channel region. A second doping material is implanted into a third exposed portion smaller than the first exposed portion to form first source/drain regions and simultaneously define a first LDD region in the first TFT region. A first and a second gate structures are formed over the first and the second channel regions, respectively. In a certain direction, the first gate structure is longer than the first channel, and the second gate structure isn't longer than the second channel region.

Abstract: An organic light emitting diode (OLED) display includes a substrate defined with a plurality of pixel areas, a heating circuit structure disposed on the substrate, and a plurality of OLEDs corresponding to each pixel area. The heating circuit structure includes two conductive lines not connected to each other, a plurality of heating lines electrically connected to the two conductive lines and covering portions of each pixel areas, and a ground electrode.

Abstract: A thin film transistor display includes a driving circuit and an active matrix. The driving circuit comprises a first thin film transistor structure. The first thin film transistor structure includes a first gate, source and drain regions, a first LDD region, a second LDD region and a first channel region between the first and the second LDD regions. The first gate region is disposed over the first channel region, and partially or completely overlies the first and the second LDD regions. The active matrix is controlled by the driving circuit and comprises a second thin film transistor structure. The second thin film transistor structure includes a second gate, source and drain regions, a third LDD region, a fourth LDD region and a second channel region between the third and the fourth LDD regions. The second gate region is disposed over the second channel region and substantially overlaps with neither of the first and the second LDD regions.

Abstract: A non-destructive contact test method and apparatus for testing an electric characteristic of a test object is provided. The method includes providing an apparatus having a conductor, wherein the conductor is in a liquid state; and using the conductor to contact a surface of the test object for testing the electric characteristic of the test object. Thus, damage to the test object during the test can be effectively avoided.

Abstract: A conducting line terminal structure for a display device. The conducting line terminal structure comprises a conducting member and an insulating layer covering a first section of the conductive member. A planarization layer is formed above a second section of the conductive member and overlaps a first section of the insulating layer and a conducting layer conductively couples to a third section of the conductive member.