Patents by Inventor Yuan Yao

Yuan Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11852982
    Abstract: A semiconductor manufacturing system includes a semiconductor processing apparatus. The semiconductor processing apparatus includes a processing chamber configured to perform a semiconductor process on a semiconductor wafer, and a transferring module configured to transfer the semiconductor wafer into and out of the processing chamber. The semiconductor manufacturing system also includes a particle attracting member. The semiconductor manufacturing system also includes a monitoring device configured to control the transferring module to load the particle attracting member into the processing chamber in a cleaning cycle while the semiconductor wafer is not in the processing chamber, and control the transferring module to load the particle attracting member out of the processing chamber after the cleaning cycle.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Yuan Yao, Yu-Yu Chen, Hsiang-Lung Tsou
  • Publication number: 20230398431
    Abstract: A method for implementing a translation action based motion sensing game includes: obtaining player's pose data detected by a motion sensing device after a preset translation-type motion sensing game is initiated; determining whether an action completion degree of the player meets a preset criterion based on the player's pose data and a preset translation action determination model; and, if the action completion degree of the player meets the preset criterion, moving a game object based on the player's pose data.
    Type: Application
    Filed: May 4, 2023
    Publication date: December 14, 2023
    Applicant: Shenzhen Shimi Network Technology Co., Ltd.
    Inventors: Chao GUO, Yuan YAO
  • Patent number: 11843664
    Abstract: A system performs continuous delivery of a data pipeline on a cloud platform. The system receives a specification of the data pipeline comprising data pipeline units. The system generates a deployment package for each data pipeline unit for a cloud platform. The system provisions computing infrastructure on the cloud platform according to the system configuration of the data pipeline unit. The data pipeline may be implemented as a data mesh. The data pipeline generates one or more data models. The system receives a schema representing a modification in a data model based on a change in the requirements of a consumer system. The system determines the changes to the data pipeline based on the received schema and reconfigures the data pipeline to generate the modified data model. The system manages access control of data to minimize the exposure to data in case of accidental or malicious data breach.
    Type: Grant
    Filed: July 31, 2021
    Date of Patent: December 12, 2023
    Assignee: Humana Inc.
    Inventors: Tian Lai, Yuan Yao, Bing Zhang
  • Publication number: 20230382388
    Abstract: A driving control method for a vehicle, comprising: acquiring a state of a rear wheel steering function of a vehicle; and adjusting the state of the rear wheel steering function to control a traffic jam pilot function of the vehicle to enter an activated state, wherein if the rear wheel steering function is in an activated state, before the rear wheel steering function is switched to an inactivated state, the traffic jam pilot function does not enter an activated state, and if the rear wheel steering function is in an inactivated state, after both a longitudinal control state and a lateral control state of the vehicle enter a traffic jam pilot mode, the traffic traffic jam pilot function enters an activated state.
    Type: Application
    Filed: September 21, 2020
    Publication date: November 30, 2023
    Inventors: Feixiang ZHANG, Yuan YAO, Hao LIU
  • Publication number: 20230384395
    Abstract: System and method for testing power conversion devices are provided. A power supply grid is connected to an AC terminal of a first power conversion device, the power supply grid is also connected to an AC terminal of the second power conversion device, and a DC terminal of the first power conversion device is connected to a DC terminal of the second power conversion device. In this way, a test loop is formed by the power supply grid, the first power conversion device and the second power conversion device. In this test loop, the first power conversion device and the second power conversion device act as a load and a power source, so no additional DC power supply and load are required during the test.
    Type: Application
    Filed: May 1, 2023
    Publication date: November 30, 2023
    Applicant: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
    Inventors: Chunfa WANG, Yanming ZHAO, Zhimin DAN, Yu YAN, Yuan YAO, Xiao WANG, Xiyang ZUO
  • Publication number: 20230371177
    Abstract: A circuit board including: a first board material layer having a first planar surface and a first sidewall surface perpendicular to the first planar surface; a first conductive layer on the first planar surface; a second board material layer stacked on the first board material layer and having a second planar surface and a second sidewall surface perpendicular to the second planar surface; a second conductive layer on the second planar surface; and a plating on the first sidewall surface and the second sidewall surface and electrically connecting the first conductive layer and the second conductive layer.
    Type: Application
    Filed: May 10, 2022
    Publication date: November 16, 2023
    Inventors: Yuan Yao, Todd Edward Takken
  • Publication number: 20230369144
    Abstract: One aspect of this description relates to a testing apparatus including an advance process control monitor (APCM) in a first wafer, a plurality of pads disposed over and coupled to the APCM. The plurality of pads are in a second wafer. The testing apparatus includes a testing unit disposed between the first wafer and the second wafer. The testing unit is coupled to the APCM. The testing unit includes a metal structure within a dielectric. The testing apparatus includes a plurality of through silicon vias (TSVs) extending in a first direction from the first wafer, through the dielectric of the testing unit, to the second wafer.
    Type: Application
    Filed: July 24, 2023
    Publication date: November 16, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shuo-Wen Chang, Yu-Hsien Li, Min-Tar Liu, Yuan-Yao Chang
  • Publication number: 20230363348
    Abstract: Some embodiments of the present disclosure provide an automatic cat excrement removing device, including: a ball compartment assembly configured to have at least three spaces including a working compartment, a screening compartment, and an excrement collection compartment; and a driving assembly configured to drive the ball compartment assembly to rotate, wherein when the ball compartment assembly rotates to a first position, the screening compartment is located at the lowest position of the ball compartment assembly, so that the cat litter falls into the screening compartment through the screening holes, while the cat excrement stays in the working compartment because the size of the cat excrement is larger than that of the screening holes; and when the ball compartment assembly rotates to a second position, the excrement collection compartment is located at the lowest position of the ball compartment assembly, so that the cat excrement falls into the excrement collection compartment.
    Type: Application
    Filed: May 31, 2022
    Publication date: November 16, 2023
    Inventors: Shuwei PAN, Yuanbin WEN, Yuan YAO
  • Patent number: 11816842
    Abstract: Image processing methods, devices, and storage media are provided. One of the image processing methods includes: obtaining an image comprising a target object; inputting the image into a mask prediction model to obtain a first mask image corresponding to the target object in the image; inputting the first mask image and the image comprising the target object into a mask quality unification model to obtain a second mask image, wherein the mask quality unification model is configured to adjust a fineness associated with the first mask image to a target fineness to obtain the second mask image, and wherein the second mask image has image semantic information consistent with image semantic information of the image comprising the target object; and inputting the image comprising the target object and the second mask image into a target image obtaining model to obtain a target image corresponding to the target object.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: November 14, 2023
    Assignee: ALIBABA GROUP HOLDING LIMITED
    Inventors: Jinlin Liu, Yuan Yao
  • Patent number: 11799374
    Abstract: A package structure is disclosed. The package structure includes processor die connected to a top surface of a package substrate. The package structure further includes a DC-DC power converter attached to a bottom surface of the package substrate. The DC-DC power converter is located at least within an open area of an interconnect component that connects the bottom surface of the package substrate and a top surface of a motherboard.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: October 24, 2023
    Assignee: International Business Machines Corporation
    Inventors: Xin Zhang, Todd Edward Takken, Yuan Yao
  • Publication number: 20230334563
    Abstract: A method of facilitating merchant onboarding to a selective financing and payment platform may include automatically gathering information on a plurality of websites of candidate merchants and automatically processing the gathered information with a selected underwriting algorithm to determine whether one or more of the candidate merchants are eligible to be selected candidates for integration into the selective financing and payment platform. The method may further include, responsive to identification of a selected candidate determined to be eligible, providing an onboarding package to the selected candidate to enable the selected candidate to offer financing terms to customers via the selective financing and payment platform.
    Type: Application
    Filed: April 19, 2022
    Publication date: October 19, 2023
    Inventors: Yuan Yao, Jiarui Xu, Karthik Ramkumar, Ivajlo Nikolov, Ruixiang Fan
  • Publication number: 20230337478
    Abstract: A pixel arrangement structure.
    Type: Application
    Filed: June 23, 2023
    Publication date: October 19, 2023
    Applicant: Hefei Visionox Technology Co., Ltd.
    Inventors: Haohan ZHANG, Yuan YAO, Mingxing LIU, Yiming XIAO, Li ZHAO
  • Patent number: 11786892
    Abstract: A catalyst structure is provided. The catalyst structure includes a porous carrier and a plurality of layered hydroxides. The porous carrier includes a nitrogen-doped carbon framework, a plurality of metal oxide particles and a plurality of carbon nanotubes. The nitrogen-doped carbon framework has a plurality of pores. The metal oxide particles are uniformly dispersed in the pores of the nitrogen-doped carbon framework. The carbon nanotubes are located on a surface of the nitrogen-doped carbon framework, and one end of each of the carbon nanotubes is connected to the surface of the nitrogen-doped carbon framework. The layered hydroxides are coated on the surface of the nitrogen-doped carbon framework.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: October 17, 2023
    Assignee: NATIONAL CHUNG CHENG UNIVERSITY
    Inventors: Yuan-Yao Li, Ta-En Ko
  • Publication number: 20230302735
    Abstract: A powdered surface monitoring system of additive manufacturing comprises an additive manufacturing processing cavity, having therein a working area carrying powder to be sintered; a laser source, generating a laser beam, which passes through a reflector, a dichroic mirror and a scanning vibration mirror and is transmitted to an upper surface of the powder in the working area; a polarization imaging device, having therein a beam expander group, a polarizer group and at least one photodetector, the polarizer group consisting of a plurality of linear polarizers, and the number of photodetectors being equal to the number of the linear polarizers.
    Type: Application
    Filed: October 26, 2022
    Publication date: September 28, 2023
    Inventors: KUO-KUANG JEN, YI-CHERNG FERNG, CHIA-HSIANG CHANG, CHUN-HSIANG HUANG, YUAN-YAO LIN, CHAO-KUEI LEE, YI-JEN CHIU
  • Publication number: 20230308013
    Abstract: A switching circuit includes a switching transistor, a metal unit, and a branch. The metal unit is provided at the switching transistor, and the branch is electrically connected between a ground and at least one of the switching transistor or between the metal unit. The branch includes a capacitor, and the capacitor is configured to discharge radiated interference.
    Type: Application
    Filed: May 30, 2023
    Publication date: September 28, 2023
    Inventors: Yuan YAO, Zhimin DAN, Meng LI, Yu YAN
  • Patent number: 11769444
    Abstract: A display panel and a display device. The display panel includes a first area and a second area, and a plurality of first pixel rows and a plurality of second pixel rows, each of the first pixel row and the second pixel row includes a plurality of pixels. The number of the pixels of each first pixel row is greater than the number of the pixels of each second pixel row. The pixels in the first pixel row are display pixels, and the plurality of pixels in the second pixel row are display pixels and virtual pixels. The display pixel includes a display pixel circuit, the virtual pixel includes a virtual pixel circuit, and the virtual pixel circuit includes a compensation unit.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: September 26, 2023
    Assignee: KunShan Go-Visionox Opto-Electronics Co., Ltd
    Inventors: Yuan Yao, Shuai Ye, Xiyang Jia, Zhengyong Zhu
  • Patent number: 11768112
    Abstract: An insert coaxial thermal radiation image evaluating system includes a cage support, first lens, first cage movable frame, second cage movable frame, cage holder and light detector. The first cage movable frame is movably disposed at the cage support and connected to the first lens. The second cage movable frame is movably disposed at the cage support and connected to the light detector. The cage holder is connected to the cage support to fix the cage support to an optical substrate. The first cage movable frame is movably disposed in the cage holder. The first lens and a second lens of a metal additive manufacturing system together form a structure of conjugate foci, such that a thermal radiation generated from a high-power infrared laser irradiation zone forms according to a fixed ratio an image captured by the light detector.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: September 26, 2023
    Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Yuan-Yao Lin, Chao-Kuei Lee, Yi-Jen Chiu, Chung-Chun Huang, Qian-Mao Zhou, Ya-Hsuan Cheng, Ming-Wei Liu, Kuo-Kuang Jen, Chih-Peng Chen
  • Publication number: 20230293573
    Abstract: The present invention generally relates to a pharmaceutical formulation that substantially increases the bioavailability of niclosamide or a pharmaceutically acceptable salt thereof for a variety of routes of delivery for therapeutic purposes. The newly enhanced formulation also substantially expands the potential therapeutic applications of niclosamide. Pharmaceutical compositions and methods of uses thereof are within the scope of this disclosure.
    Type: Application
    Filed: July 23, 2021
    Publication date: September 21, 2023
    Applicant: Purdue Research Foundation
    Inventors: Yuan Yao, Jingmin Joanne Zhang
  • Patent number: 11754614
    Abstract: The present disclosure provides a method of analyzing a semiconductor device. The method includes providing a first transistor, a second transistor disposed adjacent to the first transistor, and a gate electrode common to the first transistor and the second transistor; connecting a power-supply voltage (Vdd) to the gate electrode to turn on the first transistor, determining a first threshold voltage (Vth) based on the power-supply voltage; switching the power-supply voltage to a ground voltage (Vss); connecting the ground voltage to the gate electrode to turn on the second transistor; and determining a second threshold voltage based on the ground voltage.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: September 12, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Wei-Jhih Wang, Chia Wei Huang, Chia-Chia Kan, Yuan-Yao Chang
  • Publication number: 20230253356
    Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes a first conductive line over the substrate. The chip structure includes an insulating layer over the substrate and the first conductive line. The chip structure includes a conductive pillar over and passing through the insulating layer. The conductive pillar is formed in one piece, the conductive pillar is in direct contact with the first conductive line, and a first sidewall of the first conductive line extends across a second sidewall of the conductive pillar in a top view of the first conductive line and the conductive pillar. The chip structure includes a solder bump on the conductive pillar. The solder bump is in direct contact with the conductive pillar.
    Type: Application
    Filed: April 18, 2023
    Publication date: August 10, 2023
    Inventors: Shan-Yu HUANG, Ming-Da CHENG, Hsiao-Wen CHUNG, Ching-Wen HSIAO, Li-Chun HUNG, Yuan-Yao CHANG, Meng-Hsiu HSIEH