Patents by Inventor Yue-Ping Dai

Yue-Ping Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7903415
    Abstract: An airflow guider includes a plate-like member having a stop portion extending transversely, a rear inclined guiding portion extending downward rearward toward a first side from a top edge of the stop portion, a front inclined guiding portion extending slantwise forward toward the first side from the stop portion, and at least one fixture for installing the airflow guider to a heat sink. In light of the structure, the airflow guider can be coordinately installed to various kinds of heat sinks and provide additional thermal dissipation.
    Type: Grant
    Filed: April 15, 2009
    Date of Patent: March 8, 2011
    Assignee: Tai-Sol Electronics Co., Ltd.
    Inventors: Ko-Pin Liu, Yue-Ping Dai
  • Publication number: 20100236754
    Abstract: An airflow guider includes a plate-like member having a stop portion extending transversely, a rear inclined guiding portion extending downward rearward toward a first side from a top edge of the stop portion, a front inclined guiding portion extending slantwise forward toward the first side from the stop portion, and at least one fixture for installing the airflow guider to a heat sink. In light of the structure, the airflow guider can be coordinately installed to various kinds of heat sinks and provide additional thermal dissipation.
    Type: Application
    Filed: April 15, 2009
    Publication date: September 23, 2010
    Applicant: TAI-SOL ELECTRONICS CO., LTD.
    Inventors: Ko-Pin Liu, Yue-Ping Dai
  • Publication number: 20100147493
    Abstract: A heat-dissipating fin includes a sheety main body. The main body is provided with a high-temperature area located at each of two sides thereof, an airflow area located at a midsection thereof for an external airflow to pass through, at least one guide wall formed at the airflow area and having a front end facing the main body, and two inclined guide portions each extending rearward toward one side thereof from a front end thereof. In this way, the external airflow can be guided to the high-temperature areas of the fin to reach greater heat-dissipating efficiency.
    Type: Application
    Filed: March 4, 2009
    Publication date: June 17, 2010
    Applicant: TAI-SOL ELECTRONICS CO., LTD.
    Inventors: Yue-Ping Dai, Meng Hung Ko, Jun Chen