Abstract: A manufacturing method of a flexible electronic device includes providing a carrier substrate, forming a first layer on the carrier substrate, forming an insulating layer on a first surface of the first layer, forming a plurality of transistors on the insulating layer, wherein the plurality of transistors include at least one first transistor and at least one second transistor, patterning the insulating layer into a plurality of first portions, wherein the at least one first transistor and the at least one second transistor are respectively disposed on two adjacent ones of the plurality of first portions, removing the carrier substrate, and attaching a flexible substrate to a second surface of the first layer opposite to the first surface. The two adjacent ones of the plurality of first portions are isolated from each other.

Abstract: A flexible electronic device is disclosed. The flexible electronic device includes a protruding unit, a flexible substrate and a plurality of sensing units. The flexible substrate is disposed on the protruding unit and has a deformation region corresponding to the protruding unit. The sensing units are disposed on the flexible substrate, and at least one of the sensing units is overlapped with the deformation region. A ratio of an area of the deformation region to an area of one of the at least one of the sensing units is greater than or equal to 1.4 and less than or equal to 2222.

Abstract: The invention relates to a display device including a substrate, pixels, a first insulating layer, a second insulating layer, a first conductive layer, a second conductive layer and a trace layer. The pixels is disposed on the substrate and comprising an active layer. The first insulating layer is disposed on the substrate and comprising first recesses. The second insulating layer is disposed on the first insulating layer and comprising a second recesses overlapped with the first recesses. The first conductive layer is disposed on the second insulating layer. The second conductive layer is disposed between the substrate and the first insulating layer, and electrically connected to the first conductive layer through the first recess and the second recess. The trace layer disposed between the second insulating layer and the first insulating layer, and electrically connected to the first conductive layer. The active layer is disposed on the first insulating layer.

Abstract: A computer processing system is provided for enhancing video-based language learning. The system includes a video server for storing videos that use one or more languages to be learned. The system further includes a video metadata database for storing translations of sentences uttered in the videos, character profiles of characters appearing in the videos, and mappings between the sentences and a learner profile. The system also includes a learner profile database for storing learner profiles. The system additionally includes a semantic analyzer and matching engine for finding, for at least a given video and a given learner, alternative sentences for and responsive to the translations of the sentences uttered in the given video that conflict with a respective learner profile for the given learner. The computer processing system further includes a presentation system for playing back the given video and providing the alternative sentences to the given learner.

Abstract: The instant disclosure described a system and method to prevent the oxidizer overheating using cold side bypass for a VOCs treatment system with series rotor, which may be used in an organic waste air treatment system. The system is equipped with a Thermal Oxidizer (TO), a First Heat Exchanger, a Second Heat Exchanger, a third heat exchanger, a First Cold-Side Transporting Pipeline, a First Adsorption Rotor, a Second Adsorption Rotor, and a Chimney. There is a Cold-Side Proportional Damper installed between the First Desorption-Treated Air Pipeline and the First Cold-Side Transporting Pipeline, or it is installed on the First Desorption-Treated Air Pipeline. When the VOCs concentration becomes higher, the Cold-Side Proportional Damper can regulate the airflow to adjust the heat-recovery amount or concentration, when treating the organic waste air, it can prevent the TO from being overheated due to high oxidizer temperature, and protect it from Thermal Oxidizer shut-down.

Abstract: A food processor is revealed. A food processing unit is disposed between two support units of a machine body and connected to the support units by a lifting unit. The food processing unit is dropped down into the machine body while the food processor is not in use. Thus a volume of the food processor is significantly reduced and both packing and transportation costs are further saved efficiently. The lifting unit is provided with a guiding slot formed on the support unit while the food processing unit includes a guiding block inserted through the guiding slot correspondingly. The lifting unit further includes an operation bar locked and connected with the guiding block. Thereby the food processing unit is moved and positioned vertically by such simple and easy design and the production cost of the food processor is further reduced.

Abstract: A method for fingerprint enrollment according to an embodiment includes extracting fingerprint feature points of a fingerprint image, fragmenting the fingerprint image in units of each fingerprint feature point, to obtain a feature fragment corresponding to each fingerprint feature point, and determining, according to whether the feature fragment meets an enrollment condition, whether the fingerprint enrollment is completed. Each fingerprint image can be fully utilized, so that the count of presses on the fingerprint sensor by a user of fingerprint enrollment is reduced, and the enrollment experience of the user is improved.

Abstract: System controller and method for regulating a power converter. For example, the system controller includes a first controller terminal and a second controller terminal. The system controller is configured to receive an input signal at the first controller terminal and generate a drive signal at the second controller terminal based at least in part on the input signal to turn on or off a transistor in order to affect a current associated with a secondary winding of the power converter. Additionally, the system controller is further configured to determine whether the input signal remains larger than a first threshold for a first time period that is equal to or longer than a first predetermined duration.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a conductive pillar having a first surface, a second surface, and a lateral surface extending between the first surface and the second surface. The lateral surface has a first part and a second part connected to the first part. The semiconductor device package also includes a barrier layer in contact with the first part of the lateral surface of the conductive pillar and an encapsulant in contact with the second part of the lateral surface of the conductive pillar. The semiconductor device package also includes a first flowable conductive material disposed on the first surface of the conductive pillar. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: An electronic device having a foldable region capable of being folded along a folding axis includes a substrate, wherein at least a part of the substrate is located in the foldable region, a sensing unit overlapped with the substrate and including a first sub-unit and a second sub-unit, a first signal input electrically connected to the first sub-unit, a second signal input electrically connected to the second sub-unit, and a driving unit. The first sub-unit is driven by the driving unit through the first signal input, and the second sub-unit is driven by the driving unit through the second signal input. The first sub-unit is located at a side of the folding axis, the second sub-unit is located at another side of the folding axis, and the first sub-unit and the second sub-unit are separated from each other by a spacing at the foldable region.

Abstract: A system and method to prevent the oxidizer overheating using cold side bypass during high input for a VOCs treatment system with series rotor are described, which may be used in an organic waste air treatment system. The system is equipped with a Thermal Oxidizer (TO), a First Heat Exchanger, a Second Heat Exchanger, a third heat exchanger, a Fourth Heat Exchanger, a First Cold-Side Transporting Pipeline, a Fourth Cold-Side Transporting Pipeline, a First Adsorption Rotor, a Second Adsorption Rotor, and a Chimney. There is a Cold-Side Proportional Damper installed between the First Desorption-Treated Air Pipeline and the First Cold-Side Transporting Pipeline, the First Desorption-Treated Air Pipeline and the Fourth Cold-Side Transporting Pipeline or between the First Cold-Side Transporting Pipeline and the Fourth Cold-Side Transporting Pipeline, or the damper is installed on the First Desorption-Treated Air Pipeline.

Abstract: An electronic device includes a housing, a first protrusion portion and a first covering member. The housing has a bottom portion. The first protrusion portion is arranged on the bottom portion of the housing, wherein the first protrusion portion has a first groove through which a first wire passes. The first covering member detachably covers the first protrusion portion, wherein the first covering member has a first opening. In a first position, the first opening of the first covering member is used for allowing the first wire to pass through.

Abstract: Controller and method for a power converter. For example, a controller for a power converter includes: a first gate driver configured to output a first drive signal to a first transistor related to a primary winding, the first transistor including a drain terminal and a source terminal, the primary winding being configured to receive an input voltage, the primary being coupled to a first auxiliary winding and a second auxiliary winding; one or more voltage detectors configured to generate a first detection signal and a second detection signal based at least in part on a current signal related to the first auxiliary winding; a time controller configured to receive the first detection signal and the second detection signal and generate a control signal based at least in part on the first detection signal and the second detection signal; and a second gate driver configured to receive the control signal.

Abstract: Provided is a pharmaceutical composition for treating melanoma, including a benzenesulfonamide derivative and a pharmaceutically acceptable carrier thereof. Also provided is a method for treating melanoma by administering the composition to a subject in need thereof. Further provided is a use of the pharmaceutical composition in the manufacture of a medicament for treating melanoma.

Abstract: Disclosed herein are combination therapies for use in the treatment or prevention of HCV by administering Compound A and a second HCV inhibitor.

Abstract: Provided is a composition for reducing fat in the body of a subject, including a benzenesulfonamide derivative and a pharmaceutically or cosmetically acceptable carrier thereof. Also provided is a method for fat ablation or lipolysis by administering the composition to the subject in need thereof. Further provided is a method for preventing or treating a disease or condition related to fat accumulation by administering the composition to the subject in need thereof.

Abstract: An electronic device includes: a substrate including a through hole; a connecting element disposed in the through hole; a first insulating layer disposed on the substrate and including a first via; a first conductive element disposed on the first insulating layer and electrically connected to the connecting element through the first via; a second insulating layer disposed on the first conductive element and comprising a second via; a second conductive element disposed on the second insulating layer and electrically connected to the first conductive element through the second via; and a third conductive element disposed under the substrate and electrically connected to the connecting element, wherein, in a cross-sectional view of the electronic device, the second via is not overlapping with the connecting element.

Abstract: The disclosure relates to a display device, including a substrate, a driving structure layer, a display structure layer and a touch layer. The substrate includes a bending area and a main area adjacent to the bending area. The driving structure layer is disposed on the substrate. The driving structure layer includes an insulating structure, and the insulating structure includes a plurality of recesses. The display structure layer is disposed on the driving structure layer. The touch layer is disposed on the driving structure layer. A portion of the touch layer is disposed on the bending area of the substrate. At least a part of the plurality of recesses is disposed on the bending area of the substrate.

Abstract: A light-emitting device is provided. The light-emitting device includes a first substrate. The light-emitting device also includes a second substrate including a light-shielding structure. The light-emitting device further includes a first light-emitting module and a second light-emitting module being adjacent to each other. The first light-emitting module and the second light-emitting module are disposed between the first substrate and the second substrate. The first light-emitting module and the second light-emitting module are spaced apart by a gap, and the light-shielding structure at least partially covers the gap in a top view direction of the light-emitting device.

Abstract: The present disclosure provides a method for preparing a semiconductor device. The method includes forming a first metal plug, a second metal plug, a third metal plug, and a fourth metal plug over a semiconductor substrate. The method also includes depositing a boron nitride layer over the first metal plug, the second metal plug, the third metal plug, and the fourth metal plug. A first portion of the boron nitride layer extends between the first metal plug and the second metal plug such that the first portion of the boron nitride layer and the semiconductor substrate are separated by an airgap while a second portion of the boron nitride layer extends between the third metal plug and the fourth metal plug such that the second portion of the boron nitride layer is in direct contact with the semiconductor substrate.