Patents by Inventor Yuan-Hung Hsu
Yuan-Hung Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12268756Abstract: A biocompatible magnetic material containing an iron oxide nanoparticle and one or more biocompatible polymers, each having formula (I) below, covalently bonded to the iron oxide nanoparticle: in which each of variables R, L, x, and y is defined herein, the biocompatible magnetic material contains 4-15% Fe(II) ions relative to the total iron ions. Also disclosed in a method of preparing the biocompatible magnetic material.Type: GrantFiled: November 24, 2021Date of Patent: April 8, 2025Assignee: MegaPro Biomedical Co. Ltd.Inventors: Wen-Yuan Hsieh, Yuan-Hung Hsu, Chia-Wen Huang, Ming-Cheng Wei, Chih-Lung Chen, Shian-Jy Wang
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Patent number: 12255165Abstract: An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By connecting a plurality of conductors with a single electrical contact pad, structural stress can be distributed and breakage of the circuit portion can be prevented.Type: GrantFiled: March 12, 2024Date of Patent: March 18, 2025Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chi-Ren Chen, Po-Yung Chang, Pei-Geng Weng, Yuan-Hung Hsu, Chang-Fu Lin, Don-Son Jiang
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Publication number: 20250079255Abstract: An electronic package and a heat dissipation structure thereof are provided, in which a supporting member of the heat dissipation structure is disposed around an outer periphery of a central area and has grooves at corner areas. In this way, the grooves can avoid stress concentration in the corner areas, and the rest of the supporting member can well connect and fix the heat dissipation structure and a carrying structure, so as to suppress warpage of the entire electronic package and prevent delamination.Type: ApplicationFiled: January 31, 2024Publication date: March 6, 2025Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Wei-Jhen CHEN, Chih-Hsun HSU, Chih-Nan LIN, Yuan-Hung HSU, Don-Son JIANG
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Publication number: 20250046670Abstract: An electronic package and a heat dissipation structure thereof are provided, in which supporting members of the heat dissipation structure are arranged in edge areas, and no supporting member is arranged in corner areas. In this way, the supporting members are interrupted at the corner areas, so that stress can be prevented from concentrating in the corner areas, and the entire electronic package can be prevented from warping and delamination.Type: ApplicationFiled: October 3, 2023Publication date: February 6, 2025Inventors: Wei-Jhen CHEN, Chih-Hsun HSU, Chih-Nan LIN, Yuan-Hung HSU, Don-Son JIANG
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Patent number: 12205906Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.Type: GrantFiled: December 12, 2023Date of Patent: January 21, 2025Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu, Chi-Jen Chen
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Patent number: 12107055Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.Type: GrantFiled: February 13, 2023Date of Patent: October 1, 2024Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsun Hsu, Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Rui-Feng Tai, Don-Son Jiang
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Publication number: 20240321798Abstract: An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By connecting a plurality of conductors with a single electrical contact pad, structural stress can be distributed and breakage of the circuit portion can be prevented.Type: ApplicationFiled: March 12, 2024Publication date: September 26, 2024Applicant: SILICONWARE PRECISION INDUST RIES CO., LT D.Inventors: Chi-Ren Chen, Po-Yung Chang, Pei-Geng Weng, Yuan-Hung Hsu, Chang-Fu Lin, Don-Son Jiang
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Patent number: 12100642Abstract: An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.Type: GrantFiled: June 30, 2022Date of Patent: September 24, 2024Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
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Patent number: 12027484Abstract: An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By connecting a plurality of conductors with a single electrical contact pad, structural stress can be distributed and breakage of the circuit portion can be prevented.Type: GrantFiled: July 7, 2021Date of Patent: July 2, 2024Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chi-Ren Chen, Po-Yung Chang, Pei-Geng Weng, Yuan-Hung Hsu, Chang-Fu Lin, Don-Son Jiang
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Publication number: 20240162169Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.Type: ApplicationFiled: December 12, 2023Publication date: May 16, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu, Chi-Jen Chen
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Patent number: 11931456Abstract: A pharmaceutical composition containing a mixed polymeric micelle and a drug enclosed in the micelle, in which the mixed polymeric micelle, 1 to 1000 nm in size, includes an amphiphilic block copolymer and a lipopolymer. Also disclosed are preparation of the pharmaceutical composition and use thereof for treating cancer.Type: GrantFiled: November 16, 2022Date of Patent: March 19, 2024Assignee: MegaPro Biomedical Co. Ltd.Inventors: Ming-Cheng Wei, Yuan-Hung Hsu, Wen-Yuan Hsieh, Chia-Wen Huang, Chih-Lung Chen, Jhih-Yun Jian, Shian-Jy Wang
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Patent number: 11881459Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.Type: GrantFiled: May 6, 2020Date of Patent: January 23, 2024Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu, Chi-Jen Chen
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Publication number: 20230361091Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.Type: ApplicationFiled: July 11, 2023Publication date: November 9, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin, Don-Son Jiang, Chih-Ming Huang, Yi-Hsin Chen
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Patent number: 11792938Abstract: A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.Type: GrantFiled: November 2, 2020Date of Patent: October 17, 2023Assignee: Silicon Precision Industries Co., Ltd.Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
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Patent number: 11742296Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.Type: GrantFiled: December 28, 2020Date of Patent: August 29, 2023Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin, Don-Son Jiang, Chih-Ming Huang, Yi-Hsin Chen
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Publication number: 20230268262Abstract: A method of manufacturing an electronic package is provided and includes disposing a circuit member and a plurality of electronic elements on opposite sides of a carrier structure having circuit layers respectively, so that any two of the plurality of electronic elements can be electrically connected to each other via the circuit layers and the circuit member, where a vertical projected area of the carrier structure is larger than a vertical projected area of the circuit member, such that the circuit member is free from being protruded from side surfaces of the carrier structure. Therefore, the circuit member replaces a part of circuit layers of the carrier structure to reduce the difficulty of fabricating the circuit layers in the carrier structure.Type: ApplicationFiled: May 23, 2022Publication date: August 24, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Li-Chu Chang, Yuan-Hung Hsu, Don-Son Jiang
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Publication number: 20230187382Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.Type: ApplicationFiled: February 13, 2023Publication date: June 15, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsun Hsu, Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Rui-Feng Tai, Don-Son Jiang
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Patent number: 11610850Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.Type: GrantFiled: January 28, 2021Date of Patent: March 21, 2023Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsun Hsu, Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Rui-Feng Tai, Don-Son Jiang
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Publication number: 20230078391Abstract: A pharmaceutical composition containing a mixed polymeric micelle and a drug enclosed in the micelle, in which the mixed polymeric micelle, 1 to 1000 nm in size, includes an amphiphilic block copolymer and a lipopolymer. Also disclosed are preparation of the pharmaceutical composition and use thereof for treating cancer.Type: ApplicationFiled: November 16, 2022Publication date: March 16, 2023Inventors: Ming-Cheng Wei, Yuan-Hung Hsu, Wen-Yuan Hsieh, Chia-Wen Huang, Chih-Lung Chen, Jhih-Yun Jian, Shian-Jy Wang
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Patent number: 11541007Abstract: A pharmaceutical composition containing a mixed polymeric micelle and a drug enclosed in the micelle, in which the mixed polymeric micelle, 1 to 1000 nm in size, includes an amphiphilic block copolymer and a lipopolymer. Also disclosed are preparation of the pharmaceutical composition and use thereof for treating cancer.Type: GrantFiled: May 16, 2019Date of Patent: January 3, 2023Assignee: MegaPro Biomedical Co., Ltd.Inventors: Ming-Cheng Wei, Yuan-Hung Hsu, Wen-Yuan Hsieh, Chia-Wen Huang, Chih-Lung Chen, Jhih-Yun Jian, Shian-Jy Wang