Patents by Inventor Yuanning Yu

Yuanning Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12362329
    Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through substrate via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through substrate via.
    Type: Grant
    Filed: February 1, 2024
    Date of Patent: July 15, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming-Hung Tseng, Kris Lipu Chuang, Chung-Ming Weng, Tsung-Yuan Yu, Tzuan-Horng Liu
  • Patent number: 12360321
    Abstract: A semiconductor device includes an optical connector element and an optical coupler. The optical connector element includes a base structure, a first polymer via and a cladding layer. The base structure has a first surface and a second surface opposite to the first surface. The first polymer via passes through the base structure from the first surface to the second surface. The cladding layer is surrounding the first polymer via, wherein a refractive index of the cladding layer is different than a refractive index of the first polymer via. The optical coupler is disposed over the optical connector element, wherein the optical coupler receives optical signals from the first polymer via.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: July 15, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Yu-Hao Chen
  • Publication number: 20250218696
    Abstract: An ultra-thin solid aluminum electrolytic capacitor includes a case, an element, and a cover. A side of the case is provided with an opening. A flanged clamping portion is provided at the opening. The cover is embedded inside the opening through injection molding to encapsulate the element in the case. The cover includes a base plate, an inner plug, and a sealing side wall. The sealing side wall and the inner plug are vertically provided at an upper end face of the base plate. The inner plug is located at an inner side of the sealing side wall. A gap between an outer peripheral wall of the inner plug and an inner peripheral wall of the sealing side wall forms a groove communicated with the opening. An end face of the inner plug is symmetrically provided with two lead holes.
    Type: Application
    Filed: March 21, 2025
    Publication date: July 3, 2025
    Inventors: CHIN-TSUN LIN, CHENG-YI YANG, YUAN-YU LIN, I-CHU LIN, HSIU-WEN WU, Runhua ZOU
  • Patent number: 12340839
    Abstract: A memory device includes a first active area, a first doped structure of a first doping type, a second active area, a first gate structure and a second doped structure of a second doping type different from the first doping type. The second active area is disposed between the first active area and the first doped structure. The first gate structure is disposed between the first active area and the second active area in a layout view, and configured to store a first bit with the first active area and the second active area. The second doped structure is coupled to the first gate structure and disposed between the first doped structure and the second active area. The second doped structure and the first doped structure are configured to receive a first signal corresponding to the first bit from the first gate structure.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: June 24, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Der Chih, Yun-Sheng Chen, Jonathan Tsung-Yung Chang, Hsin-Yuan Yu, Chrong Jung Lin, Ya-Chin King
  • Patent number: 12329804
    Abstract: The present invention provides a novel modified chemokine peptide. Additionally, the novel modified chemokine peptide can be used to treat cancer and inhibit tumor growth more effectively.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: June 17, 2025
    Assignee: RISE BIOPHARMACEUTICALS INC.
    Inventors: Jya-Wei Cheng, Hsi-Tsung Cheng, Hui-Yuan Yu, Su-Ya Hsu
  • Publication number: 20250193778
    Abstract: Certain aspects of the present disclosure provide techniques for artificial intelligence-based synchronization signal scanning. A method of wireless communications by an apparatus includes monitoring at least a first frequency bandwidth across a set of time windows. The method further includes identifying at least one synchronization signal block (SSB) centered at a global synchronization channel number (GSCN) in the first frequency bandwidth using an artificial intelligence (AI) model comprising a kernel size tuned to an SSB aspect ratio. The method further includes communicating with a network entity based at least in part on the at least one SSB.
    Type: Application
    Filed: December 11, 2023
    Publication date: June 12, 2025
    Inventors: Chinmay Shankar VAZE, Gautham HARIHARAN, Kaniska MOHANTY, Supratik BHATTACHARJEE, Kapil BHATTAD, Sreeram C SREENIVASAN, Santanu PATTANAYAK, Saisruthi KOTAMRAJU, Yuanning YU
  • Publication number: 20250156430
    Abstract: The description relates to executing an inference query relative to a database management system, such as a relational database management system. In one example a trained machine learning model can be stored within the database management system. An inference query can be received that applies the trained machine learning model on data local to the database management system. Analysis can be performed on the inference query and the trained machine learning model to generate a unified intermediate representation of the inference query and the trained model. Cross optimization can be performed on the unified intermediate representation. Based upon the cross-optimization, a first portion of the unified intermediate representation to be executed by a database engine of the database management system can be determined, and, a second portion of the unified intermediate representation to be executed by a machine learning runtime can be determined.
    Type: Application
    Filed: January 15, 2025
    Publication date: May 15, 2025
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Konstantinos KARANASOS, Matteo INTERLANDI, Fotios PSALLIDAS, Rathijit SEN, Kwanghyun PARK, Ivan POPIVANOV, Subramaniam VENKATRAMAN KRISHNAN, Markus WEIMER, Yuan YU, Raghunath RAMAKRISHNAN, Carlo Aldo CURINO, Doris Suiyi XIN, Karla Jean SAUR
  • Publication number: 20250141567
    Abstract: An ultrasonic transceiver device and a control method thereof are disclosed. The ultrasonic transceiver device includes a plurality of coupled ultrasonic transceiver units. Each of the ultrasonic transceiver units includes a plurality of ultrasonic oscillators, a driving bias circuit coupled to the ultrasonic oscillators and used to receive an alternating current (AC) voltage, and a switching circuit coupled to the driving bias circuit. The switching circuit has a plurality of switching paths corresponding to a plurality of impedance values or a plurality of inductance values. The switching circuit is used to switch a system driving signal to pass through one of the switching paths according to a mode selection signal and transmitted to the driving bias circuit as the AC voltage.
    Type: Application
    Filed: October 15, 2024
    Publication date: May 1, 2025
    Applicant: Qisda Corporation
    Inventors: Fu-Sheng JIANG, Pei-Lun SONG, Yuan-Yu SHIH
  • Patent number: 12280792
    Abstract: A safety driving detection and auxiliary system comprises a physiological sensing module, an alcohol detection module, a warning device and a computing device. The physiological sensing module is configured to obtain at least one piece of physiological information of a driver. The alcohol detection module is configured to detect an alcohol concentration of the driver. The warning device is configured to generate a warning signal. The computing device is connected to the physiological sensing module, the alcohol detection module and the warning device, and is configured to determine whether to actuate a vehicle controller according to the alcohol concentration of the driver, obtain a vehicle speed information from the vehicle controller, and actuate the warning device or/and control the vehicle controller at least according to the at least one piece of physiological information and the vehicle speed information.
    Type: Grant
    Filed: September 13, 2023
    Date of Patent: April 22, 2025
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Ting Kai Chen, Chao Yuan Yu, Jung-Pin Wang, Che-Yu Lin, Tai-Yu Chiang
  • Publication number: 20250123458
    Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.
    Type: Application
    Filed: December 18, 2024
    Publication date: April 17, 2025
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
  • Patent number: 12276610
    Abstract: The present invention is directed to devices and systems for rapidly producing high resolution images of magnetic fields in a sample. The devices and systems employ diamond chips with color centers that fluoresce in the presence of magnetic fields. The high resolution is due to the use of one of three excitation methods. The first method employs modulation of an acoustic surface wave, which increases/decreases the sensitivity of the color centers to magnetic fields. The second and third methods employ arrays of magnetic field coils and electrode pairs, respectively, which again increase/decrease the sensitivity of the color centers to magnetic fields. The color centers are preferably nitrogen vacancies in the diamond chips.
    Type: Grant
    Filed: September 6, 2023
    Date of Patent: April 15, 2025
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventor: Yuan-Yu Jau
  • Publication number: 20250110291
    Abstract: Provided are a package structure and a method of forming the same. The package structure includes a bottom package having a first sidewall and a second sidewall opposite to each other; a hybrid path layer disposed on the bottom package, wherein the hybrid path layer comprises an optical path layer and an electrical path layer, and at least one optical path of the optical path layer extends from the first sidewall of the bottom package beyond a center of the bottom package; and a plurality of dies bonded onto the hybrid path layer.
    Type: Application
    Filed: October 2, 2023
    Publication date: April 3, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Yu-Hao Chen, Hao-Yi Tsai, An-Jhih Su, Tzuan-Horng Liu, Po-Yuan Teng, Tsung-Yuan Yu, Che-Hsiang Hsu
  • Patent number: 12266639
    Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through substrate via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through substrate via.
    Type: Grant
    Filed: August 1, 2023
    Date of Patent: April 1, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming-Hung Tseng, Kris Lipu Chuang, Chung-Ming Weng, Tsung-Yuan Yu, Tzuan-Horng Liu
  • Patent number: 12262420
    Abstract: Wireless communications systems and methods related to the timing arrangements and the transmission gap configurations in 2-step random access channel (RACH) procedures to improve system latency and reliability of a RACH HARQ process are provided. The UE transmits a first message including a random access preamble and a payload, and then monitors for a second message in response to the first message during a random access response (RAR) window. In response to determining that no second message is received by the UE from the BS or a back off indicator is received within the RAR window, the UE re-transmits the preamble and payload of the first message after the RAR window lapses. In response to determining if the second message received within the RAR window carries a FallbackRAR or SuccessRAR, the UE then determines to re-transmit the payload of the first message based on the FallbackRAR, or to transmit an acknowledgement message based on the SuccessRAR.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: March 25, 2025
    Assignee: QUALCOMM Incorporated
    Inventors: Jing Lei, Muhammad Nazmul Islam, Linhai He, Amir Aminzadeh Gohari, Yuanning Yu, Enoch Shiao-Kuang Lu, Yi Huang, Ruiming Zheng, Wanshi Chen
  • Publication number: 20250080685
    Abstract: A method of image processing includes receiving first feature data from image content captured with a sensor, the first feature data having a first set of states with values that change non-linearly over time, generating second feature data based at least in part on the first feature data, the second feature data having a second set of states with values that change approximately linearly over time relative to a linear operator, wherein the second set of states is greater than the first set of states, and predicting movement of one or more objects in the image content based at least in part on the second feature data.
    Type: Application
    Filed: September 6, 2023
    Publication date: March 6, 2025
    Inventors: Ming-Yuan Yu, Varun Ravi Kumar, Senthil Kumar Yogamani
  • Patent number: 12242493
    Abstract: The description relates to executing an inference query relative to a database management system, such as a relational database management system. In one example a trained machine learning model can be stored within the database management system. An inference query can be received that applies the trained machine learning model on data local to the database management system. Analysis can be performed on the inference query and the trained machine learning model to generate a unified intermediate representation of the inference query and the trained model. Cross optimization can be performed on the unified intermediate representation. Based upon the cross-optimization, a first portion of the unified intermediate representation to be executed by a database engine of the database management system can be determined, and, a second portion of the unified intermediate representation to be executed by a machine learning runtime can be determined.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: March 4, 2025
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Konstantinos Karanasos, Matteo Interlandi, Fotios Psallidas, Rathijit Sen, Kwanghyun Park, Ivan Popivanov, Subramaniam Venkatraman Krishnan, Markus Weimer, Yuan Yu, Raghunath Ramakrishnan, Carlo Aldo Curino, Doris Suiyi Xin, Karla Jean Saur
  • Publication number: 20250070013
    Abstract: A semiconductor package includes a redistribution structure, a supporting layer, a semiconductor device, and a transition waveguide structure. The redistribution structure includes a plurality of connectors. The supporting layer is formed over the redistribution structure and disposed beside and between the plurality of connectors. The semiconductor device is disposed on the supporting layer and bonded to the plurality of connectors, wherein the semiconductor device includes a device waveguide. The transition waveguide structure is disposed on the supporting layer adjacent to the semiconductor device, wherein the transition waveguide structure is optically coupled to the device waveguide.
    Type: Application
    Filed: November 14, 2024
    Publication date: February 27, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Hsiu-Jen Lin, Ming-Che Ho, Yu-Hsiang Hu, Chewn-Pu Jou, Cheng-Tse Tang
  • Publication number: 20250060542
    Abstract: A package includes an electronic die, a photonic die underlying and electronically communicating with the electronic die, a lens disposed on the electronic die, and a prism structure disposed on the lens and optically coupled to the photonic die. The prism structure includes first and second polymer layers, the first polymer layer includes a first curved surface concaving toward the photonic die, the second polymer layer embedded in the first polymer layer includes a second curved surface substantially conforming to the first curved surface, and an outer sidewall of the second polymer layer substantially aligned with an outer sidewall of the first polymer layer.
    Type: Application
    Filed: November 3, 2024
    Publication date: February 20, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Che-Hsiang Hsu, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Chung-Ming Weng
  • Patent number: 12226454
    Abstract: The present invention provides a novel modified chemokine peptide. The novel modified chemokine peptide can be combined with a targeted drug for treating cancer, especially for treating drug-resistant cancer, and inhibiting tumor growth more effectively.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: February 18, 2025
    Assignee: RISE BIOPHARMACEUTICALS INC.
    Inventors: Jya-Wei Cheng, Hsi-Tsung Cheng, Hui-Yuan Yu, Su-Ya Hsu
  • Patent number: 12225152
    Abstract: A system for achieving display of CarPlay operation interface on display screens of multiple electronic devices is disclosed. The system comprises a first electronic device and a second electronic device, wherein the first electronic device has functionality of Apple CarPlay because of including an Apple Mfi authentication chip. Particularly, a CarPlay executor comprising a principal execution unit and a plurality of sub-execution units is provided in the first electronic device. As such, after a second mobile electronic device is in communication with a second electronic device that is coupled to the first electronic device, one sub-execution unit is authorized by the Apple Mfi authentication chip so as to let a CarPlay operation interface be shown on a display screen of the second electronic device, thereby achieving display of CarPlay operation interface on display screens of multiple electronic devices.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: February 11, 2025
    Assignee: PROLIFIC TECHNOLOGY INC.
    Inventors: Ting-Ta Chien, Hsing-Yun Hsieh, Ren-Yuan Yu