Abstract: A method and apparatus for performing firmware programming on a microcontroller chip and the associated microcontroller chip are provided.

Abstract: Provided are systems and methods for indicating deployment of application features. In one embodiment, a method is provided that includes determining available features of a current deployment of an application for receiving machine-generated data from one or more data sources of a data system, determining un-deployed features of the current deployment of the application, wherein the un-deployed features comprise one or more of the available features that is configured to use input data from a data source and wherein the input data is not available to the feature in the current deployment of the application, and causing display of a deployment graphical user interface (GUI) that comprises an indication of the un-deployed features.

Abstract: A filter circuit comprises a resistor-capacitor (RC) circuit, a comparator circuit, and an output control circuit. The RC circuit is configured to generate a ripple voltage according to the PWM signal. The comparator circuit couples with the RC circuit, and is configured to compare the ripple voltage with a first reference voltage, and output a switch signal according to a comparison result. The output control circuit couples with the comparator circuit and the RC circuit, and is configured to generate an output signal according to the switch signal and the PWM signal. When a duty ratio of the PWM signal is larger than a predetermined threshold value, the output signal is corresponding to the PWM signal. When the duty ratio of the PWM signal is smaller than the predetermined threshold value, the output signal is not corresponding to the PWM signal.

Abstract: Provided are systems and methods for indicating deployment of application features. In one embodiment, a method is provided that includes determining available features of a current deployment of an application for receiving machine-generated data from one or more data sources of a data system, determining un-deployed features of the current deployment of the application, wherein the un-deployed features comprise one or more of the available features that is configured to use input data from a data source and wherein the input data is not available to the feature in the current deployment of the application, and causing display of a deployment graphical user interface (GUI) that comprises an indication of the un-deployed features.

Abstract: An airtight structure includes a first plate, a second plate, a wick structure mounted between the first plate and the second plate. A middle portion of the second plate forms a cup portion. The cup portion and the first plate together define a cavity. The wick structure is received in the cavity. A portion of the first plate extends upwardly to form a first extending portion. The first extending portion is a hollow cylinder. A portion adjacent to an end of the second plate forms a through hole corresponding to the first extending portion. The first extending portion extends through the through hole, an inner surface of the through hole contacts the first extending portion.

Abstract: A semiconductor device package includes a substrate, a semiconductor device, and an underfill. The substrate includes a top surface defining a mounting area, and a barrier section on the top surface and adjacent to the mounting area. The semiconductor device is mounted on the mounting area of the substrate. The underfill is disposed between the semiconductor device and the mounting area and the barrier section of the substrate. A contact angle between a surface of the underfill and the barrier section is greater than or equal to about 90 degrees.

Abstract: An airtight structure includes a first plate having a first surface and a second surface opposite to the first surface, a second plate mounted on the second surface of the first plate, a wick structure mounted between the first plate and the second plate, a first fixed pin welded with the first plate and the second plate, and a second fixed pin welded with the first plate and the second plate. The second plate bonds to form a cup portion. The cup portion and the first plate together define a cavity. The wick structure is received in the cavity, a bottom surface of the cup portion forms a first through hole for receiving the first fixed pin therein. An outer periphery of the cup portion forms a second through hole. The second through hole is spaced apart from the first through hole.

Abstract: Non-halogenated monomers that can be polymerized into flame retardant polymers, and processes to produce the monomers and polymers is provided. In a simplest aspect, there is provided a monomer composition that can comprise a) a group derived from one of a (meth)acrylic acid, (meth)acrylamide, or vinylbenzene, b) a polyphosphate moiety, and c) an amine species. In the monomer composition, the ethylenically unsaturated monomer of (a) is covalently bonded directly or through a linking group to the moiety of b), forming a precursor monomer unit. The amine species of c) is in complex with the precursor monomer unit. The polymer can be a homopolymer of the monomer composition, or a copolymer of the monomer composition having varying a), b) and c). In one embodiment, the polymer can additionally comprise ethylenically unsaturated monomers not covalently bonded to a polyphosphate moiety and/or can be cross-linked with a cross-linking agent such as resorcinol.

Abstract: The present disclosure relates to a semiconductor device package including a substrate, a semiconductor device and an underfill. The substrate has a first surface and a second surface angled with respect to the first surface. The semiconductor device is mounted on the first surface of the substrate and has a first surface facing the first surface of the substrate and a second surface angled with respect to the first surface of the substrate. The underfill is disposed between the first surface of the semiconductor device and the first surface of the substrate. The second surface of the substrate is located in the substrate and external to a vertical projection of the semiconductor device on the first surface of the substrate.

Abstract: The present disclosure relates to a semiconductor device package comprising a substrate, a semiconductor device, and a underfill. The substrate includes a top surface defining a mounting area, and a barrier section on the top surface and adjacent to the mounting area. The semiconductor device is mounted on the mounting area of the substrate. The underfill is disposed between the semiconductor device and the mounting area and the barrier section of the substrate. A contact angle between a surface of the underfill and the barrier section is greater than or equal to about 90 degrees.

Abstract: A switch device includes first and second switch units that are coupled respectively to first and second output terminals. Each of the first and second switch units includes a plurality of diodes and at least one semiconductor-controlled rectifier (SCR), where at least one of the diodes and one of the at least one SCR cooperatively permit a current to flow therethrough to a corresponding one of the first and second output terminals when each thereof operates in an ON state, and where at least one of the diodes and one of the at least one SCR cooperatively permit a current to flow therethrough from a corresponding one of the first and second output terminals when each thereof operates in an ON state.

Abstract: An airtight structure includes a first plate having a first surface and a second surface opposite to the first surface, a second plate mounted on the second surface of the first plate, a wick structure mounted between the first plate and the second plate, a first fixed pin welded with the first plate and the second plate, and a second fixed pin welded with the first plate and the second plate. The second plate bonds to form a cup portion. The cup portion and the first plate together define a cavity. The wick structure is received in the cavity, a bottom surface of the cup portion forms a first through hole for receiving the first fixed pin therein. An outer periphery of the cup portion forms a second through hole. The second through hole is spaced apart from the first through hole.

Abstract: An airtight structure includes a first plate, a second plate, a wick structure mounted between the first plate and the second plate. A middle portion of the second plate forms a cup portion. The cup portion and the first plate together define a cavity. The wick structure is received in the cavity. A portion of the first plate extends upwardly to form a first extending portion. The first extending portion is a hollow cylinder. A portion adjacent to an end of the second plate forms a through hole corresponding to the first extending portion. The first extending portion extends through the through hole, an inner surface of the through hole contacts the first extending portion.

Abstract: The present invention provides a system and method for transmitting apparatus-related information in real time. The system comprises at least one server in signal communication with at least one external apparatus in a wired or wireless way. While an abnormality of an external apparatus occurs, the external apparatus transmits a set of abnormality information to the server. After an information receiving interface of the server receives the set of abnormality information transmitted by the external apparatus, an information processing module vocally broadcasts the set of abnormality information. An information transmitting module transmits the set of abnormality information to the client device of at least one assigned related person. While an external apparatus suffers abnormality, the system can inform the related persons in real time to repair the external apparatus instantly.

Abstract: The disclosed technology relates to pure polyitaconic acid homo- and co-polymers free of the less reactive tri-substituted vinyl monomers (e.g., citraconic acid or mesaconic acid) that may be used, for example, as builders in detergent applications, such as in the personal and home care market.

Abstract: Guanylurea alcohol phosphate salts are disclosed. Flame retardant thermoplastic and thermoset polymers can be made by incorporating said guanylurea alcohol phosphate salts into polymers and these polymers have improved properties over similar thermoplastic or thermoset polymers where guanylurea phosphate salts are added as flame retardant dispersions to said polymer. Flame retardant polyurethane foams where the guanylurea alcohol phosphate salts have been incorporated into the polyurethane are a particularly preferred embodiment.

Abstract: A telescopic tube assembly includes a telescopic tube subassembly having first and second tubes, a tubular member configured to move with the second tube, an outer sleeve sleeved on the first tube, a retaining member, an actuating member, and a biasing member. When the second tube is in an extended position, the second tube extends out of the first tube, and the retaining member is engaged in a cavity of the tubular member so as to guard against axial movement of the second tube. When the second tube is in a retracted position, the second tube is received in the first tube, and the retaining member is retracted to be disengaged from the cavity so as to permit the axial movement of the second tube.

Abstract: A photovoltaic system includes a trailer, a solar panel, a battery, a lamppost, a turret, a shackle, a horizontal position-adjusting unit and an orientation-retaining unit. The trailer includes a cage supported on a chassis. The solar panel is supported on the cage. The battery is supported on the chassis and electrically connected to the solar panel. The lamppost includes a lamp supported thereon and electrically connected to the battery. The turret rotationally connects the lamppost to the chassis. The shackle is provided around the lamppost. The horizontal position-adjusting unit movably connects the shackle to the cage. The orientation-retaining unit retains the lamppost in a desired orientation relative to the shackle.

Abstract: Polymers are disclosed that incorporate large portions of elastomeric polyamide oligomers connected with polyisocyanates. These polymers have enhanced properties over similar polyurethanes due to better hydrolysis resistance of polyamides over polyesters and better UV resistance of polyamides over polyethers. Polyurea linkages can also improve properties over polyurethane linkages. Composites and hybrids of these polymers and other polyamides with vinyl polymers are also disclosed and claimed.

Abstract: An apparatus and a method for video frame rotation are provided. The apparatus includes a synchronous dynamic random access memory (SDRAM) and a video rotation circuit. The video rotation circuit is coupled to the SDRAM. The video rotation circuit sequentially writes a plurality of pixels of a video frame into the SDRAM in a row-by-row scanning manner. The video rotation circuit divides a plurality of columns of the video frame into a plurality of column sets, so as to divide each of the rows of the video frame into a plurality of sub-rows. The video rotation circuit performs an internal column-set scanning for each of the column sets in a column-set-by-column-set manner, so as to discretely read the sub-rows from the SDRAM.