Abstract: A method and a structure for preventing wafer edge defocus. The method comprises the following steps. First, a wafer is provided. Next, an anti-reflect layer is formed on the wafer. Parts of the anti-reflect layer are removed to expose the rim of the wafer surface. Finally, a photoresist layer is blanketed on the anti-reflect layer and the rim of the wafer.

Abstract: A best focus determining method. First, a test mask is provided, wherein the test mask comprises a transparent substrate and an opaque layer covering parts of the transparent substrate to define a first transparent area with 0° phase and a second transparent area with 90° phase. The sizes of the two transparent areas are the same. Next, a light source is provided and transmits the test mask to perform an exposure. Then, a first image corresponding to the first transparent area and a second image corresponding to the second transparent area are formed. The sizes of the first and second images are measured to ensure the best focus possible.

Abstract: A method for estimating repair accuracy of a mask shop. The method includes the steps of providing a mask having a light-shielding layer with a pattern of a plurality of lines, each of which has a defect, using the mask shop to repair the defects, measuring first widths of the lines where the defects are repaired and second and third widths of the lines aside where the defects are repaired, and calculating ratios of mean values of the second and third widths to the first widths for estimating the repair accuracy.

Abstract: A mask and method for contact hole exposure. First, a mask including a transparent substrate, a 180° phase shift layer installed on the transparent substrate to define a series of patterns having contact hole transparent areas with 0° phase, and at least one 0° phase opening installed in the phase shift layer between the adjacent contact hole transparent areas is provided. Then, an exposure is performed by transmitting a light source, such as deep ultraviolet (UV), extreme ultraviolet, or X-ray, through the mask, so as to eliminate high degree diffraction waves by the 0° phase opening.

Abstract: A mask and method for contact hole exposure. First, a mask including a transparent substrate, a phase shift layer installed on the transparent substrate to define a series of patterns having contact hole areas set in array, an a plurality of metal lines installed on the phase shift layer between the adjacent contact hole areas is provided. Then, an exposure is performed by transmitting a light source, such as deep ultraviolet (UV), extreme ultraviolet, or X-ray, through the mask after the metal lines absorb high degree diffraction waves.

Abstract: A method of forming a patterned photoresist layer. First, an anti-reflection coating layer is formed on a substrate. Next, a first bake is performed. A photoresist layer is then formed on the anti-reflection coating layer. Exposure is performed. A second bake is performed, wherein the temperature difference between the first bake and the second bake is about 35° C.˜55 ° C. Finally, development is performed. The patterned photoresist layer features have perfect profiles in accordance with this invention.

Abstract: Apparatus and method for contact hole exposure. First, an exposure apparatus including a light source and a lens comprising a central transparent area and at least one dummy transparent area is provided. Next, a mask having a plurality of contact hole patterns is provided. Finally, exposure is performed to transmit light from the light source through the mask. Additionally, the exposure apparatus comprises a light source producing light and a lens having a central transparent area and at least one dummy transparent area transmitting the light for exposure.

Abstract: The present invention provides a method for estimating repair accuracy of a mask shop. The method has the steps of providing a mask having a light-shielding layer with a pattern of a plurality of lines, each of which has a defect, using the mask shop to repair the defects, measuring first widths of the lines where the defects are repaired and second and third widths of the lines aside where the defects are repaired, and calculating ratios of means of the second and third widths to the first widths for estimating the repair accuracy.

Abstract: The present invention provides a method for estimating repair accuracy of a mask shop. The method comprises the steps of providing a mask having a light-shielding layer with a pattern of a plurality of lines, each of which has a defect, using the mask shop to repair the defects. Contaminated areas are formed in the vicinity of areas where the defects are repaired, measuring first light intensities of the contaminated areas, and second and third light intensities of two sides of the contaminated areas, and calculating ratios of means of the second and third light intensities to the first light intensities to estimate the repair accuracy.

Abstract: An assist pattern design method for lithography C/H process that includes the following steps: determining the exposure wavelength of a lithography machine light source; determining a minimum resolution line width by the sigma, process integration parameter and numerical aperture of the lithography machine; recovering the minimum line width on a mask according to the miniature scale of the determined minimum resolution line width; and using a line pattern smaller than the recovered minimum line width to connect multiply C/H patterns on the mask.