Patents by Inventor Yueh-Kang Lee

Yueh-Kang Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10972840
    Abstract: A speaker includes a circuit board, a peripheral wall, a diaphragm, at least one support member and at least one piezoelectric actuator. The peripheral wall is located on a surface of the circuit board. The diaphragm has an outer boundary attached to the peripheral wall. The diaphragm, the peripheral wall and the circuit board collectively form a chamber. The at least one support member protrudes from the surface of the circuit board and is located within the chamber. The at least one piezoelectric actuator is located on a top of the at least one support member and electrically driven to cause a vibration of the diaphragm under applied electrical bias.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: April 6, 2021
    Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
    Inventors: Jen-Yi Chen, Yueh-Kang Lee, Kai-Yu Jiang, Chao-Sen Chang
  • Publication number: 20200177996
    Abstract: A speaker includes a circuit board, a peripheral wall, a diaphragm, at least one support member and at least one piezoelectric actuator. The peripheral wall is located on a surface of the circuit board. The diaphragm has an outer boundary attached to the peripheral wall. The diaphragm, the peripheral wall and the circuit board collectively form a chamber. The at least one support member protrudes from the surface of the circuit board and is located within the chamber. The at least one piezoelectric actuator is located on a top of the at least one support member and electrically driven to cause a vibration of the diaphragm under applied electrical bias.
    Type: Application
    Filed: June 26, 2019
    Publication date: June 4, 2020
    Inventors: Jen-Yi CHEN, Yueh-Kang LEE, Kai-Yu JIANG, Chao-Sen CHANG
  • Publication number: 20180334378
    Abstract: A MEMS device includes a first structure including at least one first bump over a surface of the first structure, a second structure including a first side facing the surface of the first bump and a second side opposite to the first side, and a gap between the first structure and the second structure. The first structure and the second structure are configured to move in relation to each other. The first bump includes a plurality of first teeth over a stop surface of the first bump.
    Type: Application
    Filed: June 29, 2017
    Publication date: November 22, 2018
    Inventors: SHANG-YING TSAI, KUEI-SUNG CHANG, YUEH KANG LEE
  • Patent number: 10131533
    Abstract: A MEMS device includes a first structure including at least one first bump over a surface of the first structure, a second structure including a first side facing the surface of the first bump and a second side opposite to the first side, and a gap between the first structure and the second structure. The first structure and the second structure are configured to move in relation to each other. The first bump includes a plurality of first teeth over a stop surface of the first bump.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: November 20, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Shang-Ying Tsai, Kuei-Sung Chang, Yueh Kang Lee
  • Publication number: 20160145094
    Abstract: A method for fabricating a micro-electro-mechanical system (MEMS) device includes following steps. A cap layer is formed on an MEMS structure. The MEMS structure has a plurality of sacrificial structures. The cap layer has a plurality of release holes. The release holes are located on the sacrificial structures. A dielectric layer is formed on the cap layer, and the dielectric layer fills the release holes. A planarization process is performed on the dielectric layer. The sacrificial structures are then removed to form at least one cavity in the MEMS structure.
    Type: Application
    Filed: June 17, 2015
    Publication date: May 26, 2016
    Inventors: Yueh-Kang Lee, Li-Yeat Chen, Yi-Chaio Lan