Patents by Inventor Yueh-Kang Lee

Yueh-Kang Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectromechanical system device and method for manufacturing the same
    Patent number: 10131533
    Abstract: A MEMS device includes a first structure including at least one first bump over a surface of the first structure, a second structure including a first side facing the surface of the first bump and a second side opposite to the first side, and a gap between the first structure and the second structure. The first structure and the second structure are configured to move in relation to each other. The first bump includes a plurality of first teeth over a stop surface of the first bump.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: November 20, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Shang-Ying Tsai, Kuei-Sung Chang, Yueh Kang Lee
  • MICRO-ELELCTRO-MECHANICAL SYSTEM DEVICE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20160145094
    Abstract: A method for fabricating a micro-electro-mechanical system (MEMS) device includes following steps. A cap layer is formed on an MEMS structure. The MEMS structure has a plurality of sacrificial structures. The cap layer has a plurality of release holes. The release holes are located on the sacrificial structures. A dielectric layer is formed on the cap layer, and the dielectric layer fills the release holes. A planarization process is performed on the dielectric layer. The sacrificial structures are then removed to form at least one cavity in the MEMS structure.
    Type: Application
    Filed: June 17, 2015
    Publication date: May 26, 2016
    Inventors: Yueh-Kang Lee, Li-Yeat Chen, Yi-Chaio Lan