Patents by Inventor Yuan-Hung Hsu
Yuan-Hung Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11931456Abstract: A pharmaceutical composition containing a mixed polymeric micelle and a drug enclosed in the micelle, in which the mixed polymeric micelle, 1 to 1000 nm in size, includes an amphiphilic block copolymer and a lipopolymer. Also disclosed are preparation of the pharmaceutical composition and use thereof for treating cancer.Type: GrantFiled: November 16, 2022Date of Patent: March 19, 2024Assignee: MegaPro Biomedical Co. Ltd.Inventors: Ming-Cheng Wei, Yuan-Hung Hsu, Wen-Yuan Hsieh, Chia-Wen Huang, Chih-Lung Chen, Jhih-Yun Jian, Shian-Jy Wang
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Publication number: 20240072667Abstract: A switching regulator includes a boost power stage circuit and a control circuit. The boost power stage circuit includes: at least one power switch configured to switch a terminal of an inductor according to an operation signal during a normal operation period, such that the terminal of the inductor is switched between an output voltage and ground level; and a power line switch connected in series to the inductor between the input voltage and the output voltage. The power line switch is turned OFF when the output voltage is short to ground level, to prevent a short current from flowing from input voltage to ground level. The control circuit generates the operation signal according to the output voltage and determines whether the power line switch is P-type or N-type MOS device, so as to turn OFF the power line switch when the output voltage is short to ground level.Type: ApplicationFiled: July 25, 2023Publication date: February 29, 2024Inventors: Pao-Hsun Yu, Shei-Chie Yang, Yuan-Yen Mai, Cheng-Hung Hsu
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Patent number: 11881459Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.Type: GrantFiled: May 6, 2020Date of Patent: January 23, 2024Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu, Chi-Jen Chen
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Publication number: 20230361091Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.Type: ApplicationFiled: July 11, 2023Publication date: November 9, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin, Don-Son Jiang, Chih-Ming Huang, Yi-Hsin Chen
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Patent number: 11792938Abstract: A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.Type: GrantFiled: November 2, 2020Date of Patent: October 17, 2023Assignee: Silicon Precision Industries Co., Ltd.Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
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Patent number: 11742296Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.Type: GrantFiled: December 28, 2020Date of Patent: August 29, 2023Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin, Don-Son Jiang, Chih-Ming Huang, Yi-Hsin Chen
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Publication number: 20230268262Abstract: A method of manufacturing an electronic package is provided and includes disposing a circuit member and a plurality of electronic elements on opposite sides of a carrier structure having circuit layers respectively, so that any two of the plurality of electronic elements can be electrically connected to each other via the circuit layers and the circuit member, where a vertical projected area of the carrier structure is larger than a vertical projected area of the circuit member, such that the circuit member is free from being protruded from side surfaces of the carrier structure. Therefore, the circuit member replaces a part of circuit layers of the carrier structure to reduce the difficulty of fabricating the circuit layers in the carrier structure.Type: ApplicationFiled: May 23, 2022Publication date: August 24, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Li-Chu Chang, Yuan-Hung Hsu, Don-Son Jiang
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Publication number: 20230187382Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.Type: ApplicationFiled: February 13, 2023Publication date: June 15, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsun Hsu, Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Rui-Feng Tai, Don-Son Jiang
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Patent number: 11610850Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.Type: GrantFiled: January 28, 2021Date of Patent: March 21, 2023Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsun Hsu, Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Rui-Feng Tai, Don-Son Jiang
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Publication number: 20230078391Abstract: A pharmaceutical composition containing a mixed polymeric micelle and a drug enclosed in the micelle, in which the mixed polymeric micelle, 1 to 1000 nm in size, includes an amphiphilic block copolymer and a lipopolymer. Also disclosed are preparation of the pharmaceutical composition and use thereof for treating cancer.Type: ApplicationFiled: November 16, 2022Publication date: March 16, 2023Inventors: Ming-Cheng Wei, Yuan-Hung Hsu, Wen-Yuan Hsieh, Chia-Wen Huang, Chih-Lung Chen, Jhih-Yun Jian, Shian-Jy Wang
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Patent number: 11541007Abstract: A pharmaceutical composition containing a mixed polymeric micelle and a drug enclosed in the micelle, in which the mixed polymeric micelle, 1 to 1000 nm in size, includes an amphiphilic block copolymer and a lipopolymer. Also disclosed are preparation of the pharmaceutical composition and use thereof for treating cancer.Type: GrantFiled: May 16, 2019Date of Patent: January 3, 2023Assignee: MegaPro Biomedical Co., Ltd.Inventors: Ming-Cheng Wei, Yuan-Hung Hsu, Wen-Yuan Hsieh, Chia-Wen Huang, Chih-Lung Chen, Jhih-Yun Jian, Shian-Jy Wang
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Patent number: 11532528Abstract: An electronic package and a method for manufacturing the electronic package are provided. The method includes forming a slope surface on at least one side surface of at least one of a plurality of electronic components, and then disposing the plurality of electronic components on a carrier structure, such that the two adjacent electronic components form a space by the slope surface. Afterwards, an encapsulation layer is formed on the carrier structure and filled into the space to cover the two adjacent electronic components so as to disperse stress on the electronic components through the design of the space to prevent cracking due to stress concentration.Type: GrantFiled: January 28, 2021Date of Patent: December 20, 2022Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Chang-Fu Lin, Don-Son Jiang
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Publication number: 20220392861Abstract: An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By connecting a plurality of conductors with a single electrical contact pad, structural stress can be distributed and breakage of the circuit portion can be prevented.Type: ApplicationFiled: July 7, 2021Publication date: December 8, 2022Applicant: SILICONWARE PRECISION INDUST RIES CO., LT D.Inventors: Chi-Ren Chen, Po-Yung Chang, Pei-Geng Weng, Yuan-Hung Hsu, Chang-Fu Lin, Don-Son Jiang
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Patent number: 11516925Abstract: The present disclosure provides a package stack structure and a method for manufacturing the same. The method is characterized by stacking coreless circuit portions on the board of an electronic component to reduce the overall thickness of the package stack structure.Type: GrantFiled: April 23, 2020Date of Patent: November 29, 2022Assignee: Siliconware Precision Industries Co., LtdInventors: Han-Hung Chen, Yuan-Hung Hsu, Chang-Fu Lin, Rung-Jeng Lin, Fu-Tang Huang
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Patent number: 11482470Abstract: An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.Type: GrantFiled: May 12, 2020Date of Patent: October 25, 2022Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
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Publication number: 20220336323Abstract: An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.Type: ApplicationFiled: June 30, 2022Publication date: October 20, 2022Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
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Patent number: 11410954Abstract: Provided is an electronic package, including a first substrate of a first conductive structure and a second substrate of a second conductive structure, where a first conductive layer, a bump body and a metal auxiliary layer of the first conductive structure are sequentially formed on the first substrate, and a metal pillar, a second conductive layer, a metal layer and a solder layer of the second conductive structure are sequentially formed on the second substrate, such that the solder layer is combined with the bump body and the metal auxiliary layer to stack the first substrate and the second substrate.Type: GrantFiled: July 7, 2020Date of Patent: August 9, 2022Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
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Publication number: 20220181225Abstract: An electronic package and a method for manufacturing the electronic package are provided. The method includes forming a slope surface on at least one side surface of at least one of a plurality of electronic components, and then disposing the plurality of electronic components on a carrier structure, such that the two adjacent electronic components form a space by the slope surface. Afterwards, an encapsulation layer is formed on the carrier structure and filled into the space to cover the two adjacent electronic components so as to disperse stress on the electronic components through the design of the space to prevent cracking due to stress concentration.Type: ApplicationFiled: January 28, 2021Publication date: June 9, 2022Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Chang-Fu Lin, Don-Son Jiang
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Publication number: 20220173052Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.Type: ApplicationFiled: January 28, 2021Publication date: June 2, 2022Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsun Hsu, Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Rui-Feng Tai, Don-Son Jiang
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Publication number: 20220148975Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.Type: ApplicationFiled: December 28, 2020Publication date: May 12, 2022Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin, Don-Son Jiang, Chih-Ming Huang, Yi-Hsin Chen