Abstract: A semiconductor device includes a circuit substrate, a semiconductor package, and a metallic cover. The semiconductor package is disposed on the circuit substrate. The metallic cover is disposed over the semiconductor package and over the circuit substrate. The metallic cover comprises a lid and outer flanges. The lid overlies the semiconductor package. The outer flanges are disposed at edges of the lid, are connected with the lid, extend from the lid towards the circuit substrate, and face side surfaces of the semiconductor package. The lid has a first region that is located over the semiconductor package and is thicker than a second region that is located outside a footprint of the semiconductor package.

Abstract: The present disclosure provides an electronic device including a substrate, an extending element, a conductive element and a first insulating layer. The substrate includes an edge. The extending element is disposed on the substrate and includes a first conductive layer and a semiconductor layer, the first conductive layer and the semiconductor layer are overlapped, and the semiconductor layer extends to the edge of the substrate. The conductive element is overlapped with the first conductive layer. The insulating layer is disposed between the conductive element and the extending element.

Abstract: An interdental brush comprising an interdental brush bar and a grip, the interdental brush bar having a central shaft and a joint portion, the central shaft surface axially staggering a plurality of first bristle sets and a plurality of second bristle sets, the first bristle set has two first bristles, and the second bristle set has two second bristles, and each of the first bristles is connected with an adjacent second bristles to form a squeegee. The grip connects the joint portion, and the squeegee can increase the contact area with the teeth to enhance the cleaning effect.

Abstract: A method of forming a semiconductor device includes applying an adhesive material in a first region of an upper surface of a substrate, where applying the adhesive material includes: applying a first adhesive material at first locations of the first region; and applying a second adhesive material at second locations of the first region, the second adhesive material having a different material composition from the first adhesive material. The method further includes attaching a ring to the upper surface of the substrate using the adhesive material applied on the upper surface of the substrate, where the adhesive material is between the ring and the substrate after the ring is attached.

Abstract: A vacuum liquid-filling needle includes a needle shaft (2) and a pressure relief valve (3). The pressure relief valve is disposed within the needle shaft at a first end (21) thereof, and the needle shaft is able to connect at a second end (22) thereof to a pipe for supplying a solution to be filled. The pressure relief valve defines an internal cavity, in which a first slide valve and a second slide valve are disposed so as to be axially spaced apart from each other and both movable relative to the internal cavity. The valve body defines an inflow channel (33), an inflow port (34), an outflow port (35), an outflow channel (37) and exit apertures (38). Each of the inflow channel and the outflow channel is formed by a blind bore, and both the inflow channel and the outflow channel axially extend along the valve body. This vacuum liquid-filling needle can prevent undesired accidental efflux of the solution while providing depressurization and pressure stabilization effects during filling of the solution.

Abstract: A lamp assembly includes a lamp, a medium and an assembling piece. The medium is configured to connect the lamp to a carrier. The assembling piece is disposed between the lamp and the medium, and is configured to connect the lamp to the medium, wherein the assembling piece includes a first part and a second part. The first part is configured to non-threadedly connect the lamp with the medium. The second part is configured to release the lamp from the medium.

Abstract: A pixel package includes an electrode structure, a plurality of light-emitting units arranged on the electrode structure, and a light transmitting layer. The electrode structure has an upper layer with a first upper sheet, a lower layer with a first lower sheet, and a supporting layer arranged between the upper layer and the lower layer. The electrode structure and the plurality of light-emitting units are fully embedded in the light transmitting layer. In a top view of the pixel package, the first upper sheet is overlapped with and larger than the first lower sheet.

Abstract: Systems and methods for generating pseudo haptic feedback for a virtual widget are disclosed. The method includes computing, from a force profile of the virtual widget, a virtual displacement value based on a force value and a type of the virtual widget. The force profile describes a user's perception of physical characteristics of the virtual widget. The method generates a visual haptic feedback based on the virtual displacement value and the type of the virtual widget. Further, in response to the force value, the method may display on a display screen the visual haptic feedback.

Abstract: A method includes forming a first dielectric layer on a first wafer, and forming a first bond pad penetrating through the first dielectric layer. The first wafer includes a first semiconductor substrate, and the first bond pad is in contact with a first surface of the first semiconductor substrate. The method further includes forming a second dielectric layer on a second wafer and forming a second bond pad extending into the second dielectric layer. The second wafer includes a second semiconductor substrate. The first wafer is sawed into a plurality of dies, with the first bond pad being in a first die in the plurality of dies. The first bond pad is bonded to the second bond pad.

Abstract: A method of verifying an integrated circuit stack includes adding a dummy layer to a contact pad of a functional circuit, wherein a location of the dummy layer is determined based on a location of a contact pad of a connecting substrate. The method further includes converting the dummy layer location to the connecting substrate. The method further includes performing a layout versus schematic (LVS) check of the connecting substrate including the dummy layer in response to a determination that the dummy layer is aligned with the contact pad of the connecting substrate.

Abstract: A semiconductor structure includes a first die, second dies coupled to and on the first die, a dielectric layer on the first die and covering each second die, and through dielectric vias (TDVs) coupled to and on the first die. The first die includes a bonding dielectric layer and bonding features embedded in and leveled with the bonding dielectric layer. An array of second dies is arranged in a first region of the first die. Each second die includes a bonding dielectric layer and a bonding feature embedded in and leveled with the bonding dielectric layer. The bonding dielectric layer and the bonding feature of each second die are respectively bonded to those of the first die. The TDVs are laterally covered by the dielectric layer in a second region of the first die which is connected to the first region and arranged along a periphery of the first die.

Abstract: A system described herein may provide a technique for a selection of an Interworking Function (“IWF”) that facilitates an interworking between a licensed wireless network and another wireless network, such as an unlicensed wireless network, based on a geographical location of a User Equipment (“UE”) that is connected to the licensed wireless network and the other wireless network. The IWF may be selected from a set of candidate IWFs based on respective locations of the candidate IWFs and the UE and/or a wireless access point associated with the other wireless network. The IWF may communicate with the UE, via the other wireless network, using one or more tunnels. The IWF may identify control plane and user plane traffic received via the tunnel(s), and may forward such communications to appropriate network devices of the licensed wireless network.

Abstract: An electronic device and a method of transmitting USB commands are provided. The method includes: (A) allocating a buffer area in a memory; (B) receiving a USB command; (C) retrieving control transfer information of the USB command; (D) storing the control transfer information in the buffer area; (E) repeating steps (B) to (D) until a condition for ending a control aggregation is met; (F) generating an aggregated USB command according to the content of the buffer area; and (G) transmitting the aggregated USB command.

Abstract: Systems and methods for generating pseudo haptic feedback for a virtual widget are disclosed. The method includes computing, from a force profile of the virtual widget, a virtual displacement value based on a force value and a type of the virtual widget. The force profile describes a user's perception of physical characteristics of the virtual widget. The method generates a visual haptic feedback based on the virtual displacement value and the type of the virtual widget. Further, in response to the force value, the method may display on a display screen the visual haptic feedback.

Abstract: A pressure sensing element has an elastic porous substrate, an electrode, an upper protective layer, and a lower protective layer. The elastic porous substrate is provided with a piezoelectric layer on a surface of the elastic porous substrate. The electrode is formed on at least one of a top and a bottom of the elastic porous substrate. The upper protective layer and a lower protective layer are provided respectively above and below the elastic porous substrate. The elastic porous substrate has multiple holes arranged in regular and repetitive patterns including gyroidal structures, lattice structures or schwarz structures.

Abstract: Provided are a data transmission method and related apparatuses. The method is applicable to an electronic device established with a plurality of wireless communication links and includes the following. A game running scene is detected. in response to a game application running in a foreground. A scene data packet of the game running scene is acquired. At least two target wireless communication links are selected from the plurality of wireless communication links based on the game running scene and performing shunt transmission on the scene data packet.

Abstract: An NMOS structure includes a semiconductor substrate, a dielectric structure, a source doped region, a drain doped region, a channel region, a gate structure and two isolation P-type wells. The dielectric structure is formed in the semiconductor substrate to define an active region, in which the source/drain doped region and the channel region are formed. The channel region includes two opposite first sides and two opposite second sides. The source/drain doped region is respectively formed between the two second sides and the dielectric structure. The gate structure is formed on the semiconductor substrate. The gate structure covers a part of the dielectric structure beside the first sides. The two isolation P-type wells are formed in a part of the dielectric structure not covered by the gate structure. The isolation P-type wells respectively surround a periphery of the source/drain doped region and end at the respective second side.

Abstract: A high-speed connector includes an insulating housing, a first terminal assembly received in the insulating housing, a second terminal assembly received in the insulating housing, a third terminal assembly received in the insulating housing, and a fourth terminal assembly received in the insulating housing. The second terminal assembly is opposite to the first terminal assembly along an up-down direction. The third terminal assembly is disposed between the first terminal assembly and the second terminal assembly. The fourth terminal assembly is corresponding to the third terminal assembly. The fourth terminal assembly is disposed between the second terminal assembly and the third terminal assembly.

Abstract: A data storage device, and an error tolerance selecting method thereof which includes: writing data to data blocks of the data storage device; reading written data of the data blocks as read data; comparing the read data and the written data of each data column in the data blocks, and calculating a number of error bits in each chunk including a plurality of data columns accordingly; calculating a difference value between the number of error bits in the chunk and a first threshold value to store the difference value in an error tolerance list; and selecting a largest difference value in the error tolerance list as an error tolerance.