Patents by Inventor Yuan Yu
Yuan Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250141567Abstract: An ultrasonic transceiver device and a control method thereof are disclosed. The ultrasonic transceiver device includes a plurality of coupled ultrasonic transceiver units. Each of the ultrasonic transceiver units includes a plurality of ultrasonic oscillators, a driving bias circuit coupled to the ultrasonic oscillators and used to receive an alternating current (AC) voltage, and a switching circuit coupled to the driving bias circuit. The switching circuit has a plurality of switching paths corresponding to a plurality of impedance values or a plurality of inductance values. The switching circuit is used to switch a system driving signal to pass through one of the switching paths according to a mode selection signal and transmitted to the driving bias circuit as the AC voltage.Type: ApplicationFiled: October 15, 2024Publication date: May 1, 2025Applicant: Qisda CorporationInventors: Fu-Sheng JIANG, Pei-Lun SONG, Yuan-Yu SHIH
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Patent number: 12280792Abstract: A safety driving detection and auxiliary system comprises a physiological sensing module, an alcohol detection module, a warning device and a computing device. The physiological sensing module is configured to obtain at least one piece of physiological information of a driver. The alcohol detection module is configured to detect an alcohol concentration of the driver. The warning device is configured to generate a warning signal. The computing device is connected to the physiological sensing module, the alcohol detection module and the warning device, and is configured to determine whether to actuate a vehicle controller according to the alcohol concentration of the driver, obtain a vehicle speed information from the vehicle controller, and actuate the warning device or/and control the vehicle controller at least according to the at least one piece of physiological information and the vehicle speed information.Type: GrantFiled: September 13, 2023Date of Patent: April 22, 2025Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Ting Kai Chen, Chao Yuan Yu, Jung-Pin Wang, Che-Yu Lin, Tai-Yu Chiang
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Publication number: 20250123458Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.Type: ApplicationFiled: December 18, 2024Publication date: April 17, 2025Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
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Patent number: 12276610Abstract: The present invention is directed to devices and systems for rapidly producing high resolution images of magnetic fields in a sample. The devices and systems employ diamond chips with color centers that fluoresce in the presence of magnetic fields. The high resolution is due to the use of one of three excitation methods. The first method employs modulation of an acoustic surface wave, which increases/decreases the sensitivity of the color centers to magnetic fields. The second and third methods employ arrays of magnetic field coils and electrode pairs, respectively, which again increase/decrease the sensitivity of the color centers to magnetic fields. The color centers are preferably nitrogen vacancies in the diamond chips.Type: GrantFiled: September 6, 2023Date of Patent: April 15, 2025Assignee: National Technology & Engineering Solutions of Sandia, LLCInventor: Yuan-Yu Jau
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Publication number: 20250110291Abstract: Provided are a package structure and a method of forming the same. The package structure includes a bottom package having a first sidewall and a second sidewall opposite to each other; a hybrid path layer disposed on the bottom package, wherein the hybrid path layer comprises an optical path layer and an electrical path layer, and at least one optical path of the optical path layer extends from the first sidewall of the bottom package beyond a center of the bottom package; and a plurality of dies bonded onto the hybrid path layer.Type: ApplicationFiled: October 2, 2023Publication date: April 3, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Ming Weng, Yu-Hao Chen, Hao-Yi Tsai, An-Jhih Su, Tzuan-Horng Liu, Po-Yuan Teng, Tsung-Yuan Yu, Che-Hsiang Hsu
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Patent number: 12266639Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through substrate via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through substrate via.Type: GrantFiled: August 1, 2023Date of Patent: April 1, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming-Hung Tseng, Kris Lipu Chuang, Chung-Ming Weng, Tsung-Yuan Yu, Tzuan-Horng Liu
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Publication number: 20250080685Abstract: A method of image processing includes receiving first feature data from image content captured with a sensor, the first feature data having a first set of states with values that change non-linearly over time, generating second feature data based at least in part on the first feature data, the second feature data having a second set of states with values that change approximately linearly over time relative to a linear operator, wherein the second set of states is greater than the first set of states, and predicting movement of one or more objects in the image content based at least in part on the second feature data.Type: ApplicationFiled: September 6, 2023Publication date: March 6, 2025Inventors: Ming-Yuan Yu, Varun Ravi Kumar, Senthil Kumar Yogamani
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Patent number: 12242493Abstract: The description relates to executing an inference query relative to a database management system, such as a relational database management system. In one example a trained machine learning model can be stored within the database management system. An inference query can be received that applies the trained machine learning model on data local to the database management system. Analysis can be performed on the inference query and the trained machine learning model to generate a unified intermediate representation of the inference query and the trained model. Cross optimization can be performed on the unified intermediate representation. Based upon the cross-optimization, a first portion of the unified intermediate representation to be executed by a database engine of the database management system can be determined, and, a second portion of the unified intermediate representation to be executed by a machine learning runtime can be determined.Type: GrantFiled: August 11, 2020Date of Patent: March 4, 2025Assignee: Microsoft Technology Licensing, LLCInventors: Konstantinos Karanasos, Matteo Interlandi, Fotios Psallidas, Rathijit Sen, Kwanghyun Park, Ivan Popivanov, Subramaniam Venkatraman Krishnan, Markus Weimer, Yuan Yu, Raghunath Ramakrishnan, Carlo Aldo Curino, Doris Suiyi Xin, Karla Jean Saur
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Publication number: 20250070013Abstract: A semiconductor package includes a redistribution structure, a supporting layer, a semiconductor device, and a transition waveguide structure. The redistribution structure includes a plurality of connectors. The supporting layer is formed over the redistribution structure and disposed beside and between the plurality of connectors. The semiconductor device is disposed on the supporting layer and bonded to the plurality of connectors, wherein the semiconductor device includes a device waveguide. The transition waveguide structure is disposed on the supporting layer adjacent to the semiconductor device, wherein the transition waveguide structure is optically coupled to the device waveguide.Type: ApplicationFiled: November 14, 2024Publication date: February 27, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Hsiu-Jen Lin, Ming-Che Ho, Yu-Hsiang Hu, Chewn-Pu Jou, Cheng-Tse Tang
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Publication number: 20250060542Abstract: A package includes an electronic die, a photonic die underlying and electronically communicating with the electronic die, a lens disposed on the electronic die, and a prism structure disposed on the lens and optically coupled to the photonic die. The prism structure includes first and second polymer layers, the first polymer layer includes a first curved surface concaving toward the photonic die, the second polymer layer embedded in the first polymer layer includes a second curved surface substantially conforming to the first curved surface, and an outer sidewall of the second polymer layer substantially aligned with an outer sidewall of the first polymer layer.Type: ApplicationFiled: November 3, 2024Publication date: February 20, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Che-Hsiang Hsu, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Chung-Ming Weng
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Patent number: 12226454Abstract: The present invention provides a novel modified chemokine peptide. The novel modified chemokine peptide can be combined with a targeted drug for treating cancer, especially for treating drug-resistant cancer, and inhibiting tumor growth more effectively.Type: GrantFiled: October 30, 2020Date of Patent: February 18, 2025Assignee: RISE BIOPHARMACEUTICALS INC.Inventors: Jya-Wei Cheng, Hsi-Tsung Cheng, Hui-Yuan Yu, Su-Ya Hsu
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Patent number: 12225152Abstract: A system for achieving display of CarPlay operation interface on display screens of multiple electronic devices is disclosed. The system comprises a first electronic device and a second electronic device, wherein the first electronic device has functionality of Apple CarPlay because of including an Apple Mfi authentication chip. Particularly, a CarPlay executor comprising a principal execution unit and a plurality of sub-execution units is provided in the first electronic device. As such, after a second mobile electronic device is in communication with a second electronic device that is coupled to the first electronic device, one sub-execution unit is authorized by the Apple Mfi authentication chip so as to let a CarPlay operation interface be shown on a display screen of the second electronic device, thereby achieving display of CarPlay operation interface on display screens of multiple electronic devices.Type: GrantFiled: March 25, 2022Date of Patent: February 11, 2025Assignee: PROLIFIC TECHNOLOGY INC.Inventors: Ting-Ta Chien, Hsing-Yun Hsieh, Ren-Yuan Yu
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Patent number: 12217177Abstract: Systems and methods for processing loops in computational graphs representing machine learning models are disclosed. An example method begins with obtaining data representing a computational graph. Data identifying an allocation of the computational graph across devices is obtained. Additionally, one or more nodes in the computational graph that represent a respective control flow statement are identified. For each identified node, a structure of nodes and edges that represents an operation that provides a current state of recursion or iteration in the respective control flow statement is generated. This structure is inserted into the computational graph and the allocation of nodes to devices is modified to assign the structure to a device.Type: GrantFiled: August 10, 2023Date of Patent: February 4, 2025Assignee: Google LLCInventors: Yuan Yu, Jeffrey Adgate Dean
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Patent number: 12210200Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.Type: GrantFiled: February 26, 2024Date of Patent: January 28, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
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Patent number: 12210188Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.Type: GrantFiled: August 29, 2022Date of Patent: January 28, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hung-Yi Kuo, Chen-Hua Yu, Cheng-Chieh Hsieh, Che-Hsiang Hsu, Chung-Ming Weng, Tsung-Yuan Yu
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Publication number: 20250031089Abstract: Aspects presented herein may enable a UE to detect and identify a weather condition of an environment based on the sparsity of FFT/DWT coefficients derived from a set of range images associated with the environment. In one aspect, a UE converts a set of point clouds associated with an environment to a set of range images based on a spherical projection. The UE applies at least one of FFT or DWT to the set of range images to obtain a set of FFT coefficients or a set of DWT coefficients. The UE identifies a level of a condition for the environment based on a sparsity of the set of FFT coefficients or the set of DWT coefficients.Type: ApplicationFiled: July 21, 2023Publication date: January 23, 2025Inventors: Ming-Yuan YU, Senthil Kumar YOGAMANI, Varun RAVI KUMAR
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Publication number: 20250022668Abstract: A multilayer polymer capacitor (MLPC), including a casing, a multilayer core, an electroplated positive terminal, a first electroplated negative terminal, and a second electroplated negative terminal. The casing includes a casing body and a cover plate. The casing body is provided with an accommodating cavity, whose bottom is provided with a through hole. The multilayer core is provided in the accommodating cavity. An anode lead-out part and a cathode lead-out part are provided at two ends of the accommodating cavity, respectively. The electroplated positive terminal and the first electroplated negative terminal are provided on outer side surfaces of two ends of the casing, respectively. The second electroplated negative terminal is provided on an outer bottom surface of the casing, and is electrically connected to the multilayer core.Type: ApplicationFiled: September 29, 2024Publication date: January 16, 2025Inventors: CHENG-YI YANG, I-CHU LIN, YUAN-YU LIN, CHIN-TSUN LIN, Qirui CHEN, HSIU-WEN WU
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Publication number: 20240425042Abstract: A system for navigation store, in a time-based buffer, a first set of frames acquired by a sensor; stores, in a distance-based buffer, a second set of frames acquired by the sensor, performs moving object segmentation on the first set of frames and the second set of frames to identify at least one moving object in a scene of the frames; predicts a trajectory of the at least one moving object; and performs a navigation function based on the predicted trajectory.Type: ApplicationFiled: June 23, 2023Publication date: December 26, 2024Inventors: Ming-Yuan Yu, Varun Ravi Kumar, Senthil Kumar Yogamani
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Patent number: 12176282Abstract: A manufacturing method of a semiconductor package includes the following steps. A supporting layer is formed over a redistribution structure. A first planarization process is performed over the supporting layer. A lower dielectric layer is formed over the supporting layer, wherein the lower dielectric layer includes a concave exposing a device mounting region of the supporting layer. A first sacrificial layer is formed over the supporting layer, wherein the sacrificial layer filling the concave. A second planarization process is performed over the lower dielectric layer and the first sacrificial layer. A transition waveguide provided over the lower dielectric layer. The first sacrificial layer is removed. A semiconductor device is mounted over the device mounting region, wherein the semiconductor device includes a device waveguide is optically coupled to the transition waveguide.Type: GrantFiled: March 27, 2023Date of Patent: December 24, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Hsiu-Jen Lin, Ming-Che Ho, Yu-Hsiang Hu, Chewn-Pu Jou, Cheng-Tse Tang
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Publication number: 20240409109Abstract: A safety driving detection and auxiliary system comprises a physiological sensing module, an alcohol detection module, a warning device and a computing device. The physiological sensing module is configured to obtain at least one piece of physiological information of a driver. The alcohol detection module is configured to detect an alcohol concentration of the driver. The warning device is configured to generate a warning signal. The computing device is connected to the physiological sensing module, the alcohol detection module and the warning device, and is configured to determine whether to actuate a vehicle controller according to the alcohol concentration of the driver, obtain a vehicle speed information from the vehicle controller, and actuate the warning device or/and control the vehicle controller at least according to the at least one piece of physiological information and the vehicle speed information.Type: ApplicationFiled: September 13, 2023Publication date: December 12, 2024Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Ting Kai CHEN, Chao Yuan YU, Jung-Pin WANG, Che-Yu LIN, Tai-Yu CHIANG