Abstract: A fan-out type packaging structure includes a strain adjustment layer, a plurality of chips, an encapsulation layer, a redistribution layer, and a plurality of solder balls. The strain adjustment layer is made of a polymer material and has at least 95% laser absorbance. The plurality of chips are partially embedded in the strain adjustment layer and are spaced apart from each other. The encapsulation layer surrounds the chips and is connected to the strain adjustment layer. The redistribution layer covers the encapsulation layer and the chips. The plurality of solder balls are disposed on the redistribution layer and are spaced apart from each other.

Abstract: A docking station includes a first stand, a second stand and a main body. The first stand is contactable with a plane. The second stand is contactable with the plane. The main body is arranged between the first stand and the second stand. The main body includes a pivotal part and a support part. A first end and a second end of the pivotal part are respectively connected with the first stand and the second stand. The support part is connected with the pivotal part and contacted with the plane. In addition, there is an included angle between the support part and the first stand or between the support part and the second stand.

Abstract: A support base includes a casing, a signal transmission module, a connection port, an audio output element and a detecting module. The support base is connected with a portable electronic device through the signal transmission module. The support base is connected with an external electronic device through the connection port. A first audio signal from the portable electronic device or a second audio signal from the external electronic device can be played by the audio output element. The detecting module detects the connection status of the support base. According to the connection status, the first audio signal or the second audio signal is controlled to be outputted from the audio output element.

Abstract: A support base includes a casing, a signal transmission module, a connection port, an audio output element and a detecting module. The support base is connected with a portable electronic device through the signal transmission module. The support base is connected with an external electronic device through the connection port. A first audio signal from the portable electronic device or a second audio signal from the external electronic device can be played by the audio output element. The detecting module detects the connection status of the support base. According to the connection status, the first audio signal or the second audio signal is controlled to be outputted from the audio output element.

Abstract: The invention provides an apparatus of treating water to obtain small water cluster, which comprises one or more illumination devices and one or more holders holding metal particles. The invention also provides a method of preparing the small water cluster and the small water cluster prepared from the apparatus or the method.

Abstract: The invention provides an apparatus of treating water to obtain small water cluster, which comprises one or more illumination devices and one or more holders holding metal particles. The invention also provides a method of preparing the small water cluster and the small water cluster prepared from the apparatus or the method.

Abstract: The invention provides an apparatus of treating water to obtain small water cluster, which comprises one or more illumination devices and one or more holders holding metal particles. The invention also provides a method of preparing the small water cluster and the small water cluster prepared from the apparatus or the method.

Abstract: The invention provides an apparatus of treating water to obtain small water cluster, which comprises one or more illumination devices and one or more holders holding metal particles. The invention also provides a method of preparing the small water cluster and the small water cluster prepared from the apparatus or the method.

Abstract: A control method for adjusting leading edge blanking time in a power converting system is disclosed. The control method includes: receiving a feedback signal relative to a load connected to an output terminal of the power converting system; determining the leading edge blanking time to be a first value if the feedback signal has a magnitude about a first voltage; and determining the leading edge blanking time to be a second value if the feedback signal has a magnitude about a second voltage, wherein the first value is smaller than the second value, and the first voltage is greater than the second voltage.

Abstract: A control method for adjusting leading edge blanking time in a power converting system is disclosed. The control method includes: receiving a feedback signal relative to a load connected to an output terminal of the power converting system; determining the leading edge blanking time to be a first value if the feedback signal has a magnitude about a first voltage; and determining the leading edge blanking time to be a second value if the feedback signal has a magnitude about a second voltage, wherein the first value is smaller than the second value, and the first voltage is greater than the second voltage.

Abstract: A method for self bonding epitaxy includes forming a passivation layer on a substrate surface of a semiconductor lighting element; etching to form recesses and protrusive portions with the passivation layer located thereon; starting forming epitaxy on the bottom surface of the recesses; filling the recesses with an Epi layer; then covering the protrusive portions and starting self bonding upwards the epitaxy to finish the Epi layer structure. Such a self bonding epitaxy growing technique can prevent cavity generation caused by parameter errors of the epitaxy and reduce defect density, and improve the quality of the Epi layer and increase internal quantum efficiency.

Abstract: A control circuit for adjusting leading edge blanking time is disclosed. The control circuit is applied to a power converting system. The control circuit adjusts a leading edge blanking time according to a feedback signal relative to a load connected to the output terminal of the power converting system. An over-current protection mechanism of the power converting system is disabled within the leading edge blanking time.

Abstract: The present invention discloses a method for fabricating a light emitting diode element, which incorporates an epitaxial process with an etching process to etch LED epitaxial layers bottom up and form side-protrudent structures, whereby the LED epitaxial layers have non-rectangular inclines, which can solve the problem of total reflection and promote light-extraction efficiency. Further, the method of the present invention has a simple fabrication process, which can benefit mass production and lower cost.

Abstract: The present invention discloses a method for fabricating a light emitting diode element, which incorporates an epitaxial process with an etching process to etch LED epitaxial layers bottom up and form side-protrudent structures, whereby the LED epitaxial layers have non-rectangular inclines, which can solve the problem of total reflection and promote light-extraction efficiency. Further, the method of the present invention has a simple fabrication process, which can benefit mass production and lower cost.

Abstract: A control circuit for adjusting leading edge blanking time is disclosed. The control circuit is applied to a power converting system. The control circuit adjusts a leading edge blanking time according to a feedback signal relative to a load connected to the output terminal of the power converting system. An over-current protection mechanism of the power converting system is disabled within the leading edge blanking time.

Abstract: A power conversion system and over-load protection device thereof includes a first detection circuit, a charging/discharging circuit, and a second detection circuit. The discharging/charging circuit charges based on a feedback signal relative to output of the power conversion system. A switching-disabling control signal is produced based on the charge of the discharging/charging circuit, to disable the power conversion system.

Abstract: A method for self bonding epitaxy includes forming a passivation layer on a substrate surface of a semiconductor lighting element; etching to form recesses and protrusive portions with the passivation layer located thereon; starting forming epitaxy on the bottom surface of the recesses; filling the recesses with an Epi layer; then covering the protrusive portions and starting self bonding upwards the epitaxy to finish the Epi layer structure. Such a self bonding epitaxy growing technique can prevent cavity generation caused by parameter errors of the epitaxy and reduce defect density, and improve the quality of the Epi layer and increase internal quantum efficiency.

Abstract: A power converting circuit with an open load protection function is electrically connected to a power supply providing a first voltage level, and outputs a second voltage level to drive a load. The power converting circuit includes a DC/DC converter and a rectifying element disposed between an output node and an input node of the DC/DC converter that forms a discharging loop with the DC/DC converter. The DC/DC converter receives the power, converts the first voltage level into the second voltage level and outputs the second voltage level to the load. The rectifying element is utilized to release a surge voltage produced by the DC/DC converter in an open load condition.

Abstract: In a method of forming a crystalline GaN-based material, a first nucleation layer is formed on a substrate at a first temperature, followed with forming a second nucleation layer at a second temperature different from the first temperature. The first and second nucleation layers are composed of AlxInyGa(1-x-y)N. Subsequently, a layer of a crystalline GaN-based compound is epitaxy grown on the second nucleation layer.