Abstract: A semiconductor package includes a first heat dissipation plate, a second heat dissipation plate, a plurality of heat generating assemblies, and a plurality of fixture components. The first heat dissipation plate has a first upper surface and a first lower surface. The first heat dissipation plate includes first through holes extended from the first upper surface to the first lower surface. The second heat dissipation plate has a second upper surface and a second lower surface. The second heat dissipation plate includes second through holes extended from the second upper surface to the second lower surface. The heat generating assemblies are disposed between the first heat dissipation plate and the second heat dissipation plate. The fixture components include fix screws and nuts. The fix screws penetrate through the first heat dissipation plate and the second heat dissipation plate along the first through holes and the second through holes.

Abstract: A beating training machine comprises a hollow seat; a rod base installed in the seat and a top of the rod base being installed with a main rod; the rod base and main rod being connected; an upper end of the main rod being installed with a sub-rod; a main beating body being installed above the sub-rod; a stub installed to the connecting section; each end portion of the stub being formed with a connecting portion; the connecting portion being formed with a teeth ring and a hole; one end of at least one sub-beating body being extended with a rod portion; the rod portion being formed with an engaging portion corresponding to the connecting portion; one lateral surface of the engaging portion being formed with a teeth ring corresponding to the teeth ring of the stud; and a locking element serving to locking the sub-beating body to the stub.