Patents by Inventor Yuan HSU

Yuan HSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11664214
    Abstract: Embodiments of the present disclosure generally relate to the fabrication of integrated circuits. More particularly, the embodiments described herein provide techniques for depositing nitrogen-doped diamond-like carbon films for patterning applications. In one or more embodiments, a method for processing a substrate includes flowing a deposition gas containing a hydrocarbon compound and a nitrogen dopant compound into a processing volume of a process chamber having a substrate positioned on an electrostatic chuck, and generating a plasma at or above the substrate by applying a first RF bias to the electrostatic chuck to deposit a nitrogen-doped diamond-like carbon film on the substrate. The nitrogen-doped diamond-like carbon film has a density of greater than 1.5 g/cc and a compressive stress of about ?20 MPa to less than ?600 MPa.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: May 30, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Jui-Yuan Hsu, Pramit Manna, Karthik Janakiraman
  • Patent number: 11659487
    Abstract: The present invention provides a wireless device including a first wireless module and a second wireless module is disclosed. The first wireless module is configured to transmit data periodically, the second wireless module is configured to communicate with an electronic device, and the second wireless module and the first wireless module perform data transmission/reception based on a time-division multiplexing method. In addition, the second wireless module determines a wake interval and a doze interval based on traffic characteristics of the first wireless module.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: May 23, 2023
    Assignee: MEDIATEK INC.
    Inventors: Tsai-Yuan Hsu, Chia-Shun Wan, Chia-Yang Hsieh
  • Patent number: 11654638
    Abstract: A welding process of an inflatable product is provided that includes using isolating members between first and second portions of weldable tensioning members to resist the first and second portions of the weldable tensioning structures being welded together during welding of the first portions to a first sheet of weldable material and welding of the second portions to a second sheet of weldable material.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: May 23, 2023
    Assignee: Intex Marketing Ltd.
    Inventors: Hua Hsiang Lin, Yaw Yuan Hsu
  • Patent number: 11655644
    Abstract: An above ground frame pool (10) includes a frame assembly (20) and a liner (40) supported by the frame assembly (20). The frame assembly (20) includes a plurality of horizontal pipes (22), a plurality of vertical pipes (24), and a plurality of T-shaped joints (30). The joints (30) may lack mechanical fasteners with adjacent pipes or corresponding apertures. The joints (30) may be one-piece or multi-piece structures. Such joints (30) may be water-resistant and convenient to manufacture, assemble, disassemble, and store.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: May 23, 2023
    Assignee: Intex Marketing Ltd.
    Inventors: Zhi Xiong Huang, Ai Ming Tan, Yaw Yuan Hsu
  • Patent number: 11656275
    Abstract: An injection device is disclosed herein. The injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a base, a reservoir, a first testing pipe, a cleaning pipe and a liquid-draining pipe. The reservoir set on the base is provided with at least one connecting port and a dropping port, wherein the dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to at least one connecting port, wherein a first liquid is injected from the first testing pipe into the reservoir, and wherein the a cleaning liquid is injected from the cleaning pipe into the reservoir to clean the reservoir and the test area. The dropping port is utilized to drain off the first testing liquid and the cleaning liquid in the reservoir. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: May 23, 2023
    Assignee: HERMES TESTING SOLUTIONS INC.
    Inventors: Bo-Lung Chen, Wen-Yuan Hsu
  • Publication number: 20230146080
    Abstract: A base structure in an electroplating system is provided. The base structure includes: includes: an annular member; a contact ring attached to an inner surface of the annular member and configured to be electrically connected to a wafer in an electroplating process; and a pair of shield structures attached to an upper surface of the annular member and extending in an vertical direction. Each of the pair of shield structures includes: a curved plate comprising a plurality of discharging openings, wherein plating solution residual is discharged through the plurality of discharging openings in a cleaning procedure; and a plurality of bevels, each of the plurality of bevels corresponding to each of the plurality of discharging openings and configured to guide the plating solution residual toward the corresponding discharging opening in the cleaning procedure.
    Type: Application
    Filed: February 24, 2022
    Publication date: May 11, 2023
    Inventors: Chia-Sheng Lai, Chun-Yuan Hsu, Tzu-Chung Tsai
  • Publication number: 20230126461
    Abstract: A method for calculating an object pick-and-place sequence and an electronic apparatus for automatic storage pick-and-place are provided. When a warehousing operation is to be performed, the following steps are performed. A weight of an object to be stocked that is to be put on a shelf is obtained. The weight is substituted into a plurality of coordinate positions corresponding to a plurality of unused grid positions respectively, so as to calculate a plurality of estimated center of gravity positions. Whether the estimated center of gravity positions are located within a balance standard area is determined so as to sieve out a plurality of candidate grid positions from these unused grid positions. One of the candidate grid positions is selected as a recommended position of the object to be stocked.
    Type: Application
    Filed: July 13, 2022
    Publication date: April 27, 2023
    Applicant: GlobalWafers Co., Ltd.
    Inventors: Chia-Lin Li, Shang-Chi Wang, Chi Yuan Hsu, Han-Zong Wu
  • Publication number: 20230093808
    Abstract: The present disclosure relates to air assemblies having an inflation, a deflation, and a closed state for use with inflatable products, such as air mattresses. Specifically, the present disclosure relates to air assemblies where the configuration of the air assembly can be changed manually by a user by operating a directional control valve to inflate, deflate, or close the inflatable product. The directional control valve may also activate a pump in the inflation and deflation states and deactivate the pump in the closed state.
    Type: Application
    Filed: December 1, 2022
    Publication date: March 30, 2023
    Applicant: Intex Marketing Ltd.
    Inventors: Zhi Xiong Huang, Feng Chen, Huai Tian Wang, Yaw Yuan Hsu
  • Patent number: 11616133
    Abstract: A method includes forming a doped region on a top portion of a substrate, forming a first epitaxial layer over the substrate, forming a recess in the first epitaxial layer, the recess being aligned to the doped region, performing a surface clean treatment in the recess, the surface clean treatment includes: oxidizing surfaces of the recess to form an oxide layer in the recess, and removing the oxide layer from the surfaces of the recess, and forming a second epitaxial layer in the recess.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: March 28, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Che-Lun Chang, Shiao-Shin Cheng, Ji-Yin Tsai, Yu-Lin Tsai, Hsin-Chieh Huang, Ming-Yuan Wu, Jiun-Ming Kuo, Ming-Jie Huang, Yu-Wen Wang, Che-Yuan Hsu
  • Publication number: 20230082120
    Abstract: A package comprising a substrate and an integrated device coupled to the substrate through a plurality of pillar interconnects and a plurality of solder interconnects. The plurality of pillar interconnects comprises a first pillar interconnect. The first pillar interconnect comprises a first pillar interconnect portion comprising a first width and a second pillar interconnect portion comprising a second width that is different than the first width.
    Type: Application
    Filed: September 15, 2021
    Publication date: March 16, 2023
    Inventors: Yujen CHEN, Hung-Yuan HSU, Dongming HE
  • Publication number: 20230057439
    Abstract: A package comprising a substrate and an integrated device coupled to the substrate through a plurality of pillar interconnects and a plurality of solder interconnects. The plurality of pillar interconnects includes a first pillar interconnect comprising a first cavity. The plurality of solder interconnects comprises a first solder interconnect located in the first cavity of the first pillar interconnect. A planar cross section that extends through the first cavity of the first pillar interconnect may comprise an O shape. The first pillar interconnect comprises a first pillar interconnect portion comprising a first width; and a second pillar interconnect portion comprising a second width that is different than the first width.
    Type: Application
    Filed: August 23, 2021
    Publication date: February 23, 2023
    Inventors: Yujen CHEN, Hung-Yuan HSU, Dongming HE
  • Publication number: 20230058284
    Abstract: This disclosure is directed to an electronic device having a casing, a circular frame, and a display. A panel is arranged on one side of the casing, a circular opening is defined on the panel, and a first fixing structure is arranged on an inner edge of the circular opening. The circular frame is rotatably arranged in the circular opening to close the circular opening, a second fixing structure is arranged on an outer edge of the circular frame, and the second fixing structure is limited by the first fixing structure. The display is embedded in the circular frame and exposed on the panel, so that the display is rotatable according to various placing positions of the casing.
    Type: Application
    Filed: January 3, 2022
    Publication date: February 23, 2023
    Inventors: Chia-Yuan LIN, Chih-Yuan HSU, Chung-Chieh CHENG
  • Patent number: 11589376
    Abstract: A multi-radio device includes two or more radio subsystems coupled to a packet traffic arbitration (PTA) module. The PTA module receives a first request for radio communication from a first radio subsystem, where the first request indicates a first usage duration. After granting the first request, the PTA module receives a second request for radio communication from a second radio subsystem. The second request indicates a second usage duration. The PTA module sends a rejection of the second request to the second radio subsystem, where the rejection indicates a remaining time of the first usage duration.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: February 21, 2023
    Assignee: MediaTek Inc.
    Inventors: Li-Wei Chen, Tsai Yuan Hsu, Shun-Yong Huang, Chen-Feng Liu
  • Patent number: 11583743
    Abstract: A hanging assembly is disclosed for use with a flow generating device that produces a current in a pool. The hanging assembly includes a back supporting plate coupled to a side supporting plate where a plate angle is formed between the back supporting plate and the side supporting plate. The plate angle is adjustable such that a current angle of the current relative to a sidewall of the pool can be varied based on user preferences.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: February 21, 2023
    Assignee: Intex Marketing Ltd.
    Inventors: Zhi Xiong Huang, Yingbiao Zhang, Yaw Yuan Hsu
  • Publication number: 20230052458
    Abstract: A frame pool is disclosed including a frame assembly and a pool liner, the frame assembly including horizontal frame members and a vertical frame member coupled together via a T-shaped joint. The T-shaped joint may be constructed of plastic to facilitate attachment and detachment to the adjacent frame members and to resist galling and corrosion. The T-shaped joint may also be relatively small to improve the appearance and water containment of the frame pool.
    Type: Application
    Filed: October 10, 2022
    Publication date: February 16, 2023
    Applicant: Intex Marketing Ltd.
    Inventors: Hua Hsiang Lin, Yaw Yuan Hsu
  • Publication number: 20230050743
    Abstract: A method for manufacturing an electronic device is provided, the method includes: providing an inspection module to inspect a first area of the electronic device to obtain a first information and inspect a second area of the electronic device to obtain a second information; transmitting the first information and the second information to a processing system; comparing the first information and the second information to obtain a difference; and transmitting a correction information to a first process machine via a first interface system. When the difference is greater than or equal to -2 and less than or equal to 2, the first process machine is started to produce. An electronic device is also provided.
    Type: Application
    Filed: October 26, 2021
    Publication date: February 16, 2023
    Applicant: Innolux Corporation
    Inventors: Chih-Yuan Hsu, Kuang-Ming Fan, Wen-Hsiang Liao
  • Publication number: 20230045244
    Abstract: An injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a height-adjusting base, a reservoir, a first testing pipe, a cleaning pipe, a liquid-draining pipe, and an electrode rod. The reservoir is provided with a dropping port. The dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to the reservoir. The electrode rod penetrates through the reservoir and contacts and ionizes a testing liquid. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.
    Type: Application
    Filed: October 17, 2022
    Publication date: February 9, 2023
    Inventors: Bo-Lung CHEN, WEN-YUAN HSU
  • Publication number: 20230043942
    Abstract: An epitaxial structure includes a quantum well structure, a first type semiconductor layer, and a second type semiconductor layer. The quantum well structure has an upper surface and a lower surface opposite to each other and includes at least one quantum well layer and at least one quantum barrier layer stacked alternately. The quantum well layer includes at least one patterned layer, and the patterned layer includes multiple geometric patterns. The first type semiconductor layer is disposed on the lower surface of the quantum well structure. The second type semiconductor layer is disposed on the upper surface of the quantum well structure.
    Type: Application
    Filed: April 29, 2022
    Publication date: February 9, 2023
    Applicant: PlayNitride Display Co., Ltd.
    Inventors: Shen-Jie Wang, Kuang-Yuan Hsu
  • Publication number: 20230035759
    Abstract: Sensing pixels each store a sensing voltage level. A method for driving the plurality of sensing pixels includes providing a plurality of readout scan signals to the plurality of sensing pixels, and providing a plurality of reset scan signals to the plurality of sensing pixels. One of the plurality of readout scan signals enables one of the plurality of sensing pixels to output the sensing voltage level stored in the one of the plurality of sensing pixels. One of plurality of reset scan signals resets the sensing voltage level stored in one of the plurality of sensing pixels. An nth reset scan signal of the plurality of reset scan signals is started behind an nth readout scan signal of the plurality of readout scan signals in time domain.
    Type: Application
    Filed: October 14, 2022
    Publication date: February 2, 2023
    Applicant: InnoLux Corporation
    Inventors: Chien-Chih LIAO, Hsing-Yuan HSU, Po-Yang CHEN, I-An YAO
  • Patent number: 11569362
    Abstract: A semiconductor device includes a source/drain region, a source/drain silicide layer formed on the source/drain region, and a first contact disposed over the source/drain silicide layer. The first contact includes a first metal layer, an upper surface of the first metal layer is at least covered by a silicide layer, and the silicide layer includes a same metal element as the first metal layer.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: January 31, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Ming Hsu, Pei-Yu Chou, Chih-Pin Tsao, Kuang-Yuan Hsu, Jyh-Huei Chen