Abstract: The present disclosure provides an anti-fogging material and a manufacturing method thereof. The anti-fogging material includes a crosslinked polymer obtained by curing an anti-fogging composition, wherein the anti-fogging composition includes an ionic compound, a hard compound with two or more acrylate functional groups at the terminus thereof, and a surface active compound.

Abstract: An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar arranged in the periphery of the sensing area are disposed; a lid covering the sensing area; an encapsulant disposed on the redistribution circuit structure and encapsulating at least part of the image sensing chip and the cover; and a top tier semiconductor chip disposed above the image sensing chip and having an active surface on which a first conductor is disposed. The first conductor overlaps the image sensing chip in a direction perpendicular to the sensing surface. The first conductive pillar and the first conductor are aligned and bonded to each other to electrically connect the image sensing chip and the top tier semiconductor chip.

Abstract: A USB switching circuit includes a first multiplexer, a second multiplexer coupled with the first multiplexer through transmission paths, and a voltage regulation circuit coupled with the first and second multiplexers. The first multiplexer distributes first data signals to the transmission paths according to first control signals. The second multiplexer distributes a second data signal to the transmission paths according to second control signals. The voltage regulation circuit sets a maximum voltage and a minimum voltage of the first data signals to corresponding to a common voltage. The maximum voltage of the first data signals is not higher than a maximum voltage of the second control signals, or the minimum voltage of the first data signals is not lower than a minimum voltage of the second control signals. The first data signals and the second data signal are generated according to different communication protocols.

Abstract: A medicament with excellent JAK kinase (Janus Kinase) inhibitory activity can be used to prevent, treat and/or improve an autoimmune disease (e.g., psoriasis, rheumatoid arthritis, inflammatory bowel disease, Sjogren's syndrome, Behcet's disease, multiple sclerosis, systemic lupus erythematosus and the like). The present invention also provides a pharmaceutically acceptable composition containing the compound and a method for preparing these compounds.

Abstract: An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar arranged in the periphery of the sensing area are disposed; a lid covering the sensing area; an encapsulant disposed on the redistribution circuit structure and encapsulating at least part of the image sensing chip and the cover; and a top tier semiconductor chip disposed above the image sensing chip and having an active surface on which a first conductor is disposed. The first conductor overlaps the image sensing chip in a direction perpendicular to the sensing surface. The first conductive pillar and the first conductor are aligned and bonded to each other to electrically connect the image sensing chip and the top tier semiconductor chip.

Abstract: An intelligent regulation system for a mechanical seal, the system comprising: a monitoring device for measuring a signal correlated with a seal in real time; a control device, comprising a state determination module, a feasible region analysis module, an evaluation module and an optimizing module, wherein the state determination module unscrambles the signal obtained by the monitoring device to estimate the state of the seal; the feasible region analysis module determines, according to a current state, a state that the seal can reach by means of the regulating effect of a regulating device; the evaluation module evaluates a value for the state of the seal; and the optimizing module searches a feasible region, where the seal is regulated, for a regulating method with a relatively high value to the greatest extent, and accordingly sends an instruction to the regulating device; and the regulating device for actively applying an action to the seal according to the instruction given by the control device.

Abstract: A real-time monitoring and analysis method for a mechanical seal. In the method, an acoustic emission signal generated by a friction pair at a mechanical seal end surface is measured; a specific acoustic source generate signals on a plurality of specific frequency bands on an acoustic scale. In a seal operating process motion causes the acoustic emission signal to change on a dynamic time scale equivalent to a period of rotation. In a long-term seal service process, cumulative performance changes occur on a service time scale due to running-in, wear, and/or aging of elastic elements; for this feature, the long-term change process of the acoustic emission signal needs to be considered. Analysis is performed, on multiple scales, in combination with auxiliary information and with determined physical characterization quantities passed to scales of longer time, thereby determining the real-time working state of the seal and providing a performance change expectation of the seal.

Abstract: An intelligent regulation system for a mechanical seal, the system comprising: a monitoring device for measuring a signal correlated with a seal in real time; a control device, comprising a state determination module, a feasible region analysis module, an evaluation module and an optimizing module, wherein the state determination module unscrambles the signal obtained by the monitoring device to estimate the state of the seal; the feasible region analysis module determines, according to a current state, a state that the seal can reach by means of the regulating effect of a regulating device; the evaluation module evaluates a value for the state of the seal; and the optimizing module searches a feasible region, where the seal is regulated, for a regulating method with a relatively high value to the greatest extent, and accordingly sends an instruction to the regulating device; and the regulating device for actively applying an action to the seal according to the instruction given by the control device.

Abstract: A real-time monitoring and analysis method for a mechanical seal.

Abstract: A USB switching circuit includes a first multiplexer, a second multiplexer coupled with the first multiplexer through transmission paths, and a voltage regulation circuit coupled with the first and second multiplexers. The first multiplexer distributes first data signals to the transmission paths according to first control signals. The second multiplexer distributes a second data signal to the transmission paths according to second control signals. The voltage regulation circuit sets a maximum voltage and a minimum voltage of the first data signals to corresponding to a common voltage. The maximum voltage of the first data signals is not higher than a maximum voltage of the second control signals, or the minimum voltage of the first data signals is not lower than a minimum voltage of the second control signals. The first data signals and the second data signal are generated according to different communication protocols.

Abstract: A transmission interface communicating method used in a display device that includes the steps outlined below is provided. A first status update signal is received from a host device to turn a hot plug detect (HPD) status of the display device to a high status. A HPD signal having a low status is transmitted to the host device in response to the first status update signal. A configuration signal is received from the host device. A configuration acknowledgement signal is transmitted to the host device in response to the configuration signal. The HPD signal having the high status is actively transmitted to the host device.

Abstract: An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar arranged in the periphery of the sensing area are disposed; a lid covering the sensing area; an encapsulant disposed on the redistribution circuit structure and encapsulating at least part of the image sensing chip and the cover; and a top tier semiconductor chip disposed above the image sensing chip and having an active surface on which a first conductor is disposed. The first conductor overlaps the image sensing chip in a direction perpendicular to the sensing surface. The first conductive pillar and the first conductor are aligned and bonded to each other to electrically connect the image sensing chip and the top tier semiconductor chip.

Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes: an interposer including a wiring structure and an interposer via electrically connected to the wiring structure; a plurality of semiconductor chips located on a first surface of the interposer and electrically connected to each other through the interposer; an encapsulant located on the first surface of the interposer and encapsulating at least a portion of the plurality of semiconductor chips; and a redistribution circuit structure located on a second surface of the interposer opposite to the first surface, wherein the plurality of semiconductor chips are electrically connected to the redistribution circuit structure through at least the interposer.

Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes a redistribution circuit structure; a first semiconductor chip disposed on the redistribution structure and having a first active surface on which a first conductive post is disposed; a second semiconductor chip disposed above the first semiconductor chip and having a second active surface on which a first conductor is disposed; and a first encapsulant disposed on the redistribution circuit structure and encapsulating at least the first semiconductor chip, wherein the first conductive post and the first conductor are aligned and bonded to each other to electrically connect the first semiconductor chip and the second semiconductor chip.

Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes: an interposer including a dielectric body, a plurality of semiconductor bodies separated by the dielectric body, a through via penetrating through the dielectric body, and a wiring structure located in each of the plurality of semiconductor bodies; a plurality of semiconductor chips located side by side on a first surface of the interposer and electrically connected to the wiring structure; an encapsulant located on the first surface of the interposer and encapsulating at least a portion of the plurality of semiconductor chips; and a redistribution circuit structure located on a second surface of the interposer opposite to the first surface of the interposer and electrically connected to the plurality of semiconductor chips through the through via.

Abstract: A database processing system includes a coordinator agent controller and a virtual node data base. The coordinator agent controller detects a request to access a database by an application program and to extracts database objects from a database protocol stream based on a requirement requested by the application program. The virtual node database is generated according to the extracted database objects. The virtual node database includes memory dump storage that stores the database objects extracted from the database protocol stream, and based on the database objects the virtual node database generates virtual database objects corresponding to the database protocol stream. The extraction of database objects is performed directly on the database protocol stream without communicating with a target real database.

Abstract: A database processing system includes a coordinator agent controller and a virtual node data base. The coordinator agent controller detects a request to access a database by an application program and to extracts database objects from a database protocol stream based on a requirement requested by the application program. The virtual node database is generated according to the extracted database objects. The virtual node database includes memory dump storage that stores the database objects extracted from the database protocol stream, and based on the database objects the virtual node database generates virtual database objects corresponding to the database protocol stream. The extraction of database objects is performed directly on the database protocol stream without communicating with a target real database.

Abstract: Provided is a use of miRNA-214 inhibitor in inhibiting regulatory T cells (Treg cells). The microRNA-214 (miRNA-214) can promote Treg cells, and can assist tumors in immune escape. The experiments demonstrates that the inhibition of miRNA-214 can inhibit the growth of Treg cells, thus inhibiting the growth of tumors. Therefore, miRNA-214 can be used for developing an anti-tumour drug or a drug inhibiting immune response hyperactivity.

Abstract: A transmission interface communicating method used in a display device that includes the steps outlined below is provided. A first status update signal is received from a host device to turn a hot plug detect (HPD) status of the display device to a high status. A HPD signal having a low status is transmitted to the host device in response to the first status update signal. A configuration signal is received from the host device. A configuration acknowledgement signal is transmitted to the host device in response to the configuration signal. The HPD signal having the high status is actively transmitted to the host device.

Abstract: The present invention discloses method for preparing deoxycholic acid (DCA) or an ester thereof or a pharmaceutically acceptable salt thereof. Said compounds may be applied to remove a fat deposition.