Abstract: A light emitting device includes a substrate, an adhesion layer, a micro light emitting device (?LED), a first conductive layer, and a second conductive layer. A light emitting surface of the ?LED is away from the substrate. The ?LED includes a first semiconductive layer, a second semiconductive layer, a tether layer, a first electrode, and a second electrode. The tether layer covers a portion of sidewalls of the first semi-conductive layer, a portion of a bottom surface of the first semi-conductive layer, sidewalls of the second semiconductive layer, and a portion of a bottom surface of the second semiconductive layer. The first electrode and the second electrode are respectively electrically connected to the first semiconductive layer and the second semiconductive layer. The first conductive layer and the second conductive layer are respectively electrically connected to the first electrode and the second electrode.

Abstract: A light-emitting apparatus includes a substrate, pads disposed on the substrate, a sacrificial pattern layer and a light-emitting diode element disposed on the sacrificial pattern layer. The light-emitting diode element includes a first type semiconductor layer, a second type semiconductor layer, an active layer, and electrodes. A connection patterns disposed on at least one of the electrodes and the pads. Materials of the connection patterns include hot fluidity conductive materials. The connection patterns cover a sidewall of the sacrificial pattern layer and are electrically connected to the at least one of the electrodes and the pads. In addition, the manufacturing method of the above light-emitting apparatus is also proposed.

Abstract: An electronic computing device, a method for adjusting the trigger mechanism of a garbage collection function, and a non-transitory computer readable storage medium thereof are provided. A storage unit of the electronic computing device stores a whitelist. The whitelist records a plurality of data sets, wherein each of the data sets has a name of an application and an offset value of the application. A processor of the electronic computing device executes a system program. The system program loads the whitelist into a memory during a initialization procedure. The system program detects that a specific application is triggered and retrieves the offset value of the specific application from the whitelist in the memory according to the name of the specific application. The system program forks a process to the specific application and updates a threshold of a garbage collection function according to the offset value.

Abstract: The present invention provides a method for the preparation of an insensitive high enthalpy explosive Dihydroxylammonium 5,5?-bistetrazole-1,1?-diolate (TKX-50) in the presence of N,N-dimethylformamide, N,N-dimethylacetamide, or N-Methyl-2-pyrrolidone as a solvent via a four-step, one-pot reaction route to obtain a final product after four reaction steps. The more dangerous intermediate diazidoglyoxime may be solved by the one-pot method without the need of isolation. Further, the cyclization reaction is carried out in the presence of dropwisely added concentrated sulfuric acid to replace hydrochloric gas so no hydrochloric gas generator is needed to greatly reduce the amount of waste acid so as to effectively reduce the cost by avoiding using hydrochloric gas steel cylinders which require much safety equipment.

Abstract: A light emitting device includes a substrate, an adhesion layer, a micro light emitting device (?LED), a first conductive layer, and a second conductive layer. A light emitting surface of the ?LED is away from the substrate. The ?LED includes a first semiconductive layer, a second semiconductive layer, a tether layer, a first electrode, and a second electrode. The tether layer covers a portion of sidewalls of the first semi-conductive layer, a portion of a bottom surface of the first semi-conductive layer, sidewalls of the second semiconductive layer, and a portion of a bottom surface of the second semiconductive layer. The first electrode and the second electrode are respectively electrically connected to the first semiconductive layer and the second semiconductive layer. The first conductive layer and the second conductive layer are respectively electrically connected to the first electrode and the second electrode.

Abstract: A display panel and a method for forming a micro component support are provided. The method for forming a micro component support includes the following steps. First, a first sacrificial layer is formed on a carrier substrate, where the first sacrificial layer includes a plurality of first openings, and the first openings expose the carrier substrate. Then, a first support layer is formed on the first sacrificial layer and in the first openings. Next, a second sacrificial layer is formed on the first sacrificial layer and the first support layer, where the second sacrificial layer includes a plurality of second openings, and the second openings expose the first support layer. Then, a second support layer is formed on the second sacrificial layer and in the second openings. Next, at least one micro component is formed on the second support layer. Finally, the first sacrificial layer and the second sacrificial layer are removed.

Abstract: A display panel and a method for forming a micro component support are provided. The method for forming a micro component support includes the following steps. First, a first sacrificial layer is formed on a carrier substrate, where the first sacrificial layer includes a plurality of first openings, and the first openings expose the carrier substrate. Then, a first support layer is formed on the first sacrificial layer and in the first openings. Next, a second sacrificial layer is formed on the first sacrificial layer and the first support layer, where the second sacrificial layer includes a plurality of second openings, and the second openings expose the first support layer. Then, a second support layer is formed on the second sacrificial layer and in the second openings. Next, at least one micro component is formed on the second support layer. Finally, the first sacrificial layer and the second sacrificial layer are removed.

Abstract: A display panel and a method for forming a micro component support are provided. The method for forming a micro component support includes the following steps. First, a first sacrificial layer is formed on a carrier substrate, where the first sacrificial layer includes a plurality of first openings, and the first openings expose the carrier substrate. Then, a first support layer is formed on the first sacrificial layer and in the first openings. Next, a second sacrificial layer is formed on the first sacrificial layer and the first support layer, where the second sacrificial layer includes a plurality of second openings, and the second openings expose the first support layer. Then, a second support layer is formed on the second sacrificial layer and in the second openings. Next, at least one micro component is formed on the second support layer. Finally, the first sacrificial layer and the second sacrificial layer are removed.

Abstract: A display device includes a substrate, a first light emitting element, and a second light emitting element. The substrate includes at least one pixel area. The first light emitting element and the second emitting element are disposed in the pixel area. The first light emitting element emits light of a first color and has a first luminous efficiency-injection current density function. The second light emitting element emits light of a second color and has a second luminous efficiency-injection current density function, intersected with the first luminous efficiency-injection current density function to define a critical transform current density. The light of the first color and the light of the second color have a same color system.

Abstract: A light emitting diode includes a semiconductor structure, a first electrode, a second electrode, and an extending electrode. The semiconductor structure has at least one sidewall and includes a light emitting layer, a first semiconductor layer, and a second semiconductor layer. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The first electrode is electrically connected to the first semiconductor layer of the semiconductor structure. The first semiconductor layer is disposed between the light emitting layer and the first electrode. The second electrode is electrically connected to the second semiconductor layer of the semiconductor structure. The second semiconductor layer is disposed between the light emitting layer and the second electrode. The extending electrode is disposed on the sidewall of the semiconductor structure and is electrically connected to the second electrode.

Abstract: A display device includes a substrate, a first light emitting element, and a second light emitting element. The substrate includes at least one pixel area. The first light emitting element and the second emitting element are disposed in the pixel area. The first light emitting element emits light of a first color and has a first luminous efficiency-injection current density function. The second light emitting element emits light of a second color and has a second luminous efficiency-injection current density function, intersected with the first luminous efficiency-injection current density function to define a critical transform current density. The light of the first color and the light of the second color have a same color system.

Abstract: A device for hydrogen production with waste aluminum includes a treatment apparatus for waste aluminum and a reaction tank. The apparatus includes a first crusher, a pickling tank, and a second crusher. The first crusher is for preliminarily crushing waste aluminum to obtain first aluminum chips. The pickling tank is for receiving and pickling the first aluminum chips crushed by the first crusher. The second crusher is for receiving and fine crushing the first aluminum chips to obtain second aluminum chips. The second aluminum chips are received by the reaction tank and then hydrolyzed with an alkaline solution in the reaction tank to produce hydrogen. Since waste aluminum is used as the raw material of hydrogen production, and a specific device is used for waste aluminum treatment, so the effects of recovering waste metal, reducing environmental damage, and saving costs can be achieved at the same time.

Abstract: An electronic computing device, a method for adjusting the trigger mechanism of a garbage collection function, and a non-transitory computer readable storage medium thereof are provided. A storage unit of the electronic computing device stores a whitelist. The whitelist records a plurality of data sets, wherein each of the data sets has a name of an application and an offset value of the application. A processor of the electronic computing device executes a system program. The system program loads the whitelist into a memory during a initialization procedure. The system program detects that a specific application is triggered and retrieves the offset value of the specific application from the whitelist in the memory according to the name of the specific application. The system program forks a process to the specific application and updates a threshold of a garbage collection function according to the offset value.

Abstract: A display panel and a method for forming a micro component support are provided. The method for forming a micro component support includes the following steps. First, a first sacrificial layer is formed on a carrier substrate, where the first sacrificial layer includes a plurality of first openings, and the first openings expose the carrier substrate. Then, a first support layer is formed on the first sacrificial layer and in the first openings. Next, a second sacrificial layer is formed on the first sacrificial layer and the first support layer, where the second sacrificial layer includes a plurality of second openings, and the second openings expose the first support layer. Then, a second support layer is formed on the second sacrificial layer and in the second openings. Next, at least one micro component is formed on the second support layer. Finally, the first sacrificial layer and the second sacrificial layer are removed.

Abstract: A light emitting diode includes a semiconductor structure, a first electrode, a second electrode, and an extending electrode. The semiconductor structure has at least one sidewall and includes a light emitting layer, a first semiconductor layer, and a second semiconductor layer. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The first electrode is electrically connected to the first semiconductor layer of the semiconductor structure. The first semiconductor layer is disposed between the light emitting layer and the first electrode. The second electrode is electrically connected to the second semiconductor layer of the semiconductor structure. The second semiconductor layer is disposed between the light emitting layer and the second electrode. The extending electrode is disposed on the sidewall of the semiconductor structure and is electrically connected to the second electrode.

Abstract: A power adaptation apparatus for a wireless communication channel includes a power ratio compensator. The power ratio compensator is capable of receiving a channel quality indicator and compensating a power ratio parameter according to the channel quality indicator, wherein the power ratio parameter defines a relation between power of the wireless communication channel and power of another wireless communication channel, and is referenced for setting the power of the wireless communication channel.

Abstract: This disclosure provides systems, methods, and apparatus for providing protective coatings on electromechanical systems (EMS) devices. A display apparatus can include an electrostatic actuation assembly for controlling the position of a suspended portion of a display element. The electrostatic actuation assembly can include a load beam, drive beam, and a coating disposed over a portion of the drive beam. The coating can include a plurality of raised tabs spaced apart from each other. One or both of the size of the raised tabs and a pitch between raised tabs can be varied along a surface of the drive beam. The voltage used to actuate the actuator is, in part, related to the shape and relative position of the load and drive beams. The raised tabs can be sized, spaced, or positioned to affect a desired rest position and rest shape of the drive beam relative to the load beam.

Abstract: Embodiments of method for cooling a wafer in an ion implantation process are provided. A method for cooling the wafer in the ion implantation process includes placing the wafer in a process module. The method also includes performing the ion implantation process on the wafer and simultaneously cooling the wafer in the process module. The method further includes removing the wafer from the process module. In addition, the method includes heating up the wafer.

Abstract: Systems and methods are provided for ion implantation. For example, ion implantation is performed using a first ion implant tool. At least one condition parameter associated with the first ion implant tool is dynamically obtained. Whether the first ion implant tool is in a first condition is determined based on the at least one condition parameter. Ion implantation is performed using a second ion implant tool based on the determination.

Abstract: This disclosure provides systems, methods and apparatus for reducing capacitance between interconnects in a display apparatus. In one aspect, a display apparatus can include a plurality of light modulators each having a shutter suspended over a substrate. A first suspended interconnect can electrically couple a first light modulator and a second light modulator. A majority of the length of the first suspended interconnect can be suspended a first height above the substrate. A second suspended interconnect can electrically couple the first light modulator and a third light modulator. A majority of the length of the second suspended interconnect can be above the substrate at a different height than the first suspended interconnect.