Abstract: The present invention discloses a sports and health cloud analysis system including a cloud server with an intelligent analysis module, a big data database is coupled to the cloud server, a wearable sensing module is coupled to a mobile device for collecting at least heart sound, ECG, lung sounds, blood pressure, blood glucose level and blood oxygen saturation level information; an insole-type sensing module is used to collect at least foot information, which is connected to the mobile device. The sensing module performs at least one of exercise sensing, foot, exercise, ankle exercise, knee exercise, hand exercise. The collected information is analyzed by an intelligent analysis module to obtain data for evaluating the health status and exercise intensity.

Abstract: A method of forming a semiconductor device includes forming a first epitaxial layer over a substrate to form a wafer, depositing a dielectric layer over the first epitaxial layer, patterning the dielectric layer to form an opening, etching the first epitaxial layer through the opening to form a recess, forming a second epitaxial layer in the recess, etching the dielectric layer to expose a top surface of the first epitaxial layer, and planarizing the exposed top surface of the first epitaxial layer and a top surface of the second epitaxial layer.

Abstract: This application provides a wireless charging circuit and a device. The wireless charging circuit includes a power supply module, an inverter module, and a first coil component; the first coil component includes at least one coil; the power supply module is connected to the inverter module, and the inverter module is connected to the first coil component; the power supply module is configured to: output a direct current signal to the inverter module; and the inverter module is configured to: convert the direct current signal into an alternating current signal at a target resonant frequency, and output the alternating current signal to the first coil component, where the target resonant frequency is at an MHz level. In this application, a stylus can obtain electric energy from a power supply device without being clung to the power supply device.

Abstract: A computing system having a memory component with an embedded media controller. The memory component is encapsulated within an integrated circuit (IC) package. The embedded controller within the IC package is configured to: receive incoming packets, via a serial communication interface of the controller, from a serial connection outside of the IC package; convert the incoming packets into commands and addresses according to a predetermined serial communication protocol; operate memory units encapsulated within the IC package according to the commands and the addresses; convert results of at least a portion of the commands into outgoing packets; and transmit the outgoing packets via the serial communication interface to the serial connection outside of the IC package.

Abstract: This application discloses a wireless keyboard. The wireless keyboard includes a connection portion. The connection portion includes an accommodating cavity with an opening at an end and used for accommodating an electronic stylus. A wireless charging coil is arranged in the accommodating cavity. A charging interface and a wireless charging control module are arranged in the wireless keyboard. The wireless charging control module is connected to the charging interface and the wireless charging coil. The charging interface can receive a direct current signal. The wireless charging control module can convert, if it is detected that a direct current signal is inputted to the charging interface, the direct current signal into an alternating current signal and transmit the alternating current signal to the wireless charging coil. The wireless charging coil generates an alternating electromagnetic field in response to the alternating current signal, to wirelessly charge the electronic stylus.

Abstract: The present invention discloses a multifunctional single wafer soaking-spinning-cleaning device and a wafer processing method. The method includes a device providing step, a first lifting step, a wafer placing step, a second lifting step, a soaking step, and a third lifting steps, and a spinning cleaning step. The device providing step includes providing a multifunctional single wafer immersion and spin cleaning device, the device has a spin drive device, a wafer turntable, and a wafer receiving tray. A soaking tank is formed on the wafer receiving tray, and a watertight contact gasket is disposed on the wafer receiving tray to contact the wafer water-tightly such that in the soaking step, an appropriate water level of the liquid medicine can be accumulated to fully soak the wafer.

Abstract: A method of forming a semiconductor device includes forming a first epitaxial layer over a substrate to form a wafer, depositing a dielectric layer over the first epitaxial layer, patterning the dielectric layer to form an opening, etching the first epitaxial layer through the opening to form a recess, forming a second epitaxial layer in the recess, etching the dielectric layer to expose a top surface of the first epitaxial layer, and planarizing the exposed top surface of the first epitaxial layer and a top surface of the second epitaxial layer.

Abstract: In some implementations, a computing device can present augmented reality (AR) labels in an AR video stream. For example, the computing device can obtain route information for a route requested by a user and can determine locations along the route for placing candidate AR labels. The computing device can determine the precise location of the computing device using camera depth information obtained in response to the user scanning the local real-world environment with a camera of the computing device. The computing device can select an AR label and/or label placement location for presentation in an AR video stream based on various criteria, including the distance between the candidate AR labels and the precise location of the computing device, priorities assigned to each candidate AR label, and/or whether a clear line of sight exists between the precise location of the computing device and the candidate AR label location.

Abstract: A liquid cooling system is provided. The liquid cooling system comprises a radiator having first and second built-in fluid tank reservoirs, a multi-fan unit, at least one heat exchanger pump, and a plurality of fluid conduits. The radiator comprises at least one first flow port and at least one second flow port for attachment of the plurality of fluid conduits thereto for actively moving a cooling fluid to and from the at least one heat exchanger pump. Heat generated from a heat generating device is transferred to cooling fluid flowing through the at least one heat exchanger pump, and then output to the radiator. The heated cooling fluid flows through the radiator having the built-in fluid tank, cooling along a plurality of heat exchanger fins, whereby the multi-fan unit expels heat therefrom. The cooling fluid flows to the heat exchanger pump to once again begin the cooling loop.

Abstract: An operation method of a software program meeting UEFI specifications for configuring a GPIO port is provided. The operation method includes: operating in a command-line mode to display, on a display device, a first prompt for guiding a user to input a string of command-line arguments; in response to receipt of a string of command-line arguments for reading content stored in a register that corresponds to one of GPIO pins of the GPIO port under the command-line mode, displaying, on the display device, a default value of the register that corresponds to a function of said one of the GPIO pins; and in response to receipt of a string of command-line arguments for setting a register that corresponds to one of the GPIO pins to a set value under the command-line mode, writing the set value to the register to replace a current value with the set value.

Abstract: An insole with wireless charging system includes a pressure sensing layer arranged on the insole, a sensing device is formed in the insole to detect speed, distance, direction, acceleration, angular orientation or any combination thereof. An inductive coil is formed in the insole for wireless charging a battery.

Abstract: Technologies for framework-level audio device virtualization include a computing device that executes multiple application framework instances. The computing device monitors for an application framework instance switch and, in response to an application framework instance switch, determines whether the current application framework instance is in the foreground. If in the foreground, the computing device selects a physical audio output device. The computing device may output audio data associated with the current application framework instance using a kernel audio driver associated with the physical audio output device. If not in the foreground, the computing device selects a null audio output device using a null audio hardware abstraction layer (HAL). The null audio HAL may sleep for the duration of audio data associated with the current application framework instance. The null audio HAL may be an operating-system- and device-independent shared library of the computing device.

Abstract: A voice coil motor assembly including a base, a frame, an elastic sheet, a housing, and a plurality of shock-absorbing components is provided. The frame is disposed on the base. The frame includes a bottom surface, a top surface, a plurality of side walls and a support frame. One side of the elastic sheet is disposed on the top surface of the frame and the other is disposed on the support frame. The housing is disposed above the base to receive the frame and the elastic sheet. The housing includes a housing top wall and a plurality of housing side walls surrounding the housing top wall. The shock-absorbing components are disposed on the frame and are sandwiched between the frame and the housing side walls of the housing, and/or between the support frame and the housing top wall of the housing.

Abstract: A damper device and an electronic apparatus are provided. The damper device includes a first holder, a first damper component and a first gel. The first damper component includes a first protrusion part and a first bar part. The first protrusion part includes a first surface. The first bar part includes a first free end and a first fixed end. The first protrusion part is fixed on the first free end, the first fixed end is fixed on the first holder and the first surface protrudes outward from the first free end. The first free end and the first protrusion part are inserted into the first gel, and the first gel moves along the radial direction of the first bar part relative to the first bar part.

Abstract: A damper device includes a first motion component and a base. The first motion component includes a first damper part, and the cross section of the first damper part includes a first circular arc edge. The base includes a first gel, and the base is correspondingly disposed with the first motion component. The terminal of the first damper part is inserted into the first gel. The first motion component is configured to drive the first damper part to move along the radial direction of the first damper part relative to the first gel, and the first circular arc edge faces the moving direction of the first damper part. The damper device solves the problem that keeping the damping pin bonding to the gel is not easy.

Abstract: A method for returning to a basic input/output system (BIOS) setup utility while in a shell environment during a booting process of a computing system includes: upon execution of an update Unified Extensible Firmware Interface (UEFI) (BIOS) firmware file, storing a dynamic command in a command storage; storing a back protocol in the storage module, the back protocol being linked to a back function that, when executed, causes the CPU to call a program file that, when executed by the CPU, causes the CPU to enter a BIOS setup utility, the dynamic command being linked to accessing a memory location in which the back protocol is stored; and in response to receipt of the dynamic command while in the shell environment, locating the back protocol, performing the back function and calling the specific program file, which causes the CPU to enter the BIOS setup utility.

Abstract: The present invention discloses a multifunctional single wafer soaking-spinning-cleaning device and a wafer processing method. The method includes a device providing step, a first lifting step, a wafer placing step, a second lifting step, a soaking step, and a third lifting steps, and a spinning cleaning step. The device providing step includes providing a multifunctional single wafer immersion and spin cleaning device, the device has a spin drive device, a wafer turntable, and a wafer receiving tray. A soaking tank is formed on the wafer receiving tray, and a watertight contact gasket is disposed on the wafer receiving tray to contact the wafer water-tightly such that in the soaking step, an appropriate water level of the liquid medicine can be accumulated to fully soak the wafer.

Abstract: A vapor chamber is provided. The vapor chamber is adapted to be thermally connected to an electronic element. The vapor chamber includes a first member and a second member. The first member has a first heat transfer coefficient. The first member is connected to the electronic element. The second member has a second heat transfer coefficient. The second member is combined with the first member. The first member is located between the second member and the electronic element. The first heat transfer coefficient is greater than the second heat transfer coefficient.

Abstract: An integrated circuit layout includes an upper active region comprising a first edge and a second edge extending along a first direction and respectively adjacent to an upper cell boundary by a distance D3 and a distance D4. A first gate line is disposed on the upper active region, extends along a second direction, and protrudes from the first edge by a length L3. A second gate line is disposed on the upper active region, extends along the second direction, and protrudes from the second edge by a length L4. Two dummy gate lines respectively extend along the second direction and are disposed at two sides of the upper active region and away from the upper cell boundary by a distance S. The first direction and the second direction are perpendicular. The distances D3, D4, S and the lengths L3 and L4 have the relationships: L3?D3?S, L4?D4?S, and D3?D4.

Abstract: A camera assembly comprises a casing, a light sensing component, and a flexible circuit board. The casing comprises a lens accommodating groove, an housing, and a base on which the housing is disposed. The lens accommodating groove is disposed between the housing and the base. An opening of the lens accommodating groove is disposed at the housing. The light sensing component comprises a light sensing member and a baseplate on which the light sensing member is disposed. The light sensing member is correspondingly disposed at the bottom of the lens accommodating groove. The light sensing component is disposed on the base. The flexible circuit board comprises a first end part, a second end part, and a body part disposed between the first end part and the second end part.