Abstract: A voltage conversion circuit includes an N-level conversion unit and N-1 DC-DC conversion units. The N-level conversion unit includes N output terminals at different levels. A first input terminal of the Mth DC-DC conversion unit is connected to the Mth output terminal of the N-level conversion unit, and a second input terminal of the Mth DC-DC conversion unit is connected to an (M+1)th output terminal of the N-level conversion unit. An output level of the Mth output terminal and an output level of the (M+1)th output terminal are adjacent levels. N and M are positive integers and satisfy N ? 3 and 1 ? M < N.

Abstract: An isolated resonant conversion control apparatus includes a voltage and current obtaining unit configured to obtain an output voltage and an output current of an output-side switch transistor of an isolated resonant conversion unit, and a processing unit configured to calculate a switching frequency of an input-side switch transistor of the isolated resonant conversion unit based on the output voltage and the output current, obtain a turn-on offset time and a turn-off offset time of the output-side switch transistor relative to the input-side switch transistor based on the switching frequency of the input-side switch transistor, obtain a duty ratio of a second driving signal based on a duty ratio of a first driving signal, the turn-on offset time, and the turn-off offset time, and generate the second driving signal based on the switching frequency and the duty ratio of the second driving signal.

Abstract: Disclosed are a material pushing robot (1), a material pushing system, and a material pushing management method.

Abstract: A frozen stuffed fish ball with low soup loss and the method of preparing the same. By combining hydrocolloid and oil pre-emulsification technology, the problems of taste of powder, soup loss of fish balls after freeze-thaw cooking and the taste of frozen stuffed fish balls after freeze-thaw cooking are solved. The use of konjac gum and carrageenan or curdlan respectively, combined with oil pre-emulsification technology, also effectively improves the texture and brightness of the outer skin of fish balls. Compared with a single addition of conventional technology, the hardness, elasticity and brightness are increased, solving loosen structure, brightness and other problems due to freeze-thaw cycle. Further, it may be used in the fish ball processing line for preparing fish ball with fillings and other stuffed surimi products.

Abstract: A system performs continuous delivery of a data pipeline on a cloud platform. The system receives a specification of the data pipeline that is split into smaller specifications of data pipeline units. The system identifies a target cloud platform and generates a deployment package for each data pipeline unit for the target cloud platform. The system creates a connection with the target cloud platform and uses the connection to provision computing infrastructure on the target cloud platform for the data pipeline unit according to the system configuration of the data pipeline unit. The data pipeline may be implemented as a data mesh that is a directed acyclic graph of nodes, each node representing a data pipeline unit. Different portions of the data mesh may be modified independent of each other. Partial results stored in different portions of the data mesh may be recomputed starting from different points in time.

Abstract: The present application relates to a method and apparatus of power distribution control for power module and a power module device. The method includes: obtaining temperature data of target devices in two or more power modules; analyzing whether the power modules are operating at full power when the temperature data of the target devices meets a preset temperature fault condition; and adjusting operating parameters of the power modules based on the temperature data when the power modules are not operating at full power.

Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes a first conductive line over the substrate. The chip structure includes an insulating layer over the substrate and the first conductive line. The chip structure includes a conductive pillar over the insulating layer. The conductive pillar is formed in one piece, the conductive pillar has a lower surface and a bottom protruding portion protruding from the lower surface, the bottom protruding portion passes through the insulating layer over the first conductive line, the bottom protruding portion is in direct contact with the first conductive line, and a first linewidth of a first portion of the first conductive line under the conductive pillar is less than a width of the conductive pillar. The chip structure includes a solder bump on the conductive pillar. The solder bump is in direct contact with the conductive pillar.

Abstract: A semiconductor package provides a low profile connection to a bottom side of the semi-conductor package. The semi-conductor package includes a computer processor die and a substrate. The computer processor die is mounted on to a top surface of the substrate. The substrate is mounted on to a printed circuit board. A voltage regulator is coupled to the printed circuit board. A top surface of the voltage regulator is coupled to a bottom surface of the substrate. The package also includes a connector device. The connector device includes a cable configured to conduct power from an upstream source, and a low-profile connector module attached to an end of the cable. The connector module is configured to interface to a bottom surface of the voltage regulator.

Abstract: During operation, a computer system may receive, from an electronic device, a VNI assignment message, where the VNI assignment message specifies a range of VNIs for VXLANs and one or more associated data planes. In response, the computer system may compute whether one or more VNIs in the range of VNIs are available. For example, the computer system may communicate with the VXLANs and/or may perform a look-up operation in a data structure in memory with information about VNIs (such as available VNIs and/or unavailable VNIs). When the one or more VNIs are unavailable, the computer system may provide, to the electronic device, an error message. Alternatively, when the one or more VNIs in the range of VNIs are available, the computer system may: modify the one or more data planes that implement the VXLANs with the range of VNIs; and provide, to the electronic device, an acknowledgment message.

Abstract: A stacked semiconductor package has a substrate, a first chip, at least one spacer, a second chip and an encapsulation. The first chip and the second chip are intersecting stacked on the substrate. The at least one spacer is stacked on the substrate to support the second chip. The encapsulation is formed to encapsulate the substrate, the first chip, the at least one spacer and the second chip. The at least one spacer is made of the material of the encapsulation. Therefore, the adhesion between the at least one spacer and the encapsulation is enhanced to avoid the delamination during the reliability test and enhances the reliability of the stacked semiconductor package.

Abstract: The present disclosure provides a terminal, a server, an Internet of Things data transmission method, and a data transmission system, wherein the Internet of Things data transmission method includes following blocks: transmitting data and uniquely corresponding identity information from a terminal used to collect data to a server, and feeding back, at the server, at least one response signal to the terminal in response to the received data and the identity information.

Abstract: A heat exchange apparatus and a manufacturing method therefor are disclosed. The heat exchange apparatus comprises a valve core part and a core body part. The valve core part is provided with a valve base part. The valve seat part is at least partly arranged in a first conduit. The valve base part is provided with a base section with a bottom opening and a middle section with a peripheral opening. The valve base part is provided with a throttling hole. The throttling hole is in communication with the peripheral opening and the bottom opening. The middle section is arranged on a sheet part and the peripheral opening is in communication with inter-sheets channels. The heat exchanging apparatus comprising a connecting element. The connecting element is at least partly inserted into the first conduit. The bottom opening is in communication with a connecting cavity.

Abstract: This application discloses an electrical system and an electrical apparatus. The electrical system includes: a first-stage conversion module including a plurality of first controllable switches; a second-stage conversion module including a plurality of second controllable switches; a first digital signal processor configured to control the first controllable switch; and a second digital signal processor configured to control the second controllable switch, where a first output crossbar switch of the first digital signal processor is configured to supply a first internal signal to a first output port, so that the second digital signal processor receives the first internal signal within a preset time through a second input port. The internal signal of the first digital signal processor can be enabled to be transmitted to the second digital signal processor within a relatively short time, thereby reducing a time interval for triggering a protection action between the two digital signal processors.

Abstract: A heat exchange device including a valve element component, a core body component and a connecting member having a first end and a second end, and the second end is provided with a welding section and an adjacent section; the core body component is provided with a welding matching portion; the welding section is welded to the welding matching portion, and the adjacent section is adjacent to the welding section; the outer diameter of the welding section is smaller than or equal to the inner diameter of the welding matching portion, and the outer diameter of the adjacent section is smaller than or equal to the inner diameter of the welding matching portion; and the distance between the end of the welding matching portion away from the valve element component and the end of the welding section away from the valve element component is larger than or equal to zero.

Abstract: A display device and a driving method therefor. The display device includes pixel units and pixel scanning circuits, and each of the pixel scanning circuits corresponds to the pixel units of a row. The driving method for the display device includes: driving, by a first driving signal corresponding to a first scanning frequency, the pixel scanning circuits, the first driving signal having row periods corresponding to a frame of image under the first scanning frequency; obtaining a switching signal, and driving, by a second driving signal corresponding to a second scanning frequency, the pixel scanning circuits according to the switching signal. The second driving signal has row periods corresponding to a frame of image under the second scanning frequency, the first scanning frequency is less than the second scanning frequency, and the row period of the first driving signal is greater than the row period of the second driving signal.

Abstract: A power supply system, a converter, and a circulating current suppression method of the converter. The power supply system includes at least two converters that are coupled between a direct current power supply and an alternating current grid. Each converter obtains target output reactive power when an output current of the converter starts to increase from an initial current, obtains a reactive power compensation parameter based on the three-phase output voltages. Further, each converter obtains compensated output reactive power of the converter based on the reactive power compensation parameter and adjusts actual output reactive power of the converter based on the target output reactive power and the compensated output reactive power, so that an absolute value of a difference between common-mode output voltages of any two of the at least two adjusted converters is less than a difference threshold.

Abstract: In an apparatus for coupling integrated circuits to printed circuit boards, a backing plate with manufactured features on the top surface includes a module lid; a planar structure; a device seated in the planar structure, with the module lid in contact with the top surface of the device; and a backing plate that contains manufactured features on one side. The backing plate is in contact with the planar structure, and a plurality of fastening mechanisms couple together the lid, the device, the planar structure, and the backing plate.

Abstract: Disclosed are an indoor navigating system and an indoor navigating method based on vision. The indoor navigating method comprises capturing a material channel image; segmenting the material channel image to obtain a material pushing machine and a walkable area from the material channel image, and determining boundaries of the material pushing machine and boundaries of the walkable area; obtaining a distance between a left boundary of the material pushing machine and a left rail of a material channel and/or a distance between a right boundary of the material pushing machine and a right rail of the material channel; obtaining a lateral deviation distance of the material pushing machine, and determining a course angle; and adjust an actual moving direction of the material pushing machine according to the course angle.

Abstract: A package structure is disclosed. The package structure includes processor die connected to a top surface of a package substrate. The package structure further includes a DC-DC power converter attached to a bottom surface of the package substrate. The DC-DC power converter is located at least within an open area of an interconnect component that connects the bottom surface of the package substrate and a top surface of a motherboard.

Abstract: The present disclosure provides a wafer. The wafer includes a die, a scribe line adjacent to the die, and a test circuit adjacent to the scribe line. The test circuit includes a first switch, a second switch, and a third switch. The first switch has a first node coupled to a first device-under-test and a second node coupled to a first signal supply node. The second switch has a first node coupled to the second DUT and a second node coupled to the first signal supply node. The third switch has a first node directly coupled to the first DUT and the second DUT. The third switch has a second node coupled to a second signal supply node. The third switch selectively couples both of the first DUT and the second DUT to the second signal supply node.