Abstract: An informational plaque mounting system includes a support bracket including a base having a rear side and a front side, and at least one first pivot component at the front side; an informational plaque including a plaque front side and a plaque rear side, and at least one second pivot component at the plaque rear side; wherein the at least one second pivot component is matingly engageable with the at least one first pivot component such that the informational plaque is supported on the support bracket and pivotable relative to the support bracket for varying an angular orientation of the informational plaque relative to the support bracket.

Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes a redistribution circuit structure; a first semiconductor chip disposed on the redistribution structure and having a first active surface on which a first conductive post is disposed; a second semiconductor chip disposed above the first semiconductor chip and having a second active surface on which a first conductor is disposed; and a first encapsulant disposed on the redistribution circuit structure and encapsulating at least the first semiconductor chip, wherein the first conductive post and the first conductor are aligned and bonded to each other to electrically connect the first semiconductor chip and the second semiconductor chip.

Abstract: A medicament with excellent JAK kinase (Janus Kinase) inhibitory activity can be used to prevent, treat and/or improve an autoimmune disease (e.g., psoriasis, rheumatoid arthritis, inflammatory bowel disease, Sjogren's syndrome, Behcet's disease, multiple sclerosis, systemic lupus erythematosus and the like). The present invention also provides a pharmaceutically acceptable composition containing the compound and a method for preparing these compounds.

Abstract: The present disclosure provides a deuterium-modified thienopyridone compound, a preparation method therefor, a pharmaceutical composition thereof, and a medical use thereof. The deuterium-modified thienopyridone compound is shown in formula I, and has been shown to inhibit HPK1 kinase activity, being capable of achieving an anti-tumour effect.

Abstract: Provided is a compound as an Akt kinase inhibitor. The present invention specifically relates to a compound of formula (I) or a pharmaceutically acceptable salt thereof, a preparation method therefor, a pharmaceutical composition containing the compound, and the use thereof in the preparation of a drug for treating Akt kinase-related diseases.

Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes a redistribution circuit structure; a first semiconductor chip disposed on the redistribution structure and having a first active surface on which a first conductive post is disposed; a second semiconductor chip disposed above the first semiconductor chip and having a second active surface on which a first conductor is disposed; and a first encapsulant disposed on the redistribution circuit structure and encapsulating at least the first semiconductor chip, wherein the first conductive post and the first conductor are aligned and bonded to each other to electrically connect the first semiconductor chip and the second semiconductor chip.

Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes: an interposer including a wiring structure and an interposer via electrically connected to the wiring structure; a plurality of semiconductor chips located on a first surface of the interposer and electrically connected to each other through the interposer; an encapsulant located on the first surface of the interposer and encapsulating at least a portion of the plurality of semiconductor chips; and a redistribution circuit structure located on a second surface of the interposer opposite to the first surface, wherein the plurality of semiconductor chips are electrically connected to the redistribution circuit structure through at least the interposer.

Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes a redistribution circuit structure; a first semiconductor chip disposed on the redistribution structure and having a first active surface on which a first conductive post is disposed; a second semiconductor chip disposed above the first semiconductor chip and having a second active surface on which a first conductor is disposed; and a first encapsulant disposed on the redistribution circuit structure and encapsulating at least the first semiconductor chip, wherein the first conductive post and the first conductor are aligned and bonded to each other to electrically connect the first semiconductor chip and the second semiconductor chip.

Abstract: An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar arranged in the periphery of the sensing area are disposed; a lid covering the sensing area; an encapsulant disposed on the redistribution circuit structure and encapsulating at least part of the image sensing chip and the cover; and a top tier semiconductor chip disposed above the image sensing chip and having an active surface on which a first conductor is disposed. The first conductor overlaps the image sensing chip in a direction perpendicular to the sensing surface. The first conductive pillar and the first conductor are aligned and bonded to each other to electrically connect the image sensing chip and the top tier semiconductor chip.

Abstract: The present disclosure provides an anti-fogging material and a manufacturing method thereof. The anti-fogging material includes a crosslinked polymer obtained by curing an anti-fogging composition, wherein the anti-fogging composition includes an ionic compound, a hard compound with two or more acrylate functional groups at the terminus thereof, and a surface active compound.

Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes: an interposer including a dielectric body, a plurality of semiconductor bodies separated by the dielectric body, a through via penetrating through the dielectric body, and a wiring structure located in each of the plurality of semiconductor bodies; a plurality of semiconductor chips located side by side on a first surface of the interposer and electrically connected to the wiring structure; an encapsulant located on the first surface of the interposer and encapsulating at least a portion of the plurality of semiconductor chips; and a redistribution circuit structure located on a second surface of the interposer opposite to the first surface of the interposer and electrically connected to the plurality of semiconductor chips through the through via.

Abstract: The present disclosure provides an anti-fogging material and a manufacturing method thereof. The anti-fogging material includes a crosslinked polymer obtained by curing an anti-fogging composition, wherein the anti-fogging composition includes an ionic compound, a hard compound with two or more acrylate functional groups at the terminus thereof, and a surface active compound.

Abstract: An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar arranged in the periphery of the sensing area are disposed; a lid covering the sensing area; an encapsulant disposed on the redistribution circuit structure and encapsulating at least part of the image sensing chip and the cover; and a top tier semiconductor chip disposed above the image sensing chip and having an active surface on which a first conductor is disposed. The first conductor overlaps the image sensing chip in a direction perpendicular to the sensing surface. The first conductive pillar and the first conductor are aligned and bonded to each other to electrically connect the image sensing chip and the top tier semiconductor chip.

Abstract: A USB switching circuit includes a first multiplexer, a second multiplexer coupled with the first multiplexer through transmission paths, and a voltage regulation circuit coupled with the first and second multiplexers. The first multiplexer distributes first data signals to the transmission paths according to first control signals. The second multiplexer distributes a second data signal to the transmission paths according to second control signals. The voltage regulation circuit sets a maximum voltage and a minimum voltage of the first data signals to corresponding to a common voltage. The maximum voltage of the first data signals is not higher than a maximum voltage of the second control signals, or the minimum voltage of the first data signals is not lower than a minimum voltage of the second control signals. The first data signals and the second data signal are generated according to different communication protocols.

Abstract: A medicament with excellent JAK kinase (Janus Kinase) inhibitory activity can be used to prevent, treat and/or improve an autoimmune disease (e.g., psoriasis, rheumatoid arthritis, inflammatory bowel disease, Sjogren's syndrome, Behcet's disease, multiple sclerosis, systemic lupus erythematosus and the like). The present invention also provides a pharmaceutically acceptable composition containing the compound and a method for preparing these compounds.

Abstract: An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar arranged in the periphery of the sensing area are disposed; a lid covering the sensing area; an encapsulant disposed on the redistribution circuit structure and encapsulating at least part of the image sensing chip and the cover; and a top tier semiconductor chip disposed above the image sensing chip and having an active surface on which a first conductor is disposed. The first conductor overlaps the image sensing chip in a direction perpendicular to the sensing surface. The first conductive pillar and the first conductor are aligned and bonded to each other to electrically connect the image sensing chip and the top tier semiconductor chip.

Abstract: An intelligent regulation system for a mechanical seal, the system comprising: a monitoring device for measuring a signal correlated with a seal in real time; a control device, comprising a state determination module, a feasible region analysis module, an evaluation module and an optimizing module, wherein the state determination module unscrambles the signal obtained by the monitoring device to estimate the state of the seal; the feasible region analysis module determines, according to a current state, a state that the seal can reach by means of the regulating effect of a regulating device; the evaluation module evaluates a value for the state of the seal; and the optimizing module searches a feasible region, where the seal is regulated, for a regulating method with a relatively high value to the greatest extent, and accordingly sends an instruction to the regulating device; and the regulating device for actively applying an action to the seal according to the instruction given by the control device.

Abstract: A real-time monitoring and analysis method for a mechanical seal. In the method, an acoustic emission signal generated by a friction pair at a mechanical seal end surface is measured; a specific acoustic source generate signals on a plurality of specific frequency bands on an acoustic scale. In a seal operating process motion causes the acoustic emission signal to change on a dynamic time scale equivalent to a period of rotation. In a long-term seal service process, cumulative performance changes occur on a service time scale due to running-in, wear, and/or aging of elastic elements; for this feature, the long-term change process of the acoustic emission signal needs to be considered. Analysis is performed, on multiple scales, in combination with auxiliary information and with determined physical characterization quantities passed to scales of longer time, thereby determining the real-time working state of the seal and providing a performance change expectation of the seal.

Abstract: An intelligent regulation system for a mechanical seal, the system comprising: a monitoring device for measuring a signal correlated with a seal in real time; a control device, comprising a state determination module, a feasible region analysis module, an evaluation module and an optimizing module, wherein the state determination module unscrambles the signal obtained by the monitoring device to estimate the state of the seal; the feasible region analysis module determines, according to a current state, a state that the seal can reach by means of the regulating effect of a regulating device; the evaluation module evaluates a value for the state of the seal; and the optimizing module searches a feasible region, where the seal is regulated, for a regulating method with a relatively high value to the greatest extent, and accordingly sends an instruction to the regulating device; and the regulating device for actively applying an action to the seal according to the instruction given by the control device.