Abstract: A conductive structure and a manufacturing method thereof, an array substrate and a display device. The conductive structure includes a plurality of first metal layers made of aluminum, and between every two first metal layers that are adjacent, there is also provided a second metal layer, which is made of a metal other than aluminum. With the conductive structure, the hillock phenomenon that happens to the conductive structure when it is heated can be decreased without reducing the overall thickness of the conductive structure.

Abstract: Provided are a method and an apparatus for manufacturing a semiconductor device. The method comprises: forming a first wiring layer on a base substrate; forming an interlayer dielectric layer on the first wiring layer, with contact holes being provided in the interlayer dielectric layer; subjecting bottoms of the contact holes to a dry cleaning process; and forming a second wiring layer on the interlayer dielectric layer, wherein the second wiring layer is electrically connected to the first wiring layer via the contact holes.

Abstract: A substrate heating device and substrate heating method is disclosed. The device comprises: a heating layer for transferring heat; a transfer pipe for transferring a gas to a diffusion layer; the diffusion layer for enabling the gas to be uniformly distributed between a conducting layer and the heating layer; and the conducting layer for conducting the gas in the diffusion layer to below a substrate to be heated. The device can uniformly and fully heat the substrate to be heated, thus enabling the to-be-heated substrate to have a more uniform surface temperature, and achieving a better effect in an etching, deposition and/or sputtering process of the substrate to be heated.

Abstract: The present application discloses a thin film transistor comprising active layer on a base substrate; an insulating layer over the active layer, the insulating layer comprising a source via and a drain via, each of which extending through the insulating layer; a source electrode within the source via in contact with the active layer; and a drain electrode within the drain via in contact with the active layer.

Abstract: A manufacturing method of an array substrate comprises: forming a source and a drain of a thin film transistor on a base; forming a first insulation layer; forming an active layer of the thin film transistor; forming a second insulation layer; forming a first via hole and a second via hole in the first insulation layer and the second insulation layer above the source and the drain, by etching, and forming a third via hole and a fourth via hole in the second insulation layer above the active layer, by etching; forming a first connection line connecting the source with the active layer through the first via hole and the third via hole, a second connection line connecting the drain with the active layer and the pixel electrode through the second via hole and the fourth via hole and a pixel electrode.

Abstract: The present application discloses a thin film transistor comprising active layer on a base substrate; an insulating layer over fee active layer, the insulating layer comprising a source via and a drain via, each of which extending through the insulating layer; a source electrode within the source via in contact with the active layer; and a drain electrode within the drain via in contact with the active layer.

Abstract: The present application discloses a method of fabricating a display apparatus, comprising providing a carrier substrate comprising a base substrate and an adhesive layer over the base substrate, wherein the base substrate comprises a plurality of fluid passages between the base substrate and the adhesive layer, and a plurality of fluid inlets connected with the plurality of fluid passages; forming a product substrate on a side of the adhesive layer distal to the base substrate; dispensing a detaching agent through the plurality of fluid inlets to the plurality of fluid passages, and contacting the detaching agent with the adhesive layer through the plurality of fluid passages; and detaching the product substrate from the carrier substrate.

Abstract: A conductive structure and a manufacturing method thereof, an array substrate and a display device. The conductive structure includes a plurality of first metal layers made of aluminum, and between every two first metal layers that are adjacent, there is also provided a second metal layer, which is made of a metal other than aluminum. With the conductive structure, the hillock phenomenon that happens to the conductive structure when it is heated can be decreased without reducing the overall thickness of the conductive structure.

Abstract: Embodiments of the present invention provide a thin film transistor and a manufacturing method thereof, an array substrate including the thin film transistor, and a manufacturing method of the array substrate. The thin film transistor comprises an active layer, a gate insulation layer, a gate, an interlayer insulation layer, a source and a drain formed on a base substrate, the interlayer insulation layer and the gate insulation layer are provided therein with through holes corresponding to the source and the drain; the active layer comprises a source ohmic contact region connected with the source, a drain ohmic contact region connected with the drain, a channel region serving as a channel located below the gate, and a lightly doped region between the drain ohmic contact region and the channel region.

Abstract: Embodiments of the present disclosure provide a thin-film transistor (TFT), an array substrate and a manufacturing method thereof, and a display device. The method for preparing a TFT according to an embodiment of the present disclosure may comprise: providing a base substrate; and forming an active layer and an insulation layer on the base substrate. The active layer and the insulation layer may be arranged sequentially and in contact with each other, and the insulation layer may include at least one first insulation layer one of which is in contact with the active layer. The step of forming the first insulation layer may comprise: forming a first insulation film; and conducting a repairing process on the first insulation film by using a repairing source which provides filling atoms, so as to form bonds between at least part of dangling bonds in the first insulation film and the filling atoms.

Abstract: The present disclosure relates to the field of TFT manufacturing process, and provides an LTPS TFT array substrate, its manufacturing method and a display device. The LTPS TFT array substrate includes contact holes through which a source electrode and a drain electrode of the array substrate are connected to an active layer, respectively, wherein a conductive pattern connected to the active layer is provided at a base portion of the contact hole. According to the present disclosure, it is able to form an excellent ohmic contact between the source/drain electrodes and the active layer after the contact holes have been etched, thereby to ensure the display quality of the display device.

Abstract: The invention relates to a spatial diversity receiving device and an input channel switching method. The device comprises a main control circuit and at least one receiving channel including a RF selective switch, wherein the circuit controls the switch, so as to select one of the plurality of input signals from the plurality of antennae and send that signal to a receiving module. The module comprises a RSSI unit for outputting a RSSI value and sends the value to the circuit. On basis of a real time analysis to the receiving signal, the circuit selects a predetermined occasion to perform a compulsive switching and dynamically selects the antenna with a stronger signal so that the generation of error code due to transient interference may be reduced. The system exhibits an excellent resistance to wireless signal fading, and has a simple structure as well as a low cost and power consumption.

Abstract: The invention relates to a spatial diversity receiving device and an input channel switching method. The device comprises a main control circuit and at least one receiving channel including a RF selective switch, wherein the circuit controls the switch, so as to select one of the plurality of input signals from the plurality of antennae and send that signal to a receiving module. The module comprises a RSSI unit for outputting a RSSI value and sends the value to the circuit. On basis of a real time analysis to the receiving signal, the circuit selects a predetermined occasion to perform a compulsive switching and dynamically selects the antenna with a stronger signal so that the generation of error code due to transient interference may be reduced. The system exhibits an excellent resistance to wireless signal fading, and has a simple structure as well as a low cost and power consumption.