Abstract: Provided is a semi-finished product of an electronic device, including a substrate, a sensing module, and a lid. The substrate has a first surface and a second surface opposite to each other. The sensing module is disposed on the first surface. The lid is disposed on the first surface and forms a first cavity together with the substrate. An electronic device is also provided.

Abstract: A directional microelectromechanical systems (MEMS) microphone, including a first layer, a second layer, and a third layer stacked in sequence and multiple adhesive members formed between the first layer, the second layer, and the third layer, is provided. The adhesive members include an outer adhesive member disposed surrounding a periphery of the first layer, the second layer, and the third layer and an inner adhesive member disposed within a range surrounded by the outer adhesive member. The outer adhesive member and the inner adhesive member form at least two slits between the first layer, the second layer, and the third layer. An external sound is transmitted to a sound sensing element after passing through two receiving holes of the directional MEMS microphone respectively along two paths. One of the two paths passes through the at least two slits.

Abstract: An electronic device including a substrate, a sensor, a partition wall structure, a pressurizing component, and a stopping structure is provided. The substrate has a carrying surface. The sensor is disposed on the carrying surface. The partition wall structure is disposed on the carrying surface and surrounds the sensor. The pressurizing component is disposed on the partition wall structure. The pressurizing component, the partition wall structure, and the substrate jointly form a cavity, and the pressurizing component includes a mass and a vibration membrane. The stopping structure is disposed between the pressurizing component and the partition wall structure and extends into the cavity. The stopping structure has at least one opening penetrating the stopping structure.

Abstract: An electronic device, including a first substrate, a partition wall structure, a pressurizing component, a second substrate, a shell, and multiple first conductive parts, is provided. The first substrate has a through hole, and a first surface and a second surface that are opposite to each other. The partition wall structure is disposed on the first surface and surrounds to form a first chamber. The pressurizing component is disposed on the partition wall structure and covers the first chamber. The pressurizing component includes at least a mass and a vibration membrane. The shell is disposed on the second substrate and jointly forms a second chamber with the second substrate. The first chamber is formed in the second chamber. The multiple first conductive parts are disposed between the first substrate and the second substrate. There is a gap between any two adjacent first conductive parts.

Abstract: A micro-electromechanical packaging structure including a substrate, a sensing module, a waterproof layer, and a cover is provided. The substrate has a first surface, a second surface, and an acoustic hole penetrating through the first surface and the second surface. The acoustic hole has an upper opening and a lower opening, and an aperture of the lower opening is larger than an aperture of the upper opening. The sensing module is disposed on the first surface of the substrate and covers the upper opening. The waterproof layer is disposed on the second surface of the substrate and covers the lower opening. The waterproof layer has multiple fine holes. The fine holes are communicated with the acoustic hole. The cover is disposed on the first surface and covers the sensing module.

Abstract: A micro-electro mechanical device includes a casing, a vibration sensor, a vibration membrane assembly, and a micro-electro mechanical microphone. The casing has a sound-receiving hole, and the vibration sensor is disposed in the casing. The vibration membrane assembly is disposed in the casing and corresponds to the vibration sensor. The micro-electro mechanical microphone is disposed in the casing and corresponds to the sound-receiving hole, and a back cavity of the micro-electro mechanical microphone is formed in the casing. The back cavity at least partially overlaps with areas corresponding to a vertical projection of the vibration membrane assembly.

Abstract: An electronic device includes a substrate, a sensor, a pressurizing component, and a stopping structure. The substrate has a bearing surface. The sensor is disposed on the bearing surface. The pressurizing component is disposed on the sensor. The stopping structure is disposed between the pressurizing component and the sensor. The stopping structure has opposite upper and lower surfaces and a plurality of openings, and each opening penetrates from the upper surface to the lower surface.

Abstract: An electronic device including a substrate, a sensor, a partition wall structure, a pressurizing component, and a stopping structure is provided. The substrate has a carrying surface. The sensor is disposed on the carrying surface. The partition wall structure is disposed on the carrying surface and surrounds the sensor. The pressurizing component is disposed on the partition wall structure. The pressurizing component, the partition wall structure, and the substrate jointly form a cavity, and the pressurizing component includes a mass and a vibration membrane. The stopping structure is disposed between the pressurizing component and the partition wall structure and extends into the cavity. The stopping structure has at least one opening penetrating the stopping structure.

Abstract: A vibration sensor is designed to have a pressure-enhancing member, a pressure sensing device and first, second, third chambers. An air gap is designed to enable the first chamber to be vented to the third chamber such that the first chamber is combined with the third chamber to obtain a communicable air volume. An adhesive layer is formed between a spacer and a circuit board, and the air gap is formed in an adhesive-absent section between the spacer and the circuit board. When the pressure-enhancing member is moved to squeeze the air in the second chamber, a sensitivity of the pressure sensing device will be greatly improved.

Abstract: A vibration sensing assembly, including a base, a side shell, a sensor, an upper cover, and a diaphragm assembly, is provided. The base includes first and second bottom plates. A first cavity is formed between the first and second bottom plates. The second bottom plate includes first and second through holes. The side shell is disposed on the second bottom plate and includes a cylinder and an inner partition. The inner partition divides the cylinder into a second cavity and an airflow channel. The airflow channel is communicated with the first cavity through the first through hole. The sensor is disposed in the second cavity and covers the second through hole. The side shell is located between the base and the upper cover. The base, the side shell, and the upper cover jointly form an outer shell. The diaphragm assembly is disposed between the side shell and the upper cover.

Abstract: A vibration sensing assembly, including a base, a side shell, a sensor, an upper cover, and a diaphragm assembly, is provided. The base includes first and second bottom plates. A first cavity is formed between the first and second bottom plates. The second bottom plate includes first and second through holes. The side shell is disposed on the second bottom plate and includes a cylinder and an inner partition. The inner partition divides the cylinder into a second cavity and an airflow channel. The airflow channel is communicated with the first cavity through the first through hole. The sensor is disposed in the second cavity and covers the second through hole. The side shell is located between the base and the upper cover. The base, the side shell, and the upper cover jointly form an outer shell. The diaphragm assembly is disposed between the side shell and the upper cover.

Abstract: A micro-electro mechanical device includes a casing, a vibration sensor, a vibration membrane assembly, and a micro-electro mechanical microphone. The casing has a sound-receiving hole, and the vibration sensor is disposed in the casing. The vibration membrane assembly is disposed in the casing and corresponds to the vibration sensor. The micro-electro mechanical microphone is disposed in the casing and corresponds to the sound-receiving hole, and a back cavity of the micro-electro mechanical microphone is formed in the casing. The back cavity at least partially overlaps with areas corresponding to a vertical projection of the vibration membrane assembly.

Abstract: A vibration sensor is designed to have a pressure-enhancing member, a pressure sensing device and first, second, third chambers. A first through hole is designed to enable the first chamber to be vented to the third chamber such that the first chamber is combined with the third chamber to obtain a communicable air volume. When the pressure-enhancing member is moved to squeeze the air in the second chamber, a sensitivity of the pressure sensing device will be greatly improved.

Abstract: Provided is a semi-finished product of an electronic device, including a substrate, a sensing module, and a lid. The substrate has a first surface and a second surface opposite to each other. The sensing module is disposed on the first surface. The lid is disposed on the first surface and forms a first cavity together with the substrate. An electronic device is also provided.

Abstract: An electronic device, including a first substrate, a partition wall structure, a pressurizing component, a second substrate, a shell, and multiple first conductive parts, is provided. The first substrate has a through hole, and a first surface and a second surface that are opposite to each other. The partition wall structure is disposed on the first surface and surrounds to form a first chamber. The pressurizing component is disposed on the partition wall structure and covers the first chamber. The pressurizing component includes at least a mass and a vibration membrane. The shell is disposed on the second substrate and jointly forms a second chamber with the second substrate. The first chamber is formed in the second chamber. The multiple first conductive parts are disposed between the first substrate and the second substrate. There is a gap between any two adjacent first conductive parts.

Abstract: A microphone structure includes a backplate, a diaphragm, a sidewall and at least one airflow retaining wall. The backplate has a plurality of through holes. The diaphragm has at least one slot. The sidewall is located between the backplate and the diaphragm such that the sidewall, the diaphragm and the backplate collectively define a chamber. The at least one airflow retaining wall protrudes from the backplate and is located within the chamber. The airflow retaining wall is positioned between the through holes and the slot, and has an uneven width.

Abstract: A microphone structure includes a backplate, a diaphragm, a sidewall and at least one airflow retaining wall. The backplate has a plurality of through holes. The diaphragm has at least one slot. The sidewall is located between the backplate and the diaphragm such that the sidewall, the diaphragm and the backplate collectively define a chamber. The at least one airflow retaining wall protrudes from the backplate and is located within the chamber. The airflow retaining wall is positioned between the through holes and the slot, and has an uneven width.

Abstract: A vibration sensor includes a circuit board, a spacer, a pressure sensing device and a housing. The spacer is located on the circuit board. The pressure sensing device is located on the spacer, and the circuit board, the spacer and the pressure sensing device jointly form a first chamber and an air gap. The housing is mounted on the circuit board to defining a third chamber along with the circuit board, wherein the air gap allows the first chamber venting to the third chamber.

Abstract: A vibration sensor includes a circuit board, a pressure sensing device and a metal housing. The circuit board has a concave recess. The pressure sensing device is located on the circuit board and defines a first chamber along with the concave recess of the circuit board. The pressure sensing device includes a support board, a sensor and a pressure-enhancing member. The pressure-enhancing member includes a diaphragm and a mass. The support board, the sensor and the diaphragm of the pressure-enhancing member collectively define a second chamber. The metal housing is located on the circuit board and defines a third chamber along with the circuit board, wherein the circuit board has a sidewall which defines the concave recess and has a first through hole, and the first through hole allows the first chamber venting to the third chamber.

Abstract: A speaker includes a circuit board, a peripheral wall, a diaphragm, at least one support member and at least one piezoelectric actuator. The peripheral wall is located on a surface of the circuit board. The diaphragm has an outer boundary attached to the peripheral wall. The diaphragm, the peripheral wall and the circuit board collectively form a chamber. The at least one support member protrudes from the surface of the circuit board and is located within the chamber. The at least one piezoelectric actuator is located on a top of the at least one support member and electrically driven to cause a vibration of the diaphragm under applied electrical bias.