Abstract: Controller and method for a power converter. For example, the controller includes: a first terminal configured to receive a first voltage; a second terminal connected to a capacitor and biased to a second voltage; a voltage detector configured to receive the second voltage from the second terminal and generate a detection signal based at least in part on the second voltage; a charging controller configured to receive the detection signal and generate a first control signal based at least in part on the detection signal; and a charging current generator configured to receive the first voltage from the first terminal and receive the first control signal from the charging controller; wherein the voltage detector is further configured to: detect that the second voltage has decreased to a first predetermined threshold; and generate the detection signal indicating that the second voltage has decreased to the first predetermined threshold.

Abstract: An electronic device stretchable from a first state to a second state includes a substrate, a plurality of light emitting groups, and a plurality of signal pads. The substrate has a first region and a second region. The light emitting groups are disposed on the first region. The signal pads are disposed on the second region. When the electronic device is stretched from the first state to the second state, the first region has a first stretching ratio (R1) and the second region has a second stretching ratio (R2), and R1 is greater than R2.

Abstract: A substrate assembly includes a substrate having a first surface and a second surface opposite to the first surface. The substrate assembly includes a first conductive portion disposed on the first surface, and a second conductive portion disposed on the second surface. The substrate assembly includes a connective portion that is at least partially disposed in the substrate and penetrates from the first surface to the second surface. The first conductive portion is electrically connected to the second conductive portion through the connective portion. The substrate assembly includes a processing unit disposed on the first surface, and an electronic element disposed on the second surface. The first conductive portion, the second conductive portion and the connective portion are overlapped with either of the processing unit or the electronic element, and the other of the processing unit or the electronic element is electrically connected to the first conductive portion.

Abstract: An electronic device includes a substrate, a touch layer and a cover window layer. The touch layer includes a plurality of touch units on the substrate. The cover window layer is disposed on the touch layer, wherein the cover window layer includes a plurality of structures disposed on the substrate. At least one of the touch units partially overlaps with at least two of the structures of the cover window layer, and at least one of the structures is directly touchable from outside.

Abstract: A display device includes a display panel in a wraparound form and comprising two wraparound edges opposite to each other and two non-wraparound edges opposite to each other. The display device further includes a flexible circuit board having a surface and a bonding region at a periphery of the surface. The flexible circuit board is electrically bonded to one of the two non-wraparound edges through the bonding region for driving the display panel.

Abstract: A preclean process may be omitted from a eutectic bonding sequence. To remove oxide from one or more surfaces of a device wafer of a micro-electromechanical-system (MEMS) structure, a duration of an acid-based etch process in the eutectic bonding sequence may be increased relative to the duration of the acid-based etch process when the preclean process is performed. The increased duration of the acid-based etch process enables the acid-based etch process to remove the oxide from the one or more surfaces of the device wafer without the use of a preceding preclean process. This reduces the complexity and cycle time of the eutectic bonding sequence, reduces the risk of stiction between suspended mechanical components of the MEMS structure, and/or reduces the likelihood that the MEMS structure may be rendered defective or inoperable during manufacturing, which increases process yield.

Abstract: A display device includes a substrate, a gate line and a data line. The substrate includes a first side edge and a second side edge, a curvature of the first side edge is greater than a curvature of the second side edge, and the curvature of the second side edge is not equal to zero. The gate line and the data line are disposed on the substrate, and a curvature of the gate line is different from a curvature of the data line.

Abstract: A method for preparing the memory are provided. The method includes forming a trench at a front side of a semiconductor substrate, wherein the trench defines laterally separate active areas formed of surface regions of the semiconductor substrate; filling an isolation structure in the trench, wherein the isolation structure is filled to a height lower than top surfaces of the active areas; recessing a first group of the active areas from top surfaces of the first group of the active areas, while having top surfaces of a second group of the active areas covered; and forming contact enhancement sidewall spacers to laterally surround top portions of the active areas, respectively.

Abstract: A display device includes a flexible substrate, a display layer disposed on the flexible substrate and including a first light emitting unit, a first conductive layer disposed on the display layer, and a second conductive layer disposed on the first conductive layer, comprising a plurality of second conductive lines, wherein one of the second conductive lines comprises an opening. The first light emitting unit has a round shape and is disposed in a position corresponding to the opening.

Abstract: The present disclosure provides a dynamic random access memory (DRAM) array with contact enhancement sidewall spacers. The memory array structure includes a semiconductor substrate, an isolation structure and contact enhancement sidewall spacers. The semiconductor substrate has a trench defining laterally separate active areas formed of surface regions of the semiconductor substrate. Top surfaces of a first group of the active areas are recessed with respect to top surfaces of a second group of the active areas. The isolation structure is filled in the trench and in lateral contact with bottom portions of the active areas. The contact enhancement sidewall spacers laterally surround top portions of the active areas, respectively.

Abstract: A method includes forming a barrier layer on a substrate, removing a portion of the barrier layer to yield a patterned barrier layer and an exposed portion of the substrate within a hole in the patterned barrier layer, forming a first portion of a perovskite on the patterned barrier layer and a second portion of the perovskite on the exposed portion of the substrate, and removing the patterned barrier layer, thereby removing the first portion of the perovskite.

Abstract: A resonant converter having a pre-conduction mechanism for realizing a wide output voltage range is provided. The resonant converter includes a first circuit and a second circuit. The first circuit includes a plurality of primary-side switches. The plurality of primary-side switches includes a first high-side switch, a second high-side switch, a first low-side switch and a second low-side switch. The second circuit includes a plurality of secondary-side switches. The plurality of secondary-side switches includes a third high-side switch, a fourth high-side switch, a third low-side switch and a fourth low-side switch. When the second low-side switch and the first low-side switch are turned on and a current time reaches a preset on time, the fourth high-side switch and the third low-side switch are turned on.

Abstract: An electronic device is provided. The electronic device includes a substrate, a driving circuit, a diode and a light shielding element. The driving circuit is disposed on the substrate. The diode is electrically connected to the driving circuit. The light shielding element overlaps the substrate. A surface of the light shielding element has a first width. A cross-sectional-surface of a portion of the light shielding element has a second width. In addition, the second width is greater than the first width in a cross-sectional view, and the surface is closer to the substrate than the cross-sectional surface of the portion.

Abstract: A rollable device includes a rollable panel having two surfaces opposed to each other, a heat dissipation sheet disposed on one of the two surfaces of the rollable panel, and a supporting plate disposed between the rollable panel and the heat dissipation sheet. The heat dissipation sheet has a thermal conductivity greater than 200 W/mK.

Abstract: The disclosure provides a display device. The display device includes a display panel and a vibration generating module. The vibration generating module is attached to the display panel and includes a substrate, a circuit layer, and a plurality of vibrators. The circuit layer and the plurality of vibrators are disposed on the substrate, and the plurality of vibrators are electrically connected to the circuit layer.

Abstract: A display device is provided. The display device includes a substrate having a first edge and a second edge opposite to the first edge. There is a first distance between the first edge and the second edge. The display device also includes a plurality of light-emitting units disposed on the substrate, and a conductive line disposed on the substrate and electrically connected to at least one of the plurality of light-emitting units. The conductive line includes an undulating edge and has an extending length which is greater than or equal to half of the first distance and is less than or equal to the first distance.

Abstract: A method of manufacturing an electronic device, comprising: providing a carrier substrate with a plurality of light-emitting units disposed thereon, the plurality of light-emitting units being spaced with a first pitch (P1) in a first direction and a second pitch (P2) in a second direction that is perpendicular to the first direction; providing a driving substrate; and transferring at least a portion of the plurality of light-emitting units to the driving substrate to form a transferred portion of the plurality of light-emitting units on the driving substrate, the transferred portion being spaced with a third pitch (P3) in a third direction and a fourth pitch (P4) in a fourth direction that is perpendicular to the third direction; wherein the first pitch (P1), the second pitch (P2), the third pitch (P3), and the fourth pitch (P4) are satisfied following relations: P3=mP1; and P4=nP2, m and n are positive integers.

Abstract: A flexible electronic device is disclosed. The flexible electronic device includes a protruding unit, a flexible substrate and a plurality of sensing units. The flexible substrate is disposed on the protruding unit and has a deformation region corresponding to the protruding unit. The sensing units are disposed on the flexible substrate, and at least one of the sensing units is overlapped with the deformation region. A ratio of an area of the deformation region to an area of one of the at least one of the sensing units is greater than or equal to 1.4 and less than or equal to 2222.

Abstract: The invention provides an input device including a holder, a first wheel, a slider, and a first pressure part. The first wheel is disposed on the holder, and includes a side surface, a circle center, and a segment adjusting structure. The segment adjusting structure is disposed on the side surface in a manner of surrounding the circle center. The slider is disposed on the holder, and is movable relative to the holder to move toward or away from the circle center. The first pressure part includes two first ends. One of the first ends is connected to the slider, and as the slider moves toward or away from the circle center, interference between the other first end and the segment adjusting structure is increased or reduced.

Abstract: A system and method to prevent an oxidizer overheating using cold side bypass for a volatile organic compounds (VOCs) treatment system with a series rotor are described, which is mainly used in the organic waste air treatment system. The system is equipped with a thermal oxidizer (to), a first heat exchanger, a second heat exchanger, a third heat exchanger, a first cold-side transporting pipeline, a first adsorption rotor, a second adsorption rotor, and a chimney. A cold-side proportional damper is installed between the first desorption-treated air pipeline and the first cold-side transporting pipeline, or it is installed on the first desorption-treated air pipeline. When the VOCs concentration becomes higher, the cold-side proportional damper can regulate the airflow to adjust the heat-recovery amount or concentration, when treating the organic waste air, it can prevent the thermal oxidizer from being overheated due to high oxidizer temperature, and protect from thermal oxidizer shut-down.