Abstract: A method includes illuminating radiation to a resist layer over a substrate to pattern the resist layer. The patterned resist layer is developed by using a positive tone developer. The patterned resist layer is rinsed using a basic aqueous rinse solution. A pH value of the basic aqueous rinse solution is lower than a pH value of the developer, and a rinse temperature of rinsing the patterned resist layer is in a range of about 20° C. to about 40° C.

Abstract: An internal circulation type clathrate hydrate-based cold storage system and method are provided in the field of industrial refrigeration. The internal circulation type clathrate hydrate-based cold storage system includes a water chilling unit, a hydrate-based cold storage tank, a gas disturbance device, a concentration measurement system, a heat exchange system, a direct-current power supply and circuit control system, and a system monitoring device. The water chilling unit provides a secondary refrigerant at a low temperature. The secondary refrigerant flows through an evaporator coil in the hydrate-based cold storage tank for a heat exchange. The gas disturbance device induces hydrate nucleation. The concentration measurement system monitors a concentration of a hydrate solution in real time. The heat exchange system is equipped with a finned tube heat exchanger with a fan.

Abstract: Semiconductor structures and method of forming the same are provided. A method according to the present disclosure includes providing an intermediate structure that includes an opening, conformally depositing a metal liner over the opening, depositing a dummy fill material over the metal liner, recessing the dummy fill material such that a portion of the metal liner is exposed, removing the exposed portion of the metal liner, removing the recessed dummy fill material, and after the removing of the recessed dummy fill material, depositing a metal fill layer over the opening.

Abstract: The application discloses a motion detection method and an electronic device applying the same. A plurality of transmission packets are transmitted and a plurality of received packets are received. A received packet among the plurality of received packets is compensated into a compensated received packet. Cross packet cancellation is performed on the compensated received packet. A packet difference between the compensated received packet and another received packet among the plurality of received packets is determined. Whether an object is detected based on the packet difference is determined.

Abstract: A rotating mechanism includes: a rotating shaft; a first mechanical part, where the first mechanical part is provided with a first slide groove; a second mechanical part, where the second mechanical part is provided with a second slide groove; a third mechanical part, where the third mechanical part is disposed in the first slide groove, and one end of the third mechanical part is rotatably connected to the rotating shaft; and a fourth mechanical part, where the fourth mechanical part is disposed in the second slide groove, and one end of the fourth mechanical part is rotatably connected to the rotating shaft. When the first mechanical part and the second mechanical part rotate around the rotating shaft, the third mechanical part slides with respect to the first slide groove.

Abstract: A method is provided including forming a first layer over a substrate and forming an adhesion layer over the first layer. The adhesion layer has a composition including an epoxy group. A photoresist layer is formed directly on the adhesion layer. A portion of the photoresist layer is exposed to a radiation source. The composition of the adhesion layer and the exposed portion of the photoresist layer cross-link using the epoxy group. Thee photoresist layer is then developed (e.g., by a negative tone developer) to form a photoresist pattern feature, which may overlie the formed cross-linked region.

Abstract: A 3D-configured production structure of rubber products based on an intelligent manufacturing unit and a production method thereof. The structure includes a stereoscopic production warehouse used to store a mobile intelligent manufacturing unit and an ex-warehouse delivery system used to deliver the mobile intelligent manufacturing unit. The mobile intelligent manufacturing unit includes a unit functional assembly, a molding vulcanization apparatus, a blank feeder, a material-delivering apparatus, a product-collecting apparatus and a reclaimer. The molding vulcanization apparatus includes a upper heat plate, a upper mold, a lower mold, a lower heat plate and a support post. The upper mold and the lower mold are arranged on the inner sides of the upper heat plate and the lower heat plate, respectively. The upper heat plate is fixed on one end of the support post, and the lower heat plate is arranged through the support post.

Abstract: A vehicle violation detection method and vehicle violation detection system are provided. The method includes the following steps. A video clip including a plurality of consecutive frames is obtained, wherein the video clip is generated through photographing an intersection by an image capture device. A traffic sign object corresponding to a traffic sign and a license plate object corresponding to a license plate are detected from each of the frames. According to a sign position of the traffic sign object and a plate position of the license plate object in each of the frames, vehicle behavior information of each of the frames is obtained. By conducting regression analysis to the vehicle behavior information of each of the frames, whether a vehicle violation event has occurred is determined.

Abstract: The patent application discloses a degradable downhole tool member for hydrocarbon resource recovery. The downhole tool member comprises a shaped body comprising a degradable polymer matrix, wherein the downhole tool member, when held in downhole fluid at about 80° C., has an initial mass loss about 14% for a holding period of about 2 days in a pressure holding test.

Abstract: A fan assembly, a heat dissipation assembly and an electronic device. The fan assembly including a casing, an impeller and an air collecting component. The casing has an inner surface, an inlet and at least two outlets. The inner surface is connected to the two outlets. The inlet is in fluid communication with the two outlets. The inner surface faces the impeller. The air collecting component is disposed in one of the two outlets and having an air collecting surface. The air collecting surface faces the impeller. The air collecting surface is connected to the inner surface. The air collecting surface and the inner surface form a gap together with the impeller. The gap is widened along a rotating direction of the impeller. The air collecting component is configured to guide an airflow blown by the impeller to another outlet via the gap.

Abstract: Provided herein is a system and method to determine a three-dimensional heading of a target. The system includes a radar sensor that obtains a three-dimensional snapshot of radar data comprising Doppler velocities and spatial positions of a plurality of detection points of a target, one or more processors, and a memory storing instructions that, when executed by the one or more processors, causes the system to perform conducting a first estimation of a three-dimensional heading of the target based on the spatial positions; conducting a second estimation of the three-dimensional heading of the target based on the Doppler velocities; and obtaining a combined estimation of the three-dimensional heading of the target based on a weighted sum of the first estimation and the second estimation.

Abstract: A radio-frequency power output device includes a cooling plate, a temperature detection module, and a control module. The cooling plate is provided with a first circuit board and a second circuit board respectively on two opposite sides thereof, and the first circuit board and the second circuit board are provided with a first radio-frequency power amplification circuit and a second radio-frequency power amplification circuit, respectively. The temperature detection module is used to obtain the temperature of the first circuit board and the temperature of the second circuit board. The control module controls, based on the temperature of the first circuit board, the first radio-frequency power amplification circuit to output a radio-frequency power signal at a target temperature, and controls, based on the temperature of the second circuit board, the second radio-frequency power amplification circuit to output a radio-frequency power signal at the target temperature.

Abstract: The present application discloses an automatic cleaning device based on a decontamination robot and an automatic cleaning method, belonging to the field of mechanical automation engineering technology. The device includes a cleaning head, a cleaning seat, a protective housing and a cleaning module; wherein the cleaning head is fixedly mounted in the cleaning seat; the cleaning seat is rotationally connected with the cleaning module, and the cleaning module drives the cleaning seat and the cleaning head to realize up-and-down reciprocating motion. The protective housing passes through the cleaning head and cleaning seat and is fixedly connected with the cleaning module, which can prevent harmful substances caused by cleaning from entering the inner cavity of the cleaning module and causing damage to the mechanism.

Abstract: A method includes forming a first de-bond structure over a first substrate, where forming the first de-bond structure includes depositing a first de-bond layer over the first substrate, depositing a first silicon layer over the first de-bond layer, depositing a second de-bond layer over the first silicon layer, and depositing a second silicon layer over the second de-bond layer, epitaxially growing a first multi-layer stack over the first de-bond structure, bonding the first multi-layer stack to a second multi-layer stack, and performing a first laser annealing process to ablate the first silicon layer and portions of the first de-bond layer and the second de-bond layer in order to de-bond the first substrate from the first multi-layer stack.

Abstract: A catheter system for treating a vascular lesion within or adjacent to a vessel wall within a body of a patient includes a single light source that generates light energy, a first light guide and a second light guide, and a multiplexer. The first light guide and the second light guide are each configured to selectively receive light energy from the light source. The multiplexer receives the light energy from the light source in the form of a source beam and selectively directs the light energy from the light source in the form of individual guide beams to each of the first light guide and the second light guide.

Abstract: Semiconductor structures is provided. The semiconductor structure includes a semiconductor substrate having a first region and a second region. A surface of the first region of the semiconductor substrate contains a gate structure, a surface of the second region of the semiconductor substrate contains a dummy gate structure, and the semiconductor substrate under the dummy gate structure contains an isolation structure. The semiconductor structure further includes a bulk layer having a substantially flat reshaped surface formed in the semiconductor substrate at each of two sides of the gate structure; and a protective layer formed on the reshaped surface of the bulk layer.

Abstract: The present disclosure belongs to the technical field of heat exchangers, and provides a heat exchanger based on a Gyroid/Diamond (GD-type) hybrid minimal surface-based disturbance structure. The heat exchanger includes a core, headers, and flanges. The core includes a cold fluid channel and a hot fluid channel, the cold fluid channel and the hot fluid channel are separated by a parting sheet. An inlet and an outlet of the cold fluid channel are separated from an inlet and an outlet of the hot fluid channel by sealing bars. A GD-type hybrid minimal surface-based disturbance structure is inserted into the hot fluid channel. A cold fluid and a hot fluid are distributed in a cross-flow manner.

Abstract: A method includes forming a bonding structure that contains thermal conductive vias (also termed as thermal vias, thermal conductive pillars, or thermal pillars) on a semiconductor structure. The thermal vias, with material thermal conductivity greater than about 10 W/m·K, are embedded in the bonding structure that provides a quick dissipation path of heat from thermal hotspot regions into a substrate.

Abstract: Disclosed are a test routes planning method and apparatus of a vehicle on actual roads, a medium and a device. The method includes the following steps: dividing road traffic scenes; calculating traffic scene characteristics based on the divided road traffic scenes; constructing a preliminary road selection database for test routes; and completing a planning of the test routes of the vehicle on the actual roads at different speeds in different traffic scenes by leveraging a genetic algorithm based on the preliminary road selection database for the test routes. The present disclosure provides a solution for planning the test routes of the vehicle on the actual roads. In the solution, the travel speed distribution of a user is obtained through calculation based on traffic flow big data, and the planning of the test routes on the actual roads in different traffic scenes is completed by leveraging the genetic algorithm.

Abstract: Chip packages and methods for forming the same are provided. The method includes providing a substrate having a chip region and a scribe-line region surrounding the chip region and forming a dielectric layer on an upper surface of the substrate. A dummy structure is formed in the dielectric layer over the scribe-line region of the substrate and extends along edges of the chip region. The dummy structure includes a first stack of dummy metal layers and a second stack of dummy metal layers arranged concentrically from the inside to the outside. The method also includes performing a sawing process on a portion of the dielectric layer that surrounds the dummy structure, so as to form a saw opening through the dielectric layer. At least the first stack of dummy metal layers remains in the dielectric layer after the sawing process is performed.